SCHEMBL3343490

SCHEMBL3343490

CC=CC[Si](C)(OC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27871174 1.00
SCHEMBL31351418 0.79
SCHEMBL31351426 0.78
SCHEMBL31351371 0.76
SCHEMBL931354 0.76
SCHEMBL8520266 0.76
SCHEMBL4253417 0.76
SCHEMBL28225721 0.75
SCHEMBL31351370 0.75
SCHEMBL4169792 0.74

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5651921-A Process for preparing a water repellent silica sol IDEMITSU KOSAN COMPANY LIMITED (JP) 1997-07-29 US claimed
WO-2025023143-A1 GLASS CLOTH TREATMENT LIQUID AND SURFACE TREATED GLASS CLOTH 信越化学工業株式会社 2025-01-30 WO disclosed
US-20220153583-A1 BULK BORON NITRIDE PARTICLES, THERMALLY CONDUCTIVE RESIN COMPOSITION, AND HEAT DISSIPATING MEMBER DENKA COMPANY LIMITED (JP) 2022-05-19 US disclosed
CN-105315675-A Ultraviolet light-curing composition UNIV SHANGHAI JIAOTONG 2016-02-10 CN disclosed
US-8968458-B2 Composition for resist underlayer film and process for producing same JSR CORPORATION (JP) 2015-03-03 US disclosed
US-8808446-B2 Composition for resist underlayer film and process for producing same JSR CORPORATION (JP) 2014-08-19 US disclosed
EP-1989253-B1 CURABLE SILICONE RESIN COMPOSITION AND CURED BODY THEREOF DOW CORNING TORAY CO LTD (JP) 2013-10-02 EP disclosed
EP-2024439-B1 CURABLE SILICONE RESIN COMPOSITION AND CURED BODY THEREOF DOW CORNING TORAY CO LTD (JP) 2012-06-27 EP disclosed
US-20100151384-A1 COMPOSITION FOR RESIST UNDERLAYER FILM AND PROCESS FOR PRODUCING SAME JSR CORPORATION (JP) 2010-06-17 US disclosed
US-20090298980-A1 Curable Silicone Resin Composition and Cured Body Thereof DOW CORNING TORAY CO., LTD. (JP) 2009-12-03 US disclosed
WO-2004005404-A1 CURABLE SILICONE RESIN COMPOSITION AND CURED PRODUCT DOW CORNING TORAY SILICONE CO.,LTD. (JP) 2004-01-15 WO disclosed
EP-0475132-B1 Water repellent silica sol and process for preparing the same IDEMITSU KOSAN CO (JP) 1998-06-10 EP disclosed
US-5651921-A Process for preparing a water repellent silica sol IDEMITSU KOSAN COMPANY LIMITED (JP) 1997-07-29 US disclosed
EP-0586241-B1 Azasilacycloalkyl functional alkoxysilanes and azasilacycloalkyl functional tetramethyldisiloxanes DOW CORNING (US) 1997-04-09 EP disclosed
EP-0586240-B1 Alkoxy endblocked polydiorganosiloxane and room temperature vulcanizable silicone elastomers made therefrom DOW CORNING (US) 1996-12-18 EP disclosed
EP-0586240-A2 Alkoxy endblocked polydiorganosiloxane and room temperature vulcanizable silicone elastomers made therefrom DOW CORNING CORPORATION (US) 1994-03-09 EP disclosed
EP-0586241-A1 Azasilacycloalkyl functional alkoxysilanes and azasilacycloalkyl functional tetramethyldisiloxanes DOW CORNING CORPORATION (US) 1994-03-09 EP disclosed
US-5276123-A Endblocking polysiloxanes DOW CORNING CORPORATION (US) 1994-01-04 US disclosed
US-5239099-A Room temperature vulcanization; noncorrosive byproducts DOW CORNING CORPORATION (US) 1993-08-24 US disclosed
EP-0475132-A1 Water repellent silica sol and process for preparing the same IDEMITSU KOSAN COMPANY LIMITED (JP) 1992-03-18 EP disclosed