Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP3A4 | P08684 | 2/20 | 0.53 |
| ▸ | TSHR | P16473 | 2/20 | 0.53 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.39 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.39 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.39 |
| ▸ | MAPT | P10636 | 1/20 | 0.37 |
| ▸ | LMNA | P02545 | 1/20 | 0.35 |
| ▸ | GAA | P10253 | 1/20 | 0.35 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.35 |
| ▸ | MEN1 | O00255 | 2/20 | 0.35 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.35 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.35 |
| ▸ | ATM | Q13315 | 2/20 | 0.33 |
| ▸ | CA1 | P00915 | 1/20 | 0.33 |
| ▸ | CA2 | P00918 | 1/20 | 0.33 |
| ▸ | BCHE | P06276 | 1/20 | 0.33 |
| ▸ | ACHE | P22303 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL131318 | 0.94 | CYP3A4 (0.59) | CYP3A4TSHRALDH1A1MAPK1TDP1 | |
| SCHEMBL18223955 | 0.92 | CYP3A4 (0.46) | CYP3A4TSHRALDH1A1MAPK1TDP1 | |
| SCHEMBL16868395 | 0.91 | CYP3A4 (0.44) | CYP3A4TSHRALDH1A1MAPK1TDP1 | |
| SCHEMBL145024 | 0.89 | CYP3A4 (0.70) | CYP3A4TSHRALDH1A1MAPK1TDP1 | |
| SCHEMBL10633095 | 0.87 | CYP3A4 (0.50) | CYP3A4TSHRALDH1A1MAPK1TDP1 | |
| SCHEMBL8073336 | 0.87 | CYP3A4 (0.50) | CYP3A4TSHRALDH1A1MAPK1TDP1 | |
| SCHEMBL940949 | 0.86 | MAPT (0.45) | CYP3A4TSHRALDH1A1MAPK1TDP1 | |
| SCHEMBL1880289 | 0.86 | CYP3A4 (0.50) | CYP3A4TSHRALDH1A1MAPK1TDP1 | |
| SCHEMBL13056493 | 0.86 | CYP3A4 (0.50) | CYP3A4TSHRALDH1A1MAPK1TDP1 | |
| SCHEMBL133436 | 0.83 | CYP3A4 (0.45) | CYP3A4TSHRALDH1A1MAPK1TDP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 44 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20120123007-A1 | STYRENIC POLYMER COMPOSITION | ICL-IP AMERICA INC. | 2012-05-17 | — | — | US | claimed |
| EP-2406307-A2 | STYRENIC POLYMER COMPOSITION | ICL-IP America Inc. (US) | 2012-01-18 | — | — | EP | claimed |
| WO-2010099020-A2 | STYRENIC POLYMER COMPOSITION | ICL-IP AMERICA INC. (US) | 2010-09-02 | — | — | WO | claimed |
| US-20220169852-A1 | RESIN COMPOSITION, PREPREG, LAMINATE, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | RESONAC CORPORATION (JP) | 2022-06-02 | — | — | US | disclosed |
| EP-3950841-A1 | RESIN COMPOSITION, PREPREG, LAMINATE, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | Showa Denko Materials Co., Ltd. (JP) | 2022-02-09 | — | — | EP | disclosed |
| US-20210253856-A1 | POLYIMIDE RESIN COMPOSITION | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2021-08-19 | — | — | US | disclosed |
| EP-3795641-A1 | POLYIMIDE RESIN COMPOSITION | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2021-03-24 | — | — | EP | disclosed |
| WO-2020204175-A1 | RESIN COMPOSITION, PREPREG, LAMINATE, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | 日立化成株式会社 | 2020-10-08 | — | — | WO | disclosed |
| US-9688854-B2 | Material for molding, shaped product therefrom, and method for manufacturing the shaped product | TEIJIN LIMITED (JP) | 2017-06-27 | — | — | US | disclosed |
| US-9688854-B2 | Material for molding, shaped product therefrom, and method for manufacturing the shaped product | TEIJIN LIMITED (JP) | 2017-06-27 | — | — | US | disclosed |
| US-9580580-B2 | Cellulose ester-based resin composition | ADEKA CORPORATION (JP) | 2017-02-28 | — | — | US | disclosed |
| US-20090137717-A1 | ENCAPSULATED EPOXY RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE | HITACHI CHEMICAL CO., LTD. (JP) | 2009-05-28 | — | — | US | disclosed |
| US-20090137717-A1 | ENCAPSULATED EPOXY RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE | HITACHI CHEMICAL CO., LTD. (JP) | 2009-05-28 | — | — | US | disclosed |
| US-20090062430-A1 | Epoxy Resin Composition for Sealing and Electronic Component Device | HITACHI CHEMICAL CO., LTD. (JP) | 2009-03-05 | — | — | US | disclosed |
| US-20080234409-A1 | nonhalogenated and non-antimony sealant epoxy-resin molding material superior in flame resistance and still retaining reliability, for example, of moldability, reflow resistance, moisture resistance and high-temperature storage | HITACHI CHEMICAL CO., LTD. (JP) | 2008-09-25 | — | — | US | disclosed |
| US-20080234409-A1 | nonhalogenated and non-antimony sealant epoxy-resin molding material superior in flame resistance and still retaining reliability, for example, of moldability, reflow resistance, moisture resistance and high-temperature storage | HITACHI CHEMICAL CO., LTD. (JP) | 2008-09-25 | — | — | US | disclosed |
| US-7397139-B2 | Containing a curing agent and an inorganic filler, especially silica having a maximum diameter size of at least 32 mu m, an average particle size of 12 mu m or less and a specific surface area of 3.0 m2/g or more | HITACHI CHEMICAL CO., LTD. (JP) | 2008-07-08 | — | — | US | disclosed |
| US-7397139-B2 | Containing a curing agent and an inorganic filler, especially silica having a maximum diameter size of at least 32 mu m, an average particle size of 12 mu m or less and a specific surface area of 3.0 m2/g or more | HITACHI CHEMICAL CO., LTD. (JP) | 2008-07-08 | — | — | US | disclosed |
| US-20080039556-A1 | Encapsulated Epoxy-Resin Molding Compound, And Electronic Component Device | HITACHI CHEMICAL CO., LTD. (JP) | 2008-02-14 | — | — | US | disclosed |
| US-20080039556-A1 | Encapsulated Epoxy-Resin Molding Compound, And Electronic Component Device | HITACHI CHEMICAL CO., LTD. (JP) | 2008-02-14 | — | — | US | disclosed |