⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3623774 | 0.87 | — | — | |
| SCHEMBL977222 | 0.84 | — | — | |
| SCHEMBL12458696 | 0.84 | — | — | |
| SCHEMBL13089274 | 0.82 | — | — | |
| SCHEMBL13089407 | 0.82 | — | — | |
| SCHEMBL13089377 | 0.82 | — | — | |
| SCHEMBL12898440 | 0.80 | — | — | |
| SCHEMBL12898532 | 0.80 | — | — | |
| SCHEMBL7135810 | 0.80 | — | — | |
| SCHEMBL15105104 | 0.80 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 413 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20250304819-A1 | Flexible and foldable abrasion resistant photopatternable siloxane hard coat | OPTITUNE OY (FI) | 2025-10-02 | — | — | US | claimed |
| US-20250253145-A1 | SUBSTRATE PROCESSING METHOD | ASM IP HOLDING B.V. (NL) | 2025-08-07 | — | — | US | claimed |
| EP-3663301-B1 | BORON-CONTAINING COMPOUNDS, COMPOSITIONS, AND METHODS FOR THE DEPOSITION OF BORON CONTAINING FILMS | VERSUM MAT US LLC (US) | 2023-08-30 | — | — | EP | claimed |
| US-11634610-B2 | Siloxane polymer compositions and their use | OPTITUNE OY (FI) | 2023-04-25 | — | — | US | claimed |
| US-20220010172-A1 | SILOXANE POLYMER COMPOSITIONS AND THEIR USE | OPTITUNE OY (FI) | 2022-01-13 | — | — | US | claimed |
| US-11127864-B2 | Carbosiloxane polymer compositions, methods of producing the same and the use thereof | OPTITUNE OY (FI) | 2021-09-21 | — | — | US | claimed |
| CN-107636852-B | Method for depositing porous organosilicate glass films for use as resistive random access memories | 弗萨姆材料美国有限责任公司 | 2021-06-25 | — | — | CN | claimed |
| US-10985013-B2 | Method and precursors for manufacturing 3D devices | VERSUM MATERIALS US, LLC (US) | 2021-04-20 | — | — | US | claimed |
| US-20210087429-A1 | Flexible and foldable abrasion resistant photopatternable siloxane hard coat | OPTITUNE OY (FI) | 2021-03-25 | — | — | US | claimed |
| EP-3775075-A1 | FLEXIBLE AND FOLDABLE ABRASION RESISTANT PHOTOPATTERNABLE SILOXANE HARD COAT | Optitune Oy (FI) | 2021-02-17 | — | — | EP | claimed |
| EP-2618364-A2 | Catalyst and formulations comprising same for alkoxysilanes hydrolysis reaction in semiconductor process | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2013-07-24 | — | — | EP | claimed |
| US-20130180215-A1 | CATALYST AND FORMULATIONS COMPRISING SAME FOR ALKOXYSILANES HYDROLYSIS REACTION IN SEMICONDUCTOR PROCESS | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2013-07-18 | — | — | US | claimed |
| US-20130175680-A1 | DIELECTRIC MATERIAL WITH HIGH MECHANICAL STRENGTH | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2013-07-11 | — | — | US | claimed |
| US-7932295-B2 | Organic silica-based film, method of forming the same, composition for forming insulating film for semiconductor device, interconnect structure, and semiconductor device | JSR CORPORATION (JP) | 2011-04-26 | — | — | US | claimed |
| US-7875317-B2 | formed by hydrolyzing and condensing a siloxy compound in the presence of a polycarbosilane; low relative dielectric constant and excellent mechanical strength, storage stability, and chemical resistance; semiconductors | JSR CORPORATION (JP) | 2011-01-25 | — | — | US | claimed |
| US-7500397-B2 | Activated chemical process for enhancing material properties of dielectric films | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2009-03-10 | — | — | US | claimed |
| US-20080246153-A1 | ORGANIC SILICA-BASED FILM, METHOD OF FORMING THE SAME, COMPOSITION FOR FORMING INSULATING FILM FOR SEMICONDUCTOR DEVICE, INTERCONNECT STRUCTURE, AND SEMICONDUCTOR DEVICE | JSR CORPORATION (JP) | 2008-10-09 | — | — | US | claimed |
| US-20080199977-A1 | Activated Chemical Process for Enhancing Material Properties of Dielectric Films | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2008-08-21 | — | — | US | claimed |
| EP-1959485-A2 | Activated chemical process for enhancing material properties of dielectric films | Air Products and Chemicals, Inc. (US) | 2008-08-20 | — | — | EP | claimed |
| US-7399715-B2 | Organic silica-based film, method of forming the same, composition for forming insulating film for semiconductor device, interconnect structure, and semiconductor device | JSR CORPORATION (JP) | 2008-07-15 | — | — | US | claimed |