SCHEMBL329228

SCHEMBL329228

Cc1ccccc1CN(C)C

nearest known ligand 0.54

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
SLC6A4 P31645 9/20 0.48
SLC6A2 P23975 8/20 0.48
SLC6A3 Q01959 7/20 0.48
MAPT P10636 1/20 0.48
HTR2A P28223 1/20 0.48
TAAR1 Q96RJ0 1/20 0.48
TSHR P16473 3/20 0.48
ALDH1A1 P00352 2/20 0.48
LMNA P02545 1/20 0.46
HSP90AA1 P07900 1/20 0.45
KMT2A Q03164 2/20 0.44
KDM4E B2RXH2 1/20 0.44
MEN1 O00255 1/20 0.44
CYP3A4 P08684 1/20 0.44
CYP2D6 P10635 1/20 0.44
CYP2C19 P33261 1/20 0.44
HSD17B10 Q99714 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27301457 0.98 SLC6A4 (0.47) SLC6A4SLC6A2SLC6A3MAPTHTR2A
SCHEMBL29729780 0.84 ALDH1A1 (0.57) SLC6A4SLC6A2SLC6A3HTR2ATAAR1
SCHEMBL125255 0.84 ALDH1A1 (0.57) SLC6A4SLC6A2SLC6A3HTR2ATAAR1
SCHEMBL6771225 0.82 CYP1A2 (0.47) SLC6A4SLC6A2SLC6A3MAPTHTR2A
SCHEMBL189440 0.82 MAPT (0.60) SLC6A4SLC6A2SLC6A3MAPTTAAR1
SCHEMBL19211520 0.81 ESR1 (0.55) SLC6A4SLC6A2SLC6A3HTR2ATSHR
SCHEMBL16478390 0.81 MAPT (0.46) SLC6A4SLC6A2SLC6A3MAPTTAAR1
SCHEMBL11638292 0.81 MEN1 (0.55) MAPTTAAR1TSHRALDH1A1LMNA
Water SCHEMBL20912805 0.80 MAPT (0.58) SLC6A4SLC6A2SLC6A3MAPTTAAR1
Bromide SCHEMBL20912804 0.80 MAPT (0.58) SLC6A4SLC6A2SLC6A3MAPTTAAR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 405 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025005755-A1 COMPOSITION FOR MANUFACTURING ANISOTROPIC CONDUCTIVE FILM 엔젯 주식회사 2025-01-02 WO claimed
WO-2025224624-A1 CURABLE COMPOSITION AND CURED COMPOSITIONS DERIVED THEREFROM SHPP GLOBAL TECHNOLOGIES B.V. (NL) 2025-10-30 WO disclosed
WO-2025224628-A1 POLYFUNCTIONAL POLY(ARYLENE ETHERS) AND CURABLE COMPOSITIONS THEREOF SHPP GLOBAL TECHNOLOGIES B.V. (NL) 2025-10-30 WO disclosed
EP-4623018-A1 MULTIPURPOSE WATERBORNE EPOXY FLOORING COMPOSITION Sika Technology AG (CH) 2025-10-01 EP disclosed
WO-2025149262-A1 CURABLE POLYMER COMPOSITION CONTAINING ALDEHYDES, COMPOUNDS WITH ACTIVATED METHYLENE GROUPS, AND AN ACCELERATOR COMPONENT SIKA TECHNOLOGY AG (CH) 2025-07-17 WO disclosed
WO-2025131826-A1 CURABLE POLYMER COMPOSITIONS CONTAINING ISOCYANATES, ALDIMINES AND COMPOUNDS WITH ACTIVATED METHYLENE GROUPS SIKA TECHNOLOGY AG (CH) 2025-06-26 WO disclosed
WO-2025131844-A1 CURABLE POLYMER COMPOSITIONS CONTAINING ALDIMINES, POLYISOCYANATES AND COMPOUNDS HAVING ACTIVATED METHYLENE GROUPS SIKA TECHNOLOGY AG (CH) 2025-06-26 WO disclosed
US-12305053-B2 Conductive ink composition Enjet Co. Ltd. (KR) 2025-05-20 US disclosed
US-20250154325-A1 VANILLIC ACID-BASED ORGANIC-INORGANIC COMPOUND, CURABLE COMPOSITION, AND PRODUCTION METHOD THEREOF ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE (KR) 2025-05-15 US disclosed
EP-4543959-A1 SOLUTION OF POLYPHENOLS IN AMINE Sika Technology AG (CH) 2025-04-30 EP disclosed
EP-0488547-A2 Water reducible epoxy resin curing agent REICHHOLD CHEMICALS, INC. (US) 1992-06-03 EP disclosed
EP-0466111-A1 Polymer mixture, process for its manufacture and its use in coatings DAINIPPON INK AND CHEMICALS, INC. (JP) 1992-01-15 EP disclosed
US-4797425-A EPOXY RESIN FROM BISPHENOL WITH AMIDE HARDENERS TOTO LTD. (JP) 1989-01-10 US disclosed
US-4623559-A ULTRAVIOLET WESTINGHOUSE ELECTRIC CORP. (US) 1986-11-18 US disclosed
EP-0097299-A2 Polyamines, process for producing polyamines and their use in the production of polyurethanes BAYER AG (DE) 1984-01-04 EP disclosed
US-4383090-A HIGH SPEED; COCURING AGENT OF POLYAMIDE-POLYLACTAM COPOLYMER; FILMS; CASTINGS; POTTING; ADHESIVES DIAMOND SHAMROCK CORPORATION (US) 1983-05-10 US disclosed
EP-0075827-A2 Polyepoxide curing by polymercaptans plus catalytic co-curing agents DIAMOND SHAMROCK CHEMICALS COMPANY (US) 1983-04-06 EP disclosed
EP-0014745-A1 Curing agent for polyepoxides, curable epoxy resin compositions, hardened products therefrom and process for curing a polyepoxide DIAMOND SHAMROCK CORPORATION (US) 1980-09-03 EP disclosed
US-4177173-A INFUSIBLE FILMS, CASTINGS OR ADHESIVES DIAMOND SHAMROCK CORPORATION (US) 1979-12-04 US disclosed
US-4090986-A Thermoset epoxy foam compositions and a method of preparing the same KOPPERS COMPANY, INC. (US) 1978-05-23 US disclosed