⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5419781 | 0.89 | — | — | |
| SCHEMBL182363 | 0.87 | — | — | |
| SCHEMBL2920221 | 0.78 | — | — | |
| SCHEMBL2355725 | 0.78 | — | — | |
| SCHEMBL29788643 | 0.67 | MAOA (0.41) | — | |
| SCHEMBL2888277 | 0.67 | — | — | |
| SCHEMBL29788642 | 0.67 | MAOA (0.41) | — | |
| SCHEMBL107468 | 0.67 | MAOA (0.41) | — | |
| Hydrochloric Acid SCHEMBL12503314 | 0.65 | MAOA (0.39) | — | |
| SCHEMBL11557711 | 0.65 | MAOA (0.39) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 528 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3684155-B9 | ELECTROMAGNETIC-WAVE ABSORBING SHEET | MAXELL LTD (JP) | 2024-07-03 | — | — | EP | claimed |
| EP-4151591-B1 | N-TYPE MATERIAL FOR THERMOELECTRIC CONVERSION, METHOD FOR PRODUCING SAME, DOPANT AND THERMOELECTRIC CONVERSION ELEMENT | DENKA COMPANY LTD (JP) | 2024-07-03 | — | — | EP | claimed |
| US-11996546-B2 | Secondary zinc-manganese dioxide batteries for high power applications | RESEARCH FOUNDATION OF THE CITY UNIVERSITY OF NEW YORK (US) | 2024-05-28 | — | — | US | claimed |
| EP-3684155-B1 | ELECTROMAGNETIC-WAVE ABSORBING SHEET | MAXELL LTD (JP) | 2024-04-03 | — | — | EP | claimed |
| US-20240076164-A1 | ELEVATOR LOAD BEARING MEMBER WITH CONDUCTIVE ADHESIVE | OTIS ELEVATOR COMPANY | 2024-03-07 | — | — | US | claimed |
| EP-4332045-A1 | ELEVATOR LOAD BEARING MEMBER WITH CONDUCTIVE ADHESIVE | OTIS Elevator Company (US) | 2024-03-06 | — | — | EP | claimed |
| CN-117645223-A | Elevator load bearing member with conductive adhesive | 奥的斯电梯公司 | 2024-03-05 | — | — | CN | claimed |
| CN-116808246-A | Hydrogel flexible electrode for tissue ablation and preparation method and application thereof | 西安交通大学医学院第一附属医院 | 2023-09-29 | — | — | CN | claimed |
| US-20220415538-A1 | STRETCHABLE FIBER CONDUCTOR HAVING BUCKLED CONDUCTIVE POLYMER RIBBON WITHIN ELASTOMER TUBE | KING ABDULLAH UNIVERSITY OF SCIENCE AND TECHNOLOGY (SA) | 2022-12-29 | — | — | US | claimed |
| US-20200388828-A1 | SECONDARY ZINC-MANGANESE DIOXIDE BATTERIES FOR HIGH POWER APPLICATIONS | RESEARCH FOUNDATION OF THE CITY UNIVERSITY OF NEW YORK | 2020-12-10 | — | — | US | claimed |
| US-20040026254-A1 | Method for selectively metalizing dieletric materials | ENTHONE-OMI (DEUTSCHLAND) GMBH (DE) | 2004-02-12 | — | — | US | claimed |
| EP-1001818-B1 | IMPLANTABLE DEVICE COATED WITH POLYMER CAPABLE OF RELEASING BIOLOGICALLY ACTIVE SUBSTANCES | CENTRE NAT RECH SCIENT (FR) | 2003-12-03 | — | — | EP | claimed |
| EP-0727100-B1 | Electroluminescent device comprising a poly-3,4-dioxythiophene layer | KONINKL PHILIPS ELECTRONICS NV (NL) | 2003-01-29 | — | — | EP | claimed |
| US-20020106453-A1 | Static dissipative worksurfaces and method of fabrication | WOLF RIVER TECHNOLOGIES | 2002-08-08 | — | — | US | claimed |
| US-20020105777-A1 | Solid electrolytic capacitor and method for producing the same | SHOWA DENKO K.K. | 2002-08-08 | — | — | US | claimed |
| US-6352564-B1 | Method of making a solid electrolytic capacitor using a conductive polymer film | NEC CORPORATION (JP) | 2002-03-05 | — | — | US | claimed |
| EP-1088121-B1 | METHOD FOR METAL COATING OF SUBSTRATES | BLASBERG OBERFLAECHENTECH (DE) | 2002-02-20 | — | — | EP | claimed |
| EP-1158551-A1 | SOLID ELECTROLYTIC CAPACITOR AND ITS PRODUCTION METHOD | Showa Denko K K (JP) | 2001-11-28 | — | — | EP | claimed |
| EP-1024509-A1 | SOLID ELECTROLYTIC CAPACITOR AND PROCESS FOR PRODUCING THE SAME | Nippon Chemi-Con Corporation (JP) | 2000-08-02 | — | — | EP | claimed |
| EP-0553671-B1 | Process for making through hole connections in double layered circuit boards and multilayers | BAYER AG (DE) | 1995-11-02 | — | — | EP | claimed |