SCHEMBL33678

SCHEMBL33678

Cc1nc(-c2ccccc2)[nH]c1CO

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 2/20 0.50
PIN1 Q13526 2/20 0.49
MAPK1 P28482 2/20 0.47
USP2 O75604 2/20 0.47
TSHR P16473 2/20 0.47
HSD17B10 Q99714 2/20 0.47
MAPT P10636 3/20 0.46
GAA P10253 2/20 0.46
HPGDS O60760 1/20 0.45
POLB P06746 2/20 0.45
L3MBTL1 Q9Y468 1/20 0.43
NPC1 O15118 2/20 0.43
RAB9A P51151 2/20 0.43
BRAF P15056 2/20 0.42
CYP1A2 P05177 1/20 0.42
CASP1 P29466 1/20 0.42
CYP2C19 P33261 1/20 0.42
NPY5R Q15761 1/20 0.41
ALDH1A1 P00352 1/20 0.41
LMNA P02545 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28104155 0.98 KDM4E (0.49) KDM4EPIN1MAPK1USP2TSHR
Ethylenediamine SCHEMBL28169136 0.93 KDM4E (0.46) KDM4EPIN1MAPK1USP2TSHR
SCHEMBL28331048 0.92 KDM4E (0.51) KDM4EPIN1MAPK1USP2TSHR
SCHEMBL22321933 0.92 KDM4E (0.51) KDM4EPIN1MAPK1USP2TSHR
SCHEMBL8075160 0.89 KDM4E (0.49) KDM4EPIN1MAPK1USP2TSHR
SCHEMBL16848277 0.88 KDM4E (0.47) KDM4EPIN1MAPK1USP2TSHR
SCHEMBL16412171 0.88 KDM4E (0.42) KDM4EPIN1MAPK1USP2TSHR
SCHEMBL29165053 0.87 NISCH (0.46) KDM4EPIN1MAPK1USP2TSHR
Imidazole SCHEMBL28230383 0.85 KDM4E (0.40) KDM4EPIN1MAPK1USP2TSHR
SCHEMBL28107791 0.85 TSHR (0.41) KDM4EPIN1MAPK1USP2TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 6702 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025224106-A1 USE OF A COMPOSITION OR THERMOSETTING RESIN OR THERMOSET POLYMER MADE THEREFROM AS BUILD-UP FILM MATERIAL IN A PRINTED CIRCUIT ELEMENT BASF SE (DE) 2025-10-30 WO claimed
US-20250277138-A1 LAYER-ADDING ADHESIVE FILM CONTAINING MODIFIED BENZOCYCLOBUTENE FOR FC-BGA PACKAGE CARRIER, PREPARATION METHOD, AND APPLICATION THEREOF Shenzhen Newccess Industrial Co., Ltd. (CN) 2025-09-04 US claimed
CN-120032941-A Conductive paste and preparation method of antioxidant copper powder in conductive paste 西北工业大学 2025-05-23 CN claimed
US-20250163261-A1 LOW-DIELECTRIC RESIN COMPOSITION NAN YA PLASTICS CORPORATION (TW) 2025-05-22 US claimed
CN-120005486-A Low dielectric resin composition 南亚塑胶工业股份有限公司 2025-05-16 CN claimed
WO-2025084680-A1 MOLDING MATERIAL COMPOSITION FOR MOTOR 주식회사 케이씨씨 2025-04-24 WO claimed
CN-116042157-B Low-dielectric flame-retardant lamination adhesive film for FCBGA packaging carrier plate and preparation method thereof 深圳市纽菲斯新材料科技有限公司 2025-04-08 CN claimed
CN-119614117-A Modified epoxidized polybutadiene-containing build-up adhesive film for FC-BGA packaging carrier plate and preparation method and application thereof 深圳市纽菲斯新材料科技有限公司 2025-03-14 CN claimed
WO-2025048214-A1 COMPOSITION FOR INJECTION MOLDING MATERIAL 주식회사 케이씨씨 2025-03-06 WO claimed
CN-119286362-B Preparation method and application of insulating paint 广东金驭科技有限公司 2025-02-28 CN claimed
US-5412002-A Encapsulation NIPPON OIL CO., LTD. (JP) 1995-05-02 US claimed
US-5344899-A Phenol-tetrahydroindene resin NIPPON OIL CO., LTD. (JP) 1994-09-06 US claimed
EP-0251760-B1 Rubber composition BRIDGESTONE CORP (JP) 1994-01-26 EP claimed
US-5248710-A Epoxy and silicone resins with imidazole compounds and silica SHIN-ETSU CHEMICAL CO., LTD. (JP) 1993-09-28 US claimed
US-5140055-A Improved high speed grip performance BRIDGESTONE CORPORATION (JP) 1992-08-18 US claimed
US-4925901-A STORAGE STAABILITY, ONIUM ION CATALYST THE DOW CHEMICAL COMPANY (US) 1990-05-15 US claimed
US-4663190-A CURING EPOXY RESIN, DIBASIC ACID, IMIDAZOLE HITACHI CHEMICAL COMPANY, LTD. (JP) 1987-05-05 US claimed
US-4658009-A Novel 2-substituted-4,6-diamino-s-triazine/isocyanuric acid adduct, process for synthesis of said adduct and process for curing polyepoxy resin with said adduct SHIKOKU CHEMICALS CORPORATION (JP) 1987-04-14 US claimed
EP-0194895-A2 2-substituted-4, 6-diamino-s-triazine/isocyanuric acid adduct, process for synthesis of said adduct and process for curing polyepoxy resin with said adduct SHIKOKU CHEMICALS CORPORATION (JP) 1986-09-17 EP claimed
US-4294950-A POLYVALENT CARBOXYLIC ACID BONDED THERETO ITO OPTICAL INDUSTRIAL CO., LTD. (JP) 1981-10-13 US claimed