SCHEMBL3306404

SCHEMBL3306404

CCOC(C)C1(C)CNCCO1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3304971 0.87 LMNA (0.32)
SCHEMBL3302727 0.82
Bromide SCHEMBL2354931 0.80
SCHEMBL20515858 0.78
SCHEMBL20515874 0.78
SCHEMBL3308661 0.78
SCHEMBL3299966 0.76
SCHEMBL3304890 0.76
SCHEMBL17616419 0.75
SCHEMBL6127892 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 50 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7468399-B2 Antifouling condensation curing organopolysiloxane composition and underwater structure SHIN-ETSU CHEMICAL CO., LTD. (JP) 2008-12-23 US claimed
EP-1634928-B1 Antifouling condensation curing organopolysiloxane composition and underwater structure SHINETSU CHEMICAL CO (JP) 2007-10-31 EP claimed
EP-3892701-B1 UV CURABLE SILICONE ADHESIVE COMPOSITION AND CURED PRODUCT THEREOF SHINETSU CHEMICAL CO (JP) 2026-03-04 EP disclosed
US-20250287559-A1 MICROSTRUCTURE-TRANSFER APPARATUS, STAMP HEAD UNIT, STAMP COMPONENT FOR TRANSFERRING MICROSTRUCTURE, AND METHOD FOR TRANSFERRING MICROSTRUCTURE-INTEGRATED COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-09-11 US disclosed
US-12342467-B2 Microstructure-transfer apparatus, stamp head unit, stamp component for transferring microstructure, and method for transferring microstructure-integrated component SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-06-24 US disclosed
US-12168745-B2 Ultraviolet ray curable silicone adhesive composition and cured product thereof SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-12-17 US disclosed
CN-115038767-B Addition-curable silicone pressure-sensitive adhesive composition and cured product thereof 信越化学工业株式会社 2024-07-26 CN disclosed
CN-113396485-B Microstructure transferring device, template head unit, template member for microstructure transferring, and method for transferring microstructure integrated member 信越化学工业株式会社 2024-07-26 CN disclosed
CN-118352439-A Microstructure transferring device, template head unit, template member for microstructure transferring, and method for transferring microstructure integrated member 信越化学工业株式会社 2024-07-16 CN disclosed
EP-3885420-B1 ULTRAVIOLET RAY CURABLE SILICONE ADHESIVE COMPOSITION AND CURED PRODUCT THEREOF SHINETSU CHEMICAL CO (JP) 2023-11-29 EP disclosed
US-20230348758-A1 ADDITION-CURING SILICONE PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND CURED OBJECT OBTAINED THEREFROM SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-11-02 US disclosed
US-20130280622-A1 NONAQUEOUS ELECTROLYTIC SOLUTION AND NONAQUEOUS-ELECTROLYTE SECONDARY BATTERY MITSUBISHI CHEMICAL CORPORATION (JP) 2013-10-24 US disclosed
US-20120308881-A1 NONAQUEOUS ELECTROLYTIC SOLUTION AND NONAQEUOUS-ELECTROLYTE SECONDARY BATTERY MITSUBISHI CHEMICAL CORPORATION (JP) 2012-12-06 US disclosed
US-20120264010-A1 NONAQUEOUS ELECTROLYTES AND NONAQUEOUS-ELECTROLYTE SECONDARY BATTERIES EMPLOYING THE SAME MITSUBISHI CHEMICAL CORPORATION (JP) 2012-10-18 US disclosed
US-20100099031-A1 NONAQUEOUS ELECTROLYTES AND NONAQUEOUS-ELECTROLYTE SECONDARY BATTERIES EMPLOYING THE SAME MITSUBISHI CHEMICAL CORPORATION (JP) 2010-04-22 US disclosed
EP-2166611-A1 NONAQUEOUS ELECTROLYTE, AND RECHARGEABLE BATTERY WITH THE NONAQUEOUS ELECTROLYTE Mitsubishi Chemical Corporation (JP) 2010-03-24 EP disclosed
US-7468399-B2 Antifouling condensation curing organopolysiloxane composition and underwater structure SHIN-ETSU CHEMICAL CO., LTD. (JP) 2008-12-23 US disclosed
EP-1634928-B1 Antifouling condensation curing organopolysiloxane composition and underwater structure SHINETSU CHEMICAL CO (JP) 2007-10-31 EP disclosed
US-20060058452-A1 Antifouling condensation curing organopolysiloxane composition and underwater structure SHIN-ETSU CHEMICAL CO., LTD. 2006-03-16 US disclosed
EP-1634928-A1 Antifouling condensation curing organopolysiloxane composition and underwater structure SHIN-ETSU CHEMICAL CO., LTD. (JP) 2006-03-15 EP disclosed