SCHEMBL3325532

SCHEMBL3325532

CCCCC[P+](CCCC)(CCCC)CCCC.F[B-](F)(F)F

nearest known ligand 0.74

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
DNM1 Q05193 2/20 0.74
BDKRB2 P30411 5/20 0.39
TSHR P16473 3/20 0.37
THRB P10828 1/20 0.37
OPRM1 P35372 1/20 0.36
ALDH1A1 P00352 3/20 0.33
MAPT P10636 1/20 0.33
TDP1 Q9NUW8 1/20 0.33
LMNA P02545 1/20 0.33
CA2 P00918 1/20 0.32
SMN1; SMN2 Q16637 1/20 0.32
CYP3A4 P08684 1/20 0.32
FDPS P14324 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3327253 1.00 DNM1 (0.74) DNM1BDKRB2TSHRTHRBOPRM1
SCHEMBL4520327 0.97 DNM1 (0.79) DNM1BDKRB2TSHRTHRBOPRM1
SCHEMBL3775319 0.97 DNM1 (0.79) DNM1BDKRB2TSHRTHRBOPRM1
SCHEMBL4531826 0.97 DNM1 (0.79) DNM1BDKRB2TSHRTHRBOPRM1
SCHEMBL4527227 0.97 DNM1 (0.79) DNM1BDKRB2TSHRTHRBOPRM1
SCHEMBL4531163 0.97 DNM1 (0.79) DNM1BDKRB2TSHRTHRBOPRM1
SCHEMBL4518071 0.97 DNM1 (0.79) DNM1BDKRB2TSHRTHRBOPRM1
SCHEMBL4526445 0.97 DNM1 (0.79) DNM1BDKRB2TSHRTHRBOPRM1
SCHEMBL3784215 0.97 DNM1 (0.79) DNM1BDKRB2TSHRTHRBOPRM1
SCHEMBL28638261 0.97 DNM1 (0.79) DNM1BDKRB2TSHRTHRBOPRM1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8716401-B2 Semiconductor chip laminate and adhesive composition for semiconductor chip lamination LINTEC CORPORATION (JP) 2014-05-06 US disclosed
US-20100133703-A1 Semiconductor Chip Laminate and Adhesive Composition for Semiconductor Chip Lamination LINTEC CORPORATION (JP) 2010-06-03 US disclosed
US-6649728-B2 Polymerization catalysts or curing agents comprising phosphorus compounds such as tetraethylphosphonium tetrafluoroborate, used improve storage stability coating mixtures NIPPON CHEMICAL INDUSTRIAL CO., LTD. (JP) 2003-11-18 US disclosed
US-20030109378-A1 Catalyst for curing epoxy resins, method for making the same, epoxy resin composition, and powder coating composition NIPPON CHEMICAL INDUSTRIAL CO., LTD. (JP) 2003-06-12 US disclosed