SCHEMBL701830

SCHEMBL701830

CCC(C)OCC(C)OC(C)=O

nearest known ligand 0.47

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.47
CHRM2 P08172 1/20 0.47
CHRM4 P08173 1/20 0.47
CHRM1 P11229 1/20 0.47
TBXA2R P21731 1/20 0.47
GALR3 O60755 1/20 0.45
MAPT P10636 1/20 0.45
BLM P54132 1/20 0.45
SMN1; SMN2 Q16637 1/20 0.45
TDP1 Q9NUW8 2/20 0.35
ALOX15 P16050 1/20 0.34
ALDH1A1 P00352 1/20 0.32
LMNA P02545 1/20 0.32
HSD17B10 Q99714 1/20 0.32
TRPV1 Q8NER1 1/20 0.32
PRKCA P17252 2/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL26183 0.84
SCHEMBL2983907 0.84
SCHEMBL1214198 0.84
SCHEMBL28816092 0.84 TSHR (0.56) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL3257211 0.83 TSHR (0.48) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL329890 0.82 TSHR (0.52) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL896036 0.82 TSHR (0.42) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL429531 0.82 TSHR (0.42) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL29022894 0.81
Acetone SCHEMBL28887361 0.81 TSHR (0.54) TSHRCHRM2CHRM4CHRM1TBXA2R

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 213 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240228739-A1 COMPOSITION, METHOD FOR PRODUCING CURED PRODUCT, AND CURED PRODUCT ADEKA CORPORATION (JP) 2024-07-11 US disclosed
CN-117413022-A Composition, method for producing cured product, and cured product 株式会社ADEKA 2024-01-16 CN disclosed
US-11681222-B2 Fluorine-containing polymer, purification method, and radiation-sensitive resin composition JSR CORPORATION (JP) 2023-06-20 US disclosed
US-11678562-B2 Methods and systems of organic semiconducting polymers PHILLIPS 66 COMPANY (US) 2023-06-13 US disclosed
US-11600779-B2 Methods and systems of organic semiconducting polymers PHILLIPS 66 COMPANY (US) 2023-03-07 US disclosed
WO-2022230690-A1 INKJET INK, METHOD FOR PRODUCING PRINTED MATTER, PRINTED MATTER, AND METAL PIGMENT DISPERSION ナトコ株式会社 2022-11-03 WO disclosed
US-11440092-B2 Method for manufacturing copper powder, resin composition, method for forming cured product, and cured product ADEKA CORPORATION (JP) 2022-09-13 US disclosed
US-20220137508-A9 FLUORINE-CONTAINING POLYMER, PURIFICATION METHOD, AND RADIATION-SENSITIVE RESIN COMPOSITION JSR CORPORATION (JP) 2022-05-05 US disclosed
CN-107922589-B Resin composition and cured product 株式会社ADEKA 2022-05-03 CN disclosed
US-11289653-B2 Methods and systems of organic semiconducting polymers PHILLIPS 66 COMPANY (US) 2022-03-29 US disclosed
EP-1164434-A2 Radiation-sensitive resin composition JSR Corporation (JP) 2001-12-19 EP disclosed
EP-1162506-A1 Radiation-sensitive resin composition JSR Corporation (JP) 2001-12-12 EP disclosed
US-20010041769-A1 Polysiloxane, method of manufacturing same, silicon-containingalicyclic compouns, and radiation-sensitive resin composition JSR CORPORATION (JP) 2001-11-15 US disclosed
US-20010033990-A1 Resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-10-25 US disclosed
EP-1142928-A1 Polysiloxane, method of manufacturing same, silicon-containing alicyclic compound, and radiation-sensitive resin compounds JSR Corporation (JP) 2001-10-10 EP disclosed
EP-1085379-A1 Radiation-sensitive resin composition JSR Corporation (JP) 2001-03-21 EP disclosed
US-6180316-B1 SUITABLE FOR USE AS CHEMICALLY AMPLIFIED RESIST USED IN MANUFACTURING OF INTEGRATED CIRCUITS JSR CORPORATION (JP) 2001-01-30 US disclosed
EP-1048983-A1 Radiation sensitive resin composition JSR Corporation (JP) 2000-11-02 EP disclosed
US-6120858-A COMPRISING AN EPOXY RESIN, A NOVOLAC RESIN, A CURING ACCELERATOR AND A TITANIUM BLACK PIGMENT NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2000-09-19 US disclosed
EP-0930541-A1 Radiation sensitive resin composition JSR Corporation (JP) 1999-07-21 EP disclosed