SCHEMBL3356310

SCHEMBL3356310

C(OCC1CO1)C1CO1.C=CC(=O)OCCO

nearest known ligand 0.61

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
TSHR P16473 8/20 0.61
ALDH1A1 P00352 7/20 0.47
TP53 P04637 4/20 0.47
HIF1A Q16665 3/20 0.47
HSD17B10 Q99714 1/20 0.47
CYP3A4 P08684 3/20 0.43
HPGD P15428 1/20 0.40
THRB P10828 2/20 0.37
SMN1; SMN2 Q16637 2/20 0.36
MAPK1 P28482 2/20 0.36
TDP1 Q9NUW8 1/20 0.34
MGLL Q99685 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7642504 0.92 TSHR (0.63) TSHRALDH1A1TP53HIF1AHSD17B10
SCHEMBL28675392 0.91 ALDH1A1 (0.49) TSHRALDH1A1TP53HIF1AHSD17B10
SCHEMBL272759 0.89 ALDH1A1 (0.51) TSHRALDH1A1TP53HIF1AHSD17B10
SCHEMBL14244559 0.88 ALDH1A1 (0.54) TSHRALDH1A1TP53HIF1AHSD17B10
SCHEMBL14244380 0.88 ALDH1A1 (0.54) TSHRALDH1A1TP53HIF1AHSD17B10
SCHEMBL14244350 0.88 ALDH1A1 (0.54) TSHRALDH1A1TP53HIF1AHSD17B10
SCHEMBL14244498 0.88 ALDH1A1 (0.54) TSHRALDH1A1TP53HIF1AHSD17B10
SCHEMBL14244556 0.88 ALDH1A1 (0.54) TSHRALDH1A1TP53HIF1AHSD17B10
SCHEMBL14244603 0.88 ALDH1A1 (0.54) TSHRALDH1A1TP53HIF1AHSD17B10
Di(Hydroxyethyl)Ether SCHEMBL28908686 0.87 TSHR (0.52) TSHRALDH1A1TP53HIF1AHSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 43 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240158677-A1 ADHESIVE AND METHOD FOR REMOVING THE SAME INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2024-05-16 US claimed
CN-117925117-A Adhesive and removing method thereof 财团法人工业技术研究院 2024-04-26 CN claimed
CN-113861850-B Packaging adhesive film composition, packaging adhesive film and solar cell module 杭州福斯特应用材料股份有限公司 2023-07-14 CN claimed
CN-113861850-A Packaging adhesive film composition, packaging adhesive film and solar cell module 杭州福斯特应用材料股份有限公司 2021-12-31 CN claimed
CN-113817138-A UV-cured fingerprint-resistant resin with high fluorine content and preparation method and application thereof 湖南昕逸辰科技有限公司 2021-12-21 CN claimed
US-20240158677-A1 ADHESIVE AND METHOD FOR REMOVING THE SAME INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2024-05-16 US disclosed
CN-117925117-A Adhesive and removing method thereof 财团法人工业技术研究院 2024-04-26 CN disclosed
US-20230352733-A1 ELECTROLYTE COMPOSITION, QUASI-SOLID ELECTROLYTE AND LITHIUM-ION BATTERY EMPLOYING THE SAME INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2023-11-02 US disclosed
EP-4270579-A2 ELECTROLYTE COMPOSITION, QUASI-SOLID ELECTROLYTE AND LITHIUM-ION BATTERY EMPLOYING THE SAME Industrial Technology Research Institute (TW) 2023-11-01 EP disclosed
CN-116960450-A Electrolyte composition, solid-like electrolyte and lithium ion battery comprising same 财团法人工业技术研究院 2023-10-27 CN disclosed
CN-113861850-B Packaging adhesive film composition, packaging adhesive film and solar cell module 杭州福斯特应用材料股份有限公司 2023-07-14 CN disclosed
CN-107709493-B Photocurable adhesive sheet, and image display device 三菱化学株式会社 2022-08-09 CN disclosed
EP-1564232-B1 PHOTOSENSITIVE RESIN COMPOSITION AND PROCESS FOR THE FORMATION OF HYDROGEL TOYO GOSEI CO LTD (JP) 2008-08-20 EP disclosed
US-7408002-B2 Photosensitive resin composition and process for the formation of hydrogel TOYO GOSEI CO., LTD (JP) 2008-08-05 US disclosed
US-7320854-B2 Mixture of oxide particles, polymerizable compound,radiation sensitive decomposer and releasing agent JSR CORPORATION (JP) 2008-01-22 US disclosed
US-20060041052-A1 Photosensitive resin compostion and process for the formation of hydrogel TOYO GOSEI CO., LTD (JP) 2006-02-23 US disclosed
EP-1564232-A1 PHOTOSENSITIVE RESIN COMPOSITION AND PROCESS FOR THE FORMATION OF HYDROGEL Toyo Gosei Co., Ltd. (JP) 2005-08-17 EP disclosed
EP-1494072-A2 Radiation sensitive refractive index changing composition, pattern forming method and optical material JSR Corporation (JP) 2005-01-05 EP disclosed
US-20040265737-A1 Radiation sensitive refractive index changing composition, pattern forming method and optical material JSR CORPORATION (JP) 2004-12-30 US disclosed
US-4490433-A IMPREGNATION WITH ACRYLATE COMPOUNDS AND CURING TEIJIN LIMITED (JP) 1984-12-25 US disclosed