⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL297696 | 0.89 | — | — | |
| SCHEMBL18145549 | 0.82 | — | — | |
| SCHEMBL8845955 | 0.82 | — | — | |
| SCHEMBL6896108 | 0.80 | — | — | |
| SCHEMBL16477649 | 0.77 | — | — | |
| SCHEMBL2048012 | 0.77 | — | — | |
| SCHEMBL25331980 | 0.76 | TSHR (0.31) | — | |
| SCHEMBL5701576 | 0.73 | — | — | |
| SCHEMBL295866 | 0.73 | — | — | |
| SCHEMBL23499898 | 0.72 | TSHR (0.37) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 122 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12331164-B2 | Curable siloxane resin composition | KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY (KR) | 2025-06-17 | — | — | US | claimed |
| WO-2025106343-A1 | ETCHING METHODS | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2025-05-22 | — | — | WO | claimed |
| US-20250157825-A1 | ETCHING METHODS | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. | 2025-05-15 | — | — | US | claimed |
| US-20240258111-A1 | Surface Treatment Compositions and Methods | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. | 2024-08-01 | — | — | US | claimed |
| US-20230078587-A1 | CURABLE SILOXANE RESIN COMPOSITION | KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY (KR) | 2023-03-16 | — | — | US | claimed |
| CN-115109302-A | Micro-foaming material for internal injection molding of automobile plastic part and preparation method thereof | 江苏永成汽车零部件股份有限公司 | 2022-09-27 | — | — | CN | claimed |
| US-11447642-B2 | Methods of using surface treatment compositions | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2022-09-20 | — | — | US | claimed |
| CN-112920351-B | Hybrid sewage treatment flocculant and preparation method thereof | 山东格瑞水务有限公司 | 2021-12-07 | — | — | CN | claimed |
| US-11174394-B2 | Surface treatment compositions and articles containing same | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2021-11-16 | — | — | US | claimed |
| EP-3830196-A1 | SURFACE TREATMENT COMPOSITIONS AND METHODS | FUJIFILM Electronic Materials U.S.A, Inc. (US) | 2021-06-09 | — | — | EP | claimed |
| US-7345000-B2 | Method and system for treating a dielectric film | TOKYO ELECTRON LIMITED (JP) | 2008-03-18 | — | — | US | claimed |
| WO-2007040834-A2 | PLURAL TREATMENT STEP PROCESS FOR TREATING DIELECTRIC FILMS | TOKYO ELECTRON LIMITED (JP) | 2007-04-12 | — | — | WO | claimed |
| WO-2007040816-A2 | TREATMENT OF LOW DIELECTRIC CONSTANT FILMS USING A BATCH PROCESSING SYSTEM | TOKYO ELECTRON LIMITED (JP) | 2007-04-12 | — | — | WO | claimed |
| WO-2007040856-A2 | PLASMA-ASSISTED VAPOR PHASE TREATMENT OF LOW DIELECTRIC CONSTANT FILMS USING A BATCH PROCESSING SYSTEM | TOKYO ELECTRON LIMITED (JP) | 2007-04-12 | — | — | WO | claimed |
| US-20070077782-A1 | Treatment of low dielectric constant films using a batch processing system | TOKYO ELECTRON LIMITED (JP) | 2007-04-05 | — | — | US | claimed |
| US-20070077353-A1 | Plasma-assisted vapor phase treatment of low dielectric constant films using a batch processing system | TOKYO ELECTRON LIMITED (JP) | 2007-04-05 | — | — | US | claimed |
| US-20070077781-A1 | Plural treatment step process for treating dielectric films | TOKYO ELECTRON LIMTED (JP) | 2007-04-05 | — | — | US | claimed |
| WO-2006091264-A1 | METHOD AND SYSTEM FOR TREATING A DIELECTRIC FILM | TOKYO ELECTRON LIMITED (JP) | 2006-08-31 | — | — | WO | claimed |
| US-20060079099-A1 | Ultra low k plasma enhanced chemical vapor deposition processes using a single bifunctional precursor containing both a SiCOH matrix functionality and organic porogen functionality | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2006-04-13 | — | — | US | claimed |
| US-20050215072-A1 | Method and system for treating a dielectric film | TOKYO ELECTRON LIMITED (JP) | 2005-09-29 | — | — | US | claimed |