SCHEMBL3370922

SCHEMBL3370922

CCO[Si](CCCC(F)(F)F)(OCC)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27959490 0.93
SCHEMBL3920178 0.91
SCHEMBL16552629 0.91
SCHEMBL27959467 0.91
SCHEMBL16553335 0.91
SCHEMBL23521409 0.91
SCHEMBL16552579 0.91
SCHEMBL14028706 0.90 LMNA (0.32)
SCHEMBL180362 0.86
SCHEMBL419776 0.85

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2057240-B1 LAMINATES UTILIZING SILICONE PRESSURE SENSITIVE ADHESIVE COMPOSITION AND CONVENTIONAL SILICONE LINERS MOMENTIVE PERFORMANCE MAT INC (US) 2011-12-07 EP claimed
CN-101180343-B Fluoroalkylsilylated MQ resin and solvent-resistant pressure sensitive adhesive composition containing same MOMENTIVE PERFORMANCE MAT INC 2011-07-27 CN claimed
EP-1907450-B1 FLUOROALKYLSILYLATED MQ RESIN AND SOLVENT-RESISTANT PRESSURE SENSITIVE ADHESIVE COMPOSITION CONTAINING SAME MOMENTIVE PERFORMANCE MAT INC (US) 2010-10-13 EP claimed
CN-101573421-A Laminates utilizing pressure sensitive adhesive composition and conventional silicone liners MOMENTIVE PERFORMANCE MAT INC (US) 2009-11-04 CN claimed
EP-2057240-A2 LAMINATES UTILIZING SILICONE PRESSURE SENSITIVE ADHESIVE COMPOSITION AND CONVENTIONAL SILICONE LINERS Momentive Performance Materials Inc. (US) 2009-05-13 EP claimed
CN-101180343-A Fluoroalkylsilylated mq resin and solvent-resistant pressure sensitive adhesive composition containing same GEN ELECTRIC (US) 2008-05-14 CN claimed
EP-1907450-A1 FLUOROALKYLSILYLATED MQ RESIN AND SOLVENT-RESISTANT PRESSURE SENSITIVE ADHESIVE COMPOSITION CONTAINING SAME Momentive Performance Materials Inc. (US) 2008-04-09 EP claimed
WO-2008027498-A2 LAMINATES UTILIZING PRESSURE SENSITIVE ADHESIVE COMPOSITION AND CONVENTIONAL SILICONE LINERS MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2008-03-06 WO claimed
US-20080057251-A1 Laminates utilizing pressure sensitive adhesive composition and conventional silicon liners GENERAL ELECTRIC COMPANY (US) 2008-03-06 US claimed
US-7253238-B2 Fluoroalkylsilylated MQ resin and solvent-resistant pressure sensitive adhesive composition containing same MOMENTINE PERFORMANCE MATERIALS INC. (US) 2007-08-07 US claimed
WO-2006110439-A1 FLUOROALKYLSILYLATED MQ RESIN AND SOLVENT-RESISTANT PRESSURE SENSITIVE ADHESIVE COMPOSITION CONTAINING SAME GENERAL ELECTRIC COMPANY (US) 2006-10-19 WO claimed
US-20060229424-A1 Fluoroalkylsilylated MQ resin and solvent-resistant pressure sensitive adhesive composition containing same GENERAL ELECTRIC COMPANY 2006-10-12 US claimed
CN-113045970-B Coating composition and coated article 株式会社尼欧斯 2023-10-13 CN disclosed
CN-114402048-B Coating composition and article having coating 株式会社尼欧斯 2023-01-03 CN disclosed
CN-114402048-A Coating composition and article having coating 株式会社尼欧斯 2022-04-26 CN disclosed
WO-2021132436-A1 COATING COMPOSITION AND ARTICLE PROVIDED WITH COATING 株式会社ネオス 2021-07-01 WO disclosed
US-6864323-B2 Composition for improving scorch conditions in the preparation of grafted and/or crosslinked polymers and of filled plastics DEGUSSA AG (DE) 2005-03-08 US disclosed
US-20030114604-A1 Composition for improving scorch conditions in the preparation of grafted and/or crosslinked polymers and of filled plastics DEGUSA AG (DE) 2003-06-19 US disclosed
EP-1288235-A2 Agents for the improvement of the vulcanisation behaviour in the preparation of grafted or crosslinked polymers and filled resins Degussa AG (DE) 2003-03-05 EP disclosed
US-6399733-B1 SILICONES MITSUBISHI DENKI KABUSHIKI KAISHA (JP) 2002-06-04 US disclosed