SCHEMBL33709

SCHEMBL33709

CCCCCCCC[Si](C)(C)OC

nearest known ligand 0.42

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
TSHR P16473 4/20 0.42
THRB P10828 1/20 0.42
LMNA P02545 3/20 0.42
EPHX1 P07099 1/20 0.37
DNM1 Q05193 6/20 0.33
ALDH1A1 P00352 3/20 0.33
MEN1 O00255 2/20 0.33
KMT2A Q03164 2/20 0.33
HSD17B10 Q99714 1/20 0.33
SLC22A1 O15245 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30277142 1.00 TSHR (0.42) TSHRTHRBLMNAEPHX1DNM1
SCHEMBL30277229 1.00 TSHR (0.42) TSHRTHRBLMNAEPHX1DNM1
SCHEMBL14265451 1.00 TSHR (0.42) TSHRTHRBLMNAEPHX1DNM1
SCHEMBL5843393 1.00 TSHR (0.42) TSHRTHRBLMNAEPHX1DNM1
SCHEMBL236670 1.00 TSHR (0.42) TSHRTHRBLMNAEPHX1DNM1
SCHEMBL6054003 1.00 TSHR (0.42) TSHRTHRBLMNAEPHX1DNM1
SCHEMBL2183246 1.00 TSHR (0.42) TSHRTHRBLMNAEPHX1DNM1
SCHEMBL5843473 1.00 TSHR (0.42) TSHRTHRBLMNAEPHX1DNM1
SCHEMBL6884838 1.00 TSHR (0.42) TSHRTHRBLMNAEPHX1DNM1
SCHEMBL30277222 1.00 TSHR (0.42) TSHRTHRBLMNAEPHX1DNM1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 972 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2026105442-A1 COATING FILM, ELECTRONIC DEVICE, MOBILE BODY, AND COATING LIQUID ハドラスホールディングス株式会社 2026-05-21 WO claimed
US-12525449-B2 Method and apparatus for filling a gap ASM IP HOLDING B.V. (NL) 2026-01-13 US claimed
EP-4634324-A1 AMPHIPHILIC ABRASIVE PARTICLES AND THEIR USE FOR CHEMICAL MECHANICAL PLANARIZATION Versum Materials US, LLC (US) 2025-10-22 EP claimed
US-12331164-B2 Curable siloxane resin composition KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY (KR) 2025-06-17 US claimed
CN-120157861-A Polyester resin for low-temperature curing powder coating, preparation method of polyester resin and low-temperature curing powder coating 黄山嘉恒科技有限公司 2025-06-17 CN claimed
CN-119286254-A Application of alkyl modified silane polymer in preparation of alkali-resistant material 江西晨光新材料股份有限公司 2025-01-10 CN claimed
US-20240401204-A1 METHOD AND COMPOSITION FOR ADJUSTING HYDROPHILICITY OF METAL USING A POLYPHENOL AND A SILANE MODIFIED NANO PARTICULATE OR AMINO ACID AMND SILICA Bulk Chemicals (US) 2024-12-05 US claimed
CN-118698489-A Adsorbents, devices, kits and methods useful for biological sample processing 沃特世科技公司 2024-09-27 CN claimed
WO-2024129435-A1 AMPHIPHILIC ABRASIVE PARTICLES AND THEIR USE FOR CHEMICAL MECHANICAL PLANARIZATION VERSUM MATERIALS US, LLC (US) 2024-06-20 WO claimed
US-20240162084-A1 SEMICONDUCTOR STRUCTURE HAVING AIR GAPS AND METHOD FOR MANUFACTURING THE SAME TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) 2024-05-16 US claimed
WO-2007040856-A2 PLASMA-ASSISTED VAPOR PHASE TREATMENT OF LOW DIELECTRIC CONSTANT FILMS USING A BATCH PROCESSING SYSTEM TOKYO ELECTRON LIMITED (JP) 2007-04-12 WO claimed
US-20070077782-A1 Treatment of low dielectric constant films using a batch processing system TOKYO ELECTRON LIMITED (JP) 2007-04-05 US claimed
US-20070077353-A1 Plasma-assisted vapor phase treatment of low dielectric constant films using a batch processing system TOKYO ELECTRON LIMITED (JP) 2007-04-05 US claimed
US-20070077781-A1 Plural treatment step process for treating dielectric films TOKYO ELECTRON LIMTED (JP) 2007-04-05 US claimed
WO-2007031775-A1 METHOD FOR ATTACHMENT OF SILICON-CONTAINING COMPOUNDS TO A SURFACE AND FOR THE SYNTHESIS OF HYPERVALENT SILICON-COMPOUNDS ALEXIUM LIMITED (CY) 2007-03-22 WO claimed
WO-2006091264-A1 METHOD AND SYSTEM FOR TREATING A DIELECTRIC FILM TOKYO ELECTRON LIMITED (JP) 2006-08-31 WO claimed
US-20050215072-A1 Method and system for treating a dielectric film TOKYO ELECTRON LIMITED (JP) 2005-09-29 US claimed
US-6703497-B1 SURFACE MODIFIED BY HAVING HYDROXYL FUNCTIONAL GROUPS PRESENT AT THE SURFACE ETHERIFIED BY ORGANIC COMPOUND COMPRISING SILYLATING AGENT, ISOCYANATE, HALOGENATED ALKYLATING AGENT, ALKYLENE OXIDE, OR GLYCIDYL COMPOUND RHODIA CHIMIE (FR) 2004-03-09 US claimed
EP-1114065-A1 CELLULOSE MICROFIBRILS WITH MODIFIED SURFACE, PREPARATION METHOD AND USE THEREOF RHODIA CHIMIE (FR) 2001-07-11 EP claimed
WO-2000015667-A1 CELLULOSE MICROFIBRILS WITH MODIFIED SURFACE, PREPARATION METHOD AND USE THEREOF RHODIA CHIMIE (FR) 2000-03-23 WO claimed