SCHEMBL335412

SCHEMBL335412

C=CC1(C)CC[Si](C)(C)[Si](C)(C)O1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17559157 0.80
SCHEMBL17083 0.77
SCHEMBL645823 0.75
SCHEMBL28307575 0.70
SCHEMBL1059754 0.69
SCHEMBL5855822 0.69
SCHEMBL18631787 0.69
SCHEMBL6243921 0.68
SCHEMBL8761842 0.67
SCHEMBL2527586 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 498 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122043860-A Low-haze low-temperature curing negative photosensitive resin composition, preparation method thereof and hardening film 深圳市道尔顿电子材料股份有限公司 2026-05-15 CN claimed
EP-4735933-A2 SURFACE ACTIVATED CHEMICAL VAPOR DEPOSITION AND USES THEREOF Gvd Corporation (US) 2026-05-06 EP claimed
US-12331164-B2 Curable siloxane resin composition KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY (KR) 2025-06-17 US claimed
WO-2025106343-A1 ETCHING METHODS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2025-05-22 WO claimed
US-20250157825-A1 ETCHING METHODS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2025-05-15 US claimed
CN-119932984-A Construction method of ultra-thin finish asphalt mixture 江西省宏发路桥建筑工程有限公司 2025-05-06 CN claimed
CN-119905656-A Electrolyte, preparation method of electrolyte and lithium ion battery 惠州亿纬锂能股份有限公司 2025-04-29 CN claimed
CN-119709004-A Organic-inorganic hybrid fluorine-free anti-fingerprint transparent coating and preparation method and application thereof 华东理工大学 2025-03-28 CN claimed
CN-119729322-A Hearing aid and preparation method thereof 江苏菲沃泰纳米科技股份有限公司 2025-03-28 CN claimed
CN-119639002-A Modified branched organic silicon emulsifier and preparation method and application thereof 万华化学集团股份有限公司 2025-03-18 CN claimed
WO-2007022377-A2 CONFORMABLE SOLVENT-BASED BANDAGE AND COATING MATERIAL SALAMONE ANN BEAL (US) 2007-02-22 WO claimed
CN-1819180-A Dielectric materialand method to make the same IBM (US) 2006-08-16 CN claimed
US-20060165891-A1 SiCOH dielectric material with improved toughness and improved Si-C bonding, semiconductor device containing the same, and method to make the same INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2006-07-27 US claimed
CN-1782125-A Method for forming dielectric film and dielectric film IBM (US) 2006-06-07 CN claimed
US-20060079099-A1 Ultra low k plasma enhanced chemical vapor deposition processes using a single bifunctional precursor containing both a SiCOH matrix functionality and organic porogen functionality INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2006-04-13 US claimed
US-20050194619-A1 SiCOH dielectric material with improved toughness and improved Si-C bonding, semiconductor device containing the same, and method to make the same INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2005-09-08 US claimed
EP-0915120-B1 Method for termination of post cure in silicone elastomers DOW CORNING (US) 2002-01-30 EP claimed
US-6136874-A Microporous polymeric foams made with silicon or germanium based monomers THE PROCTER & GAMBLE COMPANY (US) 2000-10-24 US claimed
US-5929164-A THICKENING SOLVENTS BY REACTING A HYDRIDOPOLYSILOXANE, A ALPHA-OMEGA DIENE USING A PLATINUM HYDROSILATION CATALYST AND SOLVENT; GELATION; REACTING WITH AN UNSATURATED SILANE AND SHEARING TO FORM A PASTE DOW CORNING CORPORATION (US) 1999-07-27 US claimed
EP-0915120-A2 Method for termination of post cure in silicone elastomers DOW CORNING CORPORATION (US) 1999-05-12 EP claimed