⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9719776 | 0.78 | — | — | |
| SCHEMBL30495996 | 0.74 | ALDH1A1 (0.35) | — | |
| SCHEMBL5918601 | 0.69 | ALDH1A1 (0.35) | — | |
| SCHEMBL26416994 | 0.69 | ALDH1A1 (0.35) | — | |
| SCHEMBL28515504 | 0.69 | — | — | |
| SCHEMBL6248781 | 0.68 | CYP4F2 (0.31) | — | |
| SCHEMBL9719756 | 0.68 | — | — | |
| SCHEMBL2816954 | 0.67 | — | — | |
| SCHEMBL1475983 | 0.67 | — | — | |
| SCHEMBL15557031 | 0.67 | ALDH1A1 (0.33) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-113937417-B | Photocuring modified lithium ion battery diaphragm and preparation method thereof | 长园泽晖新能源材料研究院(珠海)有限公司 | 2022-08-02 | — | — | CN | claimed |
| CN-113937417-A | Photocuring modified lithium ion battery diaphragm and preparation method thereof | 长园泽晖新能源材料研究院(珠海)有限公司 | 2022-01-14 | — | — | CN | claimed |
| CN-113652163-A | Isocyanate-resistant release coating formula, release paper thereof, and manufacturing method and application of release paper | 浙江凯伦特种材料有限公司 | 2021-11-16 | — | — | CN | claimed |
| CN-112300746-A | Preparation method of UV (ultraviolet) moisture dual-curing heat-conducting adhesive | 上海汉司实业有限公司 | 2021-02-02 | — | — | CN | claimed |
| CN-111004376-A | Preparation method of fluorine-containing alkali-soluble UV resin and UV ink composition of resin | 福建拓烯新材料科技有限公司 | 2020-04-14 | — | — | CN | claimed |
| CN-115701857-A | Composition, dried product, cured product, transfer film, method for producing transfer film, and method for forming pattern | 富士胶片株式会社 | 2023-02-14 | — | — | CN | disclosed |
| CN-115686260-A | Touch panel sensor and method for manufacturing touch panel sensor | 富士胶片株式会社 | 2023-02-03 | — | — | CN | disclosed |
| CN-115685683-A | Photosensitive transfer material for LED array, light-shielding material for LED array, and electronic device | 富士胶片株式会社 | 2023-02-03 | — | — | CN | disclosed |
| CN-115519871-A | Transfer film, laminate, acoustic speaker, and method for manufacturing laminate | 富士胶片株式会社 | 2022-12-27 | — | — | CN | disclosed |
| CN-115480446-A | Transfer film, laminate, pattern forming method, and method for manufacturing circuit board | 富士胶片株式会社 | 2022-12-16 | — | — | CN | disclosed |
| CN-113087406-B | High-temperature toughened color photovoltaic glass panel, production method thereof and color solar photovoltaic module | 杭州玻美文化艺术有限公司 | 2022-10-14 | — | — | CN | disclosed |
| CN-113097340-B | Solar panel with honeycomb-shaped color coating, production method thereof and color solar photovoltaic module | 杭州科望特种油墨有限公司 | 2022-08-02 | — | — | CN | disclosed |
| CN-107964385-B | High-thermal-conductivity ultraviolet-curing adhesive and preparation method thereof | 黑龙江省科学院石油化学研究院 | 2021-02-09 | — | — | CN | disclosed |
| CN-112300746-A | Preparation method of UV (ultraviolet) moisture dual-curing heat-conducting adhesive | 上海汉司实业有限公司 | 2021-02-02 | — | — | CN | disclosed |
| CN-111004376-A | Preparation method of fluorine-containing alkali-soluble UV resin and UV ink composition of resin | 福建拓烯新材料科技有限公司 | 2020-04-14 | — | — | CN | disclosed |
| US-8361697-B2 | Photosensitive resin composition, photosensitive resin laminate, method for forming resist pattern and process for producing printed circuit board, lead frame, semiconductor package and concavoconvex board | ASAHI KASEI E-MATERIALS CORPORATION (JP) | 2013-01-29 | — | — | US | disclosed |
| US-20100297559-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAMINATE, METHOD FOR FORMING RESIST PATTERN AND PROCESS FOR PRODUCING PRINTED CIRCUIT BOARD, LEAD FRAME, SEMICONDUCTOR PACKAGE AND CONCAVOCONVEX BOARD | ASAHI KASEI E-MATERIALS CORPORATION (JP) | 2010-11-25 | — | — | US | disclosed |
| US-20100159691-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND LAMINATE | ASAHI KASEI EMD CORPORATION (JP) | 2010-06-24 | — | — | US | disclosed |
| US-6090487-A | COMPOSITION WHICH REACTS TO ULTRAVIOLET RADIATION OR TO ELECTRON BEAM; COMPOSITES | VETROTEX FRANCE (FR) | 2000-07-18 | — | — | US | disclosed |
| US-5882792-A | Sizing composition for glass threads, process using this composition and resulting products | VETROTEX FRANCE (FR) | 1999-03-16 | — | — | US | disclosed |