SCHEMBL3308778

SCHEMBL3308778

NCCNCC(CC(=O)O)N(CC(=O)O)CC(=O)O

nearest known ligand 0.37

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
ANPEP P15144 1/20 0.37
GABRR1 P24046 2/20 0.31
LMNA P02545 1/20 0.31
MEN1 O00255 1/20 0.30
CA12 O43570 1/20 0.30
CA6 P23280 1/20 0.30
CA7 P43166 1/20 0.30
RECQL P46063 1/20 0.30
KMT2A Q03164 1/20 0.30
CA9 Q16790 1/20 0.30
CA14 Q9ULX7 1/20 0.30
CA5B Q9Y2D0 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL233605 0.80 ALDH1A1 (0.31) LMNA
SCHEMBL285036 0.76 ANPEP (0.34) ANPEP
SCHEMBL12296559 0.75 GSR (0.42) GABRR1LMNAMEN1RECQLKMT2A
SCHEMBL6958710 0.74 SLC22A6 (0.41) GABRR1LMNA
SCHEMBL7118918 0.74
SCHEMBL3725808 0.74 ANPEP (0.44) ANPEPGABRR1LMNAMEN1CA12
SCHEMBL10787464 0.73
SCHEMBL4342796 0.73 TDP1 (0.41) LMNA
SCHEMBL11149311 0.69 ANPEP (0.40) ANPEPGABRR1LMNAMEN1CA12
SCHEMBL5871512 0.67 SLC22A6 (0.35) LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 44 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20050272116-A1 Polymer substrate for recombinant protein purification and environmental remediation CLEMSON UNIVERSITY 2005-12-08 US claimed
EP-0140575-B1 ELECTROLESS COPPER PLATING BATH AND METHOD C. UYEMURA & CO LTD (JP) 1988-09-14 EP claimed
US-4650691-A STABILIZER MIXTURE C. UYEMURA & CO., LTD. (JP) 1987-03-17 US claimed
EP-0021757-B1 ELECTROLESS COPPER PLATING SOLUTION Hitachi, Ltd. (JP) 1984-03-14 EP claimed
US-4303443-A POLYOXYALKYLENE-AMINE STABILIZERS, COMPLEXING AGENTS AND REDUCING AGENTS HITACHI, LTD. (JP) 1981-12-01 US claimed
EP-0021757-A1 Electroless copper plating solution Hitachi, Ltd. (JP) 1981-01-07 EP claimed
JP-4059792-A None JP disclosed
JP-4059791-A None JP disclosed
JP-4059790-A None JP disclosed
JP-4059793-A None JP disclosed
EP-4225880-A1 CLEANER FOR ELECTRONIC DEVICE COMPONENTS Henkel AG & Co. KGaA (DE) 2023-08-16 EP disclosed
US-20230193169-A1 CLEANER FOR ELECTRONIC DEVICE COMPONENTS HENKEL AG & CO. KGAA (DE) 2023-06-22 US disclosed
WO-2022073178-A1 CLEANER FOR ELECTRONIC DEVICE COMPONENTS HENKEL AG & CO. KGAA (DE) 2022-04-14 WO disclosed
EP-0142356-A2 Analytical method for determining formaldehyde in electroless copper plating bath C. UYEMURA & CO LTD (JP) 1985-05-22 EP disclosed
EP-0140575-A2 Electroless copper plating bath and method C. UYEMURA & CO LTD (JP) 1985-05-08 EP disclosed
EP-0021757-B1 ELECTROLESS COPPER PLATING SOLUTION Hitachi, Ltd. (JP) 1984-03-14 EP disclosed
US-4303443-A POLYOXYALKYLENE-AMINE STABILIZERS, COMPLEXING AGENTS AND REDUCING AGENTS HITACHI, LTD. (JP) 1981-12-01 US disclosed
EP-0021757-A1 Electroless copper plating solution Hitachi, Ltd. (JP) 1981-01-07 EP disclosed
US-4131599-A ULTRAVIOLET DEGRADATION SANKYO COMPANY, LIMITED (JP) 1978-12-26 US disclosed
US-4073700-A FROM GOLD CYANIDE IN THE PRESENCE OF A CHELATING AGENT WEISBERG ALFRED M 1978-02-14 US disclosed