SCHEMBL3345245

SCHEMBL3345245

N#Cc1ccccc1-c1c2ccccc2nc2ccccc12

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 6/20 0.55
KDM4E B2RXH2 4/20 0.55
SMN1; SMN2 Q16637 3/20 0.46
LMNA P02545 3/20 0.46
MAPT P10636 3/20 0.46
CYP1A2 P05177 2/20 0.46
CYP3A4 P08684 2/20 0.46
CYP2D6 P10635 2/20 0.46
CYP2C19 P33261 2/20 0.46
CYP2C9 P11712 1/20 0.46
NPSR1 Q6W5P4 1/20 0.46
GPR55 Q9Y2T6 1/20 0.46
GLA P06280 2/20 0.42
HPGD P15428 2/20 0.42
CASP1 P29466 2/20 0.42
CASP7 P55210 2/20 0.42
HSD17B10 Q99714 2/20 0.42
HTT P42858 2/20 0.42
GAA P10253 2/20 0.42
RAB9A P51151 2/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29660659 1.00 ALDH1A1 (0.55) ALDH1A1KDM4ESMN1; SMN2LMNAMAPT
SCHEMBL13170780 0.79 ESR2 (0.47) ALDH1A1KDM4EMAPTHPGDHSD17B10
SCHEMBL13170778 0.78 CA1 (0.55) ALDH1A1KDM4EMAPTGLAHPGD
SCHEMBL20291561 0.76 MEN1 (0.49) ALDH1A1KDM4ESMN1; SMN2LMNAMAPT
SCHEMBL21808809 0.76 ESR2 (0.43) LMNATSHRESR2CA1CA2
SCHEMBL786440 0.75 METAP1 (0.53) ALDH1A1KDM4ELMNAMAPTCYP1A2
SCHEMBL28165137 0.75 ADORA2A (0.64) ALDH1A1KDM4ECYP1A2HPGDHSD17B10
SCHEMBL14529177 0.75 CYP1A2 (0.49) ALDH1A1KDM4ESMN1; SMN2LMNAMAPT
SCHEMBL30594229 0.74 CYP1A2 (0.49) ALDH1A1KDM4ESMN1; SMN2LMNAMAPT
SCHEMBL27909137 0.73 ESR2 (0.52) ALDH1A1KDM4EKMT2ATSHRESR2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110357989-A Tertiary amine photosensitizer, preparation method, comprising its photosensitive polymer combination and photosensitive polymer combination application 常州强力电子新材料股份有限公司 2019-10-22 CN claimed
CN-110114376-B Curable composition, method for producing cured product, cured product thereof, and adhesive using same 株式会社ADEKA 2022-06-14 CN disclosed
EP-3339331-B1 COMPOSITION ADEKA CORP (JP) 2022-02-16 EP disclosed
CN-108419438-B Coloring composition 株式会社艾迪科 2021-10-01 CN disclosed
CN-112154167-A Composition, cured product, optical filter, and method for producing cured product 株式会社艾迪科 2020-12-29 CN disclosed
CN-111566173-A Coating composition, method for curing the composition, barrier film, and method for producing cured product 株式会社艾迪科 2020-08-21 CN disclosed
WO-2020021969-A1 COMPOSITION, CURED PRODUCT, OPTICAL FILTER, AND PRODUCTION METHOD FOR CURED PRODUCT 株式会社ADEKA 2020-01-30 WO disclosed
CN-110357989-A Tertiary amine photosensitizer, preparation method, comprising its photosensitive polymer combination and photosensitive polymer combination application 常州强力电子新材料股份有限公司 2019-10-22 CN disclosed
CN-110114376-A Curable composition, method for producing cured product, cured product thereof, and adhesive using same 株式会社ADEKA 2019-08-09 CN disclosed
CN-108419438-A Coloured composition 株式会社艾迪科 2018-08-17 CN disclosed
EP-3339331-A1 COMPOSITION Adeka Corporation (JP) 2018-06-27 EP disclosed
CN-107636024-A Composition 株式会社艾迪科 2018-01-26 CN disclosed
CN-101779165-B Photosensitive resin composition and laminate thereof ASAHI KASEI E MATERIALS CORP 2014-09-24 CN disclosed
CN-102844709-B Photosensitive resin composition, photoresist film using same, method for forming resist pattern, and method for manufacturing printed wiring board NICHIGO MORTON CO LTD 2014-08-20 CN disclosed
CN-102844709-A Photosensitive resin composition, photoresist film using same, method for forming resist pattern, and method for manufacturing printed wiring board NICHIGO MORTON CO LTD 2012-12-26 CN disclosed
CN-101449208-B Photosensitive resin composition and laminate ASAHI KASEI E-MATERIALS CORP. (JP) 2011-12-14 CN disclosed
CN-101779165-A Photosensitive resin composition and laminate thereof ASAHI KASEI EMD CORP 2010-07-14 CN disclosed
US-20100159691-A1 PHOTOSENSITIVE RESIN COMPOSITION AND LAMINATE ASAHI KASEI EMD CORPORATION (JP) 2010-06-24 US disclosed
CN-101568882-A Photosensitive resin composition and laminate ASAHI KASEI EMD CORP (JP) 2009-10-28 CN disclosed
CN-101449208-A Photosensitive resin composition and laminate ASAHI KASEI EMD CORP (JP) 2009-06-03 CN disclosed