⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28689950 | 0.87 | — | — | |
| SCHEMBL8331933 | 0.87 | — | — | |
| SCHEMBL27921930 | 0.87 | — | — | |
| SCHEMBL151515 | 0.82 | — | — | |
| SCHEMBL8510286 | 0.82 | — | — | |
| SCHEMBL12076550 | 0.82 | — | — | |
| SCHEMBL12076561 | 0.82 | — | — | |
| SCHEMBL8912718 | 0.82 | — | — | |
| SCHEMBL3517739 | 0.82 | — | — | |
| SCHEMBL4574627 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119104879-A | Radio frequency chip test carrier | 中国电子科技集团公司第二十六研究所 | 2024-12-10 | — | — | CN | claimed |
| CN-218918858-U | Chip packaging structure and electronic equipment | 上海慧能泰半导体科技有限公司 | 2023-04-25 | — | — | CN | claimed |
| WO-2010057933-A1 | INTEGRATED CIRCUIT DEVICE EQUIPPED WITH DIFFERENT CONNECTION MEANS | GEMALTO SA (FR) | 2010-05-27 | — | — | WO | claimed |
| US-20260150451-A1 | WIRING BOARD, FUNCTIONAL BACKPLANE, BACKLIGHT MODULE, DISPLAY PANEL AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. (CN) | 2026-05-28 | — | — | US | disclosed |
| US-12563875-B2 | Wiring board, functional backplane, backlight module, display panel and display apparatus | BOE TECHNOLOGY GROUP CO., LTD. (CN) | 2026-02-24 | — | — | US | disclosed |
| CN-119104879-A | Radio frequency chip test carrier | 中国电子科技集团公司第二十六研究所 | 2024-12-10 | — | — | CN | disclosed |
| US-20240234658-A1 | WIRING BOARD, FUNCTIONAL BACKPLANE, BACKLIGHT MODULE, DISPLAY PANEL AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. (CN) | 2024-07-11 | — | — | US | disclosed |
| CN-116685714-A | Circuit board, functional backboard, backlight module, display panel and display device | 京东方科技集团股份有限公司 | 2023-09-01 | — | — | CN | disclosed |
| CN-218918858-U | Chip packaging structure and electronic equipment | 上海慧能泰半导体科技有限公司 | 2023-04-25 | — | — | CN | disclosed |
| CN-109922600-B | Circuit board structure and manufacturing method thereof | 欣兴电子股份有限公司 | 2021-03-05 | — | — | CN | disclosed |
| US-10123418-B1 | Circuit board structure and manufacturing method thereof | UNIMICRON TECHNOLOGY CORP. (TW) | 2018-11-06 | — | — | US | disclosed |
| WO-2010057933-A1 | INTEGRATED CIRCUIT DEVICE EQUIPPED WITH DIFFERENT CONNECTION MEANS | GEMALTO SA (FR) | 2010-05-27 | — | — | WO | disclosed |
| CN-1356563-A | Refractory reflecting ayer, laminated sheet made of said reflecting layer, and LCD containing one of them | KOYA METALS CO LTD (JP) | 2002-07-03 | — | — | CN | disclosed |