SCHEMBL3343930

SCHEMBL3343930

C=C(C)C(=O)OCC(C)OCC(C)OCC(C)OCC(C)OCC(C)OCC(C)OCC(C)OC(=O)C(=C)C

nearest known ligand 0.66

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
TSHR P16473 4/20 0.66
ALDH1A1 P00352 2/20 0.40
THRB P10828 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29990876 1.00 TSHR (0.66) TSHRALDH1A1THRB
SCHEMBL142807 1.00 TSHR (0.66) TSHRALDH1A1THRB
SCHEMBL156577 1.00 TSHR (0.66) TSHRALDH1A1THRB
SCHEMBL30918135 1.00 TSHR (0.66) TSHRALDH1A1THRB
SCHEMBL672401 1.00 TSHR (0.66) TSHRALDH1A1THRB
SCHEMBL7154371 1.00 TSHR (0.66) TSHRALDH1A1THRB
SCHEMBL6823542 1.00 TSHR (0.66) TSHRALDH1A1THRB
SCHEMBL41275 1.00 TSHR (0.66) TSHRALDH1A1THRB
SCHEMBL2404839 1.00 TSHR (0.66) TSHRALDH1A1THRB
SCHEMBL29907221 1.00 TSHR (0.66) TSHRALDH1A1THRB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025018412-A1 PHOTOSENSITIVE ELEMENT, PHOTOSENSITIVE ELEMENT ROLL, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR FORMING CONDUCTOR PATTERN 旭化成株式会社 2025-01-23 WO disclosed
EP-3429001-B1 BINDER FOR NONAQUEOUS SECONDARY BATTERY ELECTRODES, SLURRY FOR NONAQUEOUS SECONDARY BATTERY ELECTRODES, ELECTRODE FOR NONAQUEOUS SECONDARY BATTERIES, AND NONAQUEOUS SECONDARY BATTERY ZEON CORP (JP) 2024-07-10 EP disclosed
US-20230375930-A1 PHOTOSENSITIVE RESIN MULTILAYER BODY ASAHI KASEI KABUSHIKI KAISHA (JP) 2023-11-23 US disclosed
WO-2023127934-A1 ENERGY-RAY-CURABLE COMPOSITION FOR THREE-DIMENSIONAL SHAPING USE, DENTAL STRUCTURE, MOUTHPIECE, TEETH-STRAIGHTENING MOUTHPIECE, AND METHOD FOR PRODUCING DENTAL STRUCTURE クラレノリタケデンタル株式会社 2023-07-06 WO disclosed
CN-108701833-B Binder for nonaqueous secondary battery electrode, slurry for nonaqueous secondary battery electrode, electrode for nonaqueous secondary battery, and nonaqueous secondary battery 日本瑞翁株式会社 2022-02-01 CN disclosed
US-10910651-B2 Binder for non-aqueous secondary battery electrode, slurry for non-aqueous secondary battery electrode, electrode for non-aqueous secondary battery, and non-aqueous secondary battery ZEON CORPORATION (JP) 2021-02-02 US disclosed
WO-2020145178-A1 INTERPENETRATING NETWORK POLYMER COMPRISING CROSSLINKED ORGANOPOLYSILOXANE AND (METH)ACRYLIC POLYMER, AND METHOD FOR PRODUCING SAME 信越化学工業株式会社 2020-07-16 WO disclosed
US-10709530-B2 Photocurable composition, denture base, and plate denture MITSUI CHEMICALS, INC. (JP) 2020-07-14 US disclosed
US-10338468-B2 Photosensitive resin composition, photosensitive resin laminate, resin pattern production method, cured film, and display device ASAHI KASEI KABUSHIKI KAISHA (JP) 2019-07-02 US disclosed
US-20190097235-A1 BINDER FOR NON-AQUEOUS SECONDARY BATTERY ELECTRODE, SLURRY FOR NON-AQUEOUS SECONDARY BATTERY ELECTRODE, ELECTRODE FOR NON-AQUEOUS SECONDARY BATTERY, AND NON-AQUEOUS SECONDARY BATTERY ZEON CORPORATION (JP) 2019-03-28 US disclosed
US-20180014919-A1 PHOTOCURABLE COMPOSITION, DENTURE BASE, AND PLATE DENTURE MITSUI CHEMICALS, INC. (JP) 2018-01-18 US disclosed
US-20170285474-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAMINATE, RESIN PATTERN PRODUCTION METHOD, CURED FILM, AND DISPLAY DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2017-10-05 US disclosed
US-8563223-B2 Photosensitive resin composition and laminate ASAHI KASEI E-MATERIALS CORPORATION (JP) 2013-10-22 US disclosed
US-8361697-B2 Photosensitive resin composition, photosensitive resin laminate, method for forming resist pattern and process for producing printed circuit board, lead frame, semiconductor package and concavoconvex board ASAHI KASEI E-MATERIALS CORPORATION (JP) 2013-01-29 US disclosed
US-20100297559-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAMINATE, METHOD FOR FORMING RESIST PATTERN AND PROCESS FOR PRODUCING PRINTED CIRCUIT BOARD, LEAD FRAME, SEMICONDUCTOR PACKAGE AND CONCAVOCONVEX BOARD ASAHI KASEI E-MATERIALS CORPORATION (JP) 2010-11-25 US disclosed
US-20100159691-A1 PHOTOSENSITIVE RESIN COMPOSITION AND LAMINATE ASAHI KASEI EMD CORPORATION (JP) 2010-06-24 US disclosed
US-20100119977-A1 PHOTOSENSITIVE RESIN COMPOSITION AND LAMINATE ASAHI KASEI E-MATERIALS CORPORATION (JP) 2010-05-13 US disclosed
US-6656633-B2 Binder for electrode for lithium ion secondary battery, and utilization thereof ZEON CORPORATION (JP) 2003-12-02 US disclosed
US-20020034686-A1 Electrochemical stability ZEON CORPORATION (JP) 2002-03-21 US disclosed
US-4194066-A POLYMERIZING POLYOXYALKYLENE GLYCOL (METH)ACRYLATES JAPAN ATOMIC ENERGY RESEARCH INSTITUTE (JP) 1980-03-18 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-10709530-B2 Photocurable composition, denture base, and plate denture PAM, COPE, ARCN1 TSHR 3274/4885ALDH1A1 947/4885THRB 1756/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.