⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29997642 | 0.82 | — | — | |
| SCHEMBL28886966 | 0.74 | — | — | |
| SCHEMBL28742909 | 0.70 | — | — | |
| SCHEMBL29000955 | 0.69 | — | — | |
| SCHEMBL28752212 | 0.69 | — | — | |
| SCHEMBL9576646 | 0.68 | — | — | |
| SCHEMBL28956591 | 0.68 | CXCR5 (0.32) | — | |
| SCHEMBL9579848 | 0.66 | PTGS2 (0.33) | — | |
| SCHEMBL6635127 | 0.66 | — | — | |
| SCHEMBL2979129 | 0.62 | DHODH (0.33) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115206186-A | Optical film | 住友化学株式会社 | 2022-10-18 | — | — | CN | disclosed |
| US-8409784-B2 | Photosensitive resin composition, dry film, and processed product made using the same | MITSUI CHEMICALS, INC. (JP) | 2013-04-02 | — | — | US | disclosed |
| US-8361605-B2 | Photosensitive resin composition, dry film, and processed product made using the same | MITSUI CHEMICALS, INC. (JP) | 2013-01-29 | — | — | US | disclosed |
| US-8362103-B2 | Resin composition, dry film, and processed product made using the same | MITSUI CHEMICALS, INC. (JP) | 2013-01-29 | — | — | US | disclosed |
| US-7851124-B2 | Composition for forming wiring protective film and uses thereof | MITSUI CHEMICALS, INC. (JP) | 2010-12-14 | — | — | US | disclosed |
| US-20100116532-A1 | PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, AND PROCESSED PRODUCT MADE USING THE SAME | MITSUI CHEMICALS, INC. (JP) | 2010-05-13 | — | — | US | disclosed |
| US-20100084172-A1 | PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, AND PROCESSED PRODUCT MADE USING THE SAME | MITSUI CHEMICALS, INC. (JP) | 2010-04-08 | — | — | US | disclosed |
| US-20100059263-A1 | RESIN COMPOSITION, DRY FILM, AND PROCESSED PRODUCT MADE USING THE SAME | MITSUI CHEMICALS, INC. (JP) | 2010-03-11 | — | — | US | disclosed |
| US-7030170-B2 | Photosensitive resin composition, dry film, and workpiece using the same | MITSUI CHEMICALS, INC. (JP) | 2006-04-18 | — | — | US | disclosed |
| US-20050170270-A1 | Composition for forming wiring protective film and uses thereof | MITSUI CHEMICALS, INC. (JP) | 2005-08-04 | — | — | US | disclosed |
| US-20040247908-A1 | Composition for forming wiring protective film and uses thereof | MITSUI CHEMICALS, INC. (JP) | 2004-12-09 | — | — | US | disclosed |
| US-20030176528-A1 | Photosensitive resin composition, dry film, and workpiece using the same | MITSUI CHEMICALS, INC. (JP) | 2003-09-18 | — | — | US | disclosed |