⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1636846 | 1.00 | — | — | |
| SCHEMBL1637518 | 1.00 | — | — | |
| SCHEMBL10543058 | 0.82 | — | — | |
| SCHEMBL2288209 | 0.77 | — | — | |
| SCHEMBL8051471 | 0.77 | — | — | |
| SCHEMBL1263285 | 0.77 | — | — | |
| SCHEMBL27363847 | 0.77 | — | — | |
| SCHEMBL425257 | 0.77 | — | — | |
| SCHEMBL20494981 | 0.77 | — | — | |
| SCHEMBL2367 | 0.77 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 159 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4110846-B1 | AMINE EPOXY RESIN ADDUCT | SIKA TECH AG (CH) | 2024-01-24 | — | — | EP | claimed |
| WO-2023233102-A1 | TWO-COMPONENT THERMALLY CONDUCTIVE COMPOSITION OF SILYL POLYMER | BOSTIK SA (FR) | 2023-12-07 | — | — | WO | claimed |
| EP-4284853-A1 | ADDUCT OF ALKYLATED DIAMINE AND EPOXY NOVOLAC RESIN | Sika Technology AG (CH) | 2023-12-06 | — | — | EP | claimed |
| EP-4263742-A1 | TWO-COMPONENT POLYURETHANE STRUCTURAL ADHESIVE WITH IMPROVED PROPERTIES | Bostik SA (FR) | 2023-10-25 | — | — | EP | claimed |
| US-20230312975-A1 | FLOOR PROTECTION SYSTEM WITH HIGH DYNAMIC CRACK BRIDGING | SIKA TECHNOLOGY AG (CH) | 2023-10-05 | — | — | US | claimed |
| EP-4240799-A1 | FLOOR PROTECTION SYSTEM WITH HIGH DYNAMIC CRACK BRIDGING | Sika Technology AG (CH) | 2023-09-13 | — | — | EP | claimed |
| US-20230088913-A1 | AMINE-EPOXY RESIN ADDITION PRODUCT | SIKA TECHNOLOGY AG (CH) | 2023-03-23 | — | — | US | claimed |
| EP-4036175-A1 | CORROSION PROTECTION COATING WITH HIGH THERMAL SHOCK RESISTANCE | SIKA TECHNOLOGY AG (CH) | 2022-08-03 | — | — | EP | claimed |
| EP-3861046-B1 | ACCELERATOR FOR THE HARDENING OF EPOXIDE RESINS WHICH CONTAIN ALKYL GROUPS | SIKA TECH AG (CH) | 2022-06-29 | — | — | EP | claimed |
| WO-2022129731-A1 | TWO-COMPONENT POLYURETHANE STRUCTURAL ADHESIVE WITH IMPROVED PROPERTIES | BOSTIK SA (FR) | 2022-06-23 | — | — | WO | claimed |
| EP-3416997-B1 | HARDENER FOR LOW-EMISSION EPOXY RESIN COMPOSITIONS | SIKA TECH AG (CH) | 2020-09-23 | — | — | EP | claimed |
| US-20190177472-A1 | CURING AGENT FOR LOW-EMISSION EPOXY RESIN COMPOSITIONS | SIKA TECHNOLOGY AG (CH) | 2019-06-13 | — | — | US | claimed |
| WO-2018172651-A1 | THIXOTROPIC COMPOSITION THAT CAN BE USED AS AN ANTI-RUNNING AGENT FOR MASTICS | BOSTIK SA (FR) | 2018-09-27 | — | — | WO | claimed |
| EP-3375803-A1 | HARDENER FOR LOW-EMISSION EPOXY RESIN COMPOSITIONS | SIKA TECHNOLOGY AG (CH) | 2018-09-19 | — | — | EP | claimed |
| EP-3205682-A1 | HARDENER FOR LOW-EMISSION EPOXY RESIN COMPOSITIONS | Sika Technology AG (CH) | 2017-08-16 | — | — | EP | claimed |
| US-5049631-A | Heat resistant | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1991-09-17 | — | — | US | claimed |
| EP-0045721-B1 | PIPERIDYL DERIVATIVES OF TRIAZINE COPOLYMERS, PROCESS FOR THEIR PREPARATION AND COMPOSITIONS STABILISED WITH SUCH DERIVATIVES | CIBA-GEIGY S.p.A. (IT) | 1985-05-08 | — | — | EP | claimed |
| US-4459395-A | LIGHT, HEAT, AND OXIDATION STABILIZERS FOR POLYOLEFINS | CHIMOSA CHIMICA ORGANICA S.P.A. (IT) | 1984-07-10 | — | — | US | claimed |
| EP-0045721-A2 | Piperidyl derivatives of triazine copolymers, process for their preparation and compositions stabilised with such derivatives | CIBA-GEIGY S.p.A. (IT) | 1982-02-10 | — | — | EP | claimed |
| US-4052373-A | O-AMINOESTER | FUJI PHOTO FILM CO., LTD. (JA) | 1977-10-04 | — | — | US | claimed |