SCHEMBL3303486

SCHEMBL3303486

C=C(C)C(=O)OC(C)(C)C12CC3CC(C)(CC(C)(C3)C1)C2

nearest known ligand 0.36

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 1/20 0.34
KMT2A Q03164 1/20 0.34
GRIN1 Q05586 4/20 0.33
GRIN2A Q12879 4/20 0.33
GRIN2D O15399 3/20 0.33
GRIN3B O60391 3/20 0.33
GRIN2B Q13224 3/20 0.33
GRIN2C Q14957 3/20 0.33
GRIN3A Q8TCU5 3/20 0.33
LMNA P02545 2/20 0.33
SLC22A1 O15245 1/20 0.33
ESR1 P03372 1/20 0.33
ADRB3 P13945 1/20 0.33
ACHE P22303 1/20 0.33
OPRK1 P41145 1/20 0.33
MTOR P42345 1/20 0.33
HTT P42858 1/20 0.33
CYP1A2 P05177 1/20 0.33
CYP2D6 P10635 1/20 0.33
CYP2C9 P11712 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16708432 0.89 ALDH1A1 (0.33)
SCHEMBL6370850 0.85 EPHX2 (0.33) MEN1KMT2AGRIN1GRIN2AGRIN2D
SCHEMBL5901133 0.83 ALDH1A1 (0.33)
SCHEMBL5901482 0.82
SCHEMBL1218938 0.82
SCHEMBL3680710 0.80 CYP17A1 (0.32) MEN1KMT2A
SCHEMBL16708433 0.80
SCHEMBL16708435 0.80
SCHEMBL15281488 0.80 CYP17A1 (0.36) MEN1KMT2ALMNAEPHX2
SCHEMBL172055 0.80 CYP17A1 (0.36) MEN1KMT2ALMNAEPHX2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8530134-B2 Process for producing photoresist polymeric compounds DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2013-09-10 US disclosed
US-20100297551-A1 PROCESS FOR PRODUCING PHOTORESIST POLYMERIC COMPOUNDS DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2010-11-25 US disclosed
US-7816471-B2 Process for producing photoresist polymeric compounds DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2010-10-19 US disclosed
US-20100099836-A1 PROCESS FOR PRODUCING PHOTORESIST POLYMERIC COMPOUNDS WATANABE HITOSHI 2010-04-22 US disclosed
US-7662897-B2 dropping polymerization of monomers such as 1-hydroxy-3-methacryloyloxyadamantane (HMA), 5-methacryloyloxy-2,6-norbornane carbolactone (MNBL), 2-methacryloyloxy-2-methyladamantane (2-MMA), solvent extraction, redissolving, desolventing; purification; metal-free DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2010-02-16 US disclosed
US-7655743-B2 Process for producing photoresist polymeric compounds DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2010-02-02 US disclosed
US-20080268377-A1 PROCESS FOR PRODUCING PHOTORESIST POLYMERIC COMPOUNDS WATANABE HITOSHI 2008-10-30 US disclosed
EP-1491560-B1 PROCESS FOR THE PRODUCTION OF HIGH-MOLECULAR COMPOUNDS FOR PHOTORESIST DAICEL CHEM (JP) 2007-11-21 EP disclosed
US-20060116494-A1 Process for producing photoresist polymeric compounds WATANABE HITOSHI 2006-06-01 US disclosed
US-20060116493-A1 Process for producing photoresist polymeric compounds WATANABE HITOSHI 2006-06-01 US disclosed
US-7015291-B2 Process for the production of high-molecular compounds for photoresist DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2006-03-21 US disclosed
US-20050100815-A1 Process for the production of high-molecular compounds for photoresist DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2005-05-12 US disclosed