SCHEMBL329890

SCHEMBL329890

CC(=O)OC(C)COC(C)C

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 4/20 0.52
CHRM2 P08172 2/20 0.50
CHRM4 P08173 2/20 0.50
CHRM1 P11229 2/20 0.50
TBXA2R P21731 1/20 0.50
SMN1; SMN2 Q16637 2/20 0.48
GALR3 O60755 1/20 0.48
MAPT P10636 1/20 0.48
BLM P54132 1/20 0.48
TDP1 Q9NUW8 1/20 0.38
ALOX15 P16050 1/20 0.36
TRPV1 Q8NER1 1/20 0.33
LMNA P02545 2/20 0.31
MEN1 O00255 1/20 0.31
CYP1A2 P05177 1/20 0.31
HRH1 P35367 1/20 0.31
KMT2A Q03164 1/20 0.31
CHRM5 P08912 1/20 0.30
CHRM3 P20309 1/20 0.30
CYP2C9 P11712 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3257211 0.96 TSHR (0.48) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL22808920 0.82 TSHR (0.37) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL701830 0.82 TSHR (0.47) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL8863004 0.80 TDP1 (0.47) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL8862935 0.80 TDP1 (0.47) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL145638 0.80 TSHR (0.45) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL8843127 0.80 TDP1 (0.47) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL10713824 0.80 TSHR (0.45) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL8862928 0.80 TDP1 (0.47) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL10277717 0.80 TSHR (0.45) TSHRCHRM2CHRM4CHRM1TBXA2R

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 312 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110874025-B Diluent composition, substrate processing method and semiconductor element manufacturing method 易案爱富科技有限公司 2024-05-24 CN claimed
US-11220659-B2 Thinner composition ENF TECHNOLOGY CO., LTD. (KR) 2022-01-11 US claimed
CN-110874025-A Thinner composition, substrate processing method and semiconductor device manufacturing method 易案爱富科技有限公司 2020-03-10 CN claimed
US-20200071640-A1 THINNER COMPOSITION ENF TECHNOLOGY CO., LTD. (KR) 2020-03-05 US claimed
US-20150355545-A1 THINNER COMPOSITION FOR IMPROVING COATING AND REMOVING PERFORMANCE OF RESIST DONGWOO FINE-CHEM CO., LTD. (KR) 2015-12-10 US claimed
EP-2404940-B1 Method for producing polymer composition and polymer composition INCTEC INC (JP) 2014-12-24 EP claimed
EP-2404940-A1 Method for producing polymer composition and polymer composition The Inctec Inc. (JP) 2012-01-11 EP claimed
US-20070193960-A1 Process for recovering organic compounds from aqueous streams containing same DOW GLOBAL TECHNOLOGIES INC. 2007-08-23 US claimed
EP-1720814-A2 PROCESS FOR RECOVERING ORGANIC COMPOUNDS FROM AQUEOUS STREAMS CONTAINING SAME The Dow Global Technologies Inc. (US) 2006-11-15 EP claimed
WO-2005087692-A2 PROCESS FOR RECOVERING ORGANIC COMPOUNDS FROM AQUEOUS STREAMS CONTAINING SAME DOW GLOBAL TECHNOLOGIES INC. (US) 2005-09-22 WO claimed
US-20250090668-A1 GLYCOL COMPOSITIONS INCLUDING TOCOPHEROLS DOW GLOBAL TECHNOLOGIES LLC (US) 2025-03-20 US disclosed
US-20240409714-A1 GLYCOL COMPOSITIONS COMPRISING CHELANTS DOW GLOBAL TECHNOLOGIES LLC (US) 2024-12-12 US disclosed
EP-4430152-A1 GLYCOL COMPOSITIONS COMPRISING CHELANTS Dow Global Technologies LLC (US) 2024-09-18 EP disclosed
CN-118510877-A Cleaning composition for pretreatment of metal substrates, method for the production thereof and use thereof 巴斯夫涂料有限公司 2024-08-16 CN disclosed
CN-118382663-A Glycol composition comprising tocopherol 陶氏环球技术有限责任公司 2024-07-23 CN disclosed
US-5266443-A Presensitized plates for lithography not requiring dampening with water FUJI PHOTO FILM CO., LTD. (JP) 1993-11-30 US disclosed
EP-0510646-A1 Presensitized plates for use in making lithographic printing plates not requiring dampening with water FUJI PHOTO FILM CO., LTD. (JP) 1992-10-28 EP disclosed
EP-0500951-A1 HALOGEN-FREE DETERGENT COMPOSITION NEW JAPAN CHEMICAL CO.,LTD. (JP) 1992-09-02 EP disclosed
EP-0466070-A2 Presensitized plates for use in making lithographic printing plates not requiring dampening with water Fuji Photo Film Co., Ltd. (JP) 1992-01-15 EP disclosed
US-4186122-A POLYESTER-AMIDE-IMIDE COPOLYMERS HITACHI CHEMICAL COMPANY, LTD. (JP) 1980-01-29 US disclosed