SCHEMBL3340469

SCHEMBL3340469

Cn1cccc1[Ru]c1cccn1C

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.41
TRIM24 O15164 1/20 0.41
TRIM33 Q9UPN9 1/20 0.41
INMT O95050 1/20 0.37
PCSK9 Q8NBP7 1/20 0.34
ALDH1A1 P00352 6/20 0.33
CYP2A6 P11509 1/20 0.33
CYP2A13 Q16696 1/20 0.33
KDM4E B2RXH2 2/20 0.32
MAOB P27338 1/20 0.32
SMN1; SMN2 Q16637 2/20 0.31
GAA P10253 2/20 0.31
MAPT P10636 2/20 0.31
MEN1 O00255 1/20 0.31
NPC1 O15118 1/20 0.31
USP2 O75604 1/20 0.31
NFKB1 P19838 1/20 0.31
RAB9A P51151 1/20 0.31
NFKB2 Q00653 1/20 0.31
KMT2A Q03164 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL196709 0.69
SCHEMBL197196 0.67 PCSK9 (0.60) TSHRTRIM24TRIM33INMTPCSK9
Hydrochloric Acid SCHEMBL6769002 0.67
SCHEMBL10591350 0.65
SCHEMBL143814 0.65
SCHEMBL8676817 0.63
SCHEMBL12754884 0.63
SCHEMBL3092636 0.63
SCHEMBL12074519 0.63
SCHEMBL2971700 0.63

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9418890-B2 Method for tuning a deposition rate during an atomic layer deposition process APPLIED MATERIALS, INC. (US) 2016-08-16 US disclosed
US-7682946-B2 flowing a process gas through a conduit to form a circular gas flow pattern, exposing a substrate to the circular gas flow pattern, pulsing a organoruthanium precursor into the process gas and igniting a plasma of ammonia, N2, H2 from the process gas to deposit a material on the substrate (Ru, Ta, W ) APPLIED MATERIALS, INC. (US) 2010-03-23 US disclosed
US-20070128864-A1 APPARATUS AND PROCESS FOR PLASMA-ENHANCED ATOMIC LAYER DEPOSITION APPLIED MATERIALS, INC. 2007-06-07 US disclosed
US-20070119370-A1 APPARATUS AND PROCESS FOR PLASMA-ENHANCED ATOMIC LAYER DEPOSITION APPLIED MATERIALS, INC. 2007-05-31 US disclosed
US-20070119371-A1 APPARATUS AND PROCESS FOR PLASMA-ENHANCED ATOMIC LAYER DEPOSITION APPLIED MATERIALS, INC. 2007-05-31 US disclosed