SCHEMBL3373347

SCHEMBL3373347

CC(C)(C)c1ccc2c(c1)Cc1c-2ccc(C(C)(C)C)c1[Zr](Cl)(Cl)(=C1CCCCC1)C1C=Cc2ccccc21

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3375983 0.84
SCHEMBL3371895 0.84
SCHEMBL2806622 0.81
SCHEMBL2805309 0.74
Hydrochloric Acid SCHEMBL3373340 0.74
SCHEMBL2805385 0.74 PNMT (0.32)
SCHEMBL29976431 0.71
Hydrochloric Acid SCHEMBL3371890 0.70
SCHEMBL2802229 0.69
SCHEMBL2804103 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2050771-B1 FILM OR LAMINATE COMPRISING ETHYLENE RESIN OR ETHYLENE RESIN COMPOSITION MITSUI CHEMICALS INC (JP) 2020-07-15 EP disclosed
US-8299193-B2 Film or laminate comprising ethylene-based resin or ethylene-based resin composition MITSUI CHEMICALS, INC. (JP) 2012-10-30 US disclosed
US-7858723-B2 Ethylene-based resin and molded object obtained therefrom MITSUI CHEMICALS, INC. (JP) 2010-12-28 US disclosed
EP-1849805-B1 ETHYLENIC RESIN AND FORMED ARTICLE OBTAINED THEREFROM MITSUI CHEMICALS INC (JP) 2010-11-10 EP disclosed
US-20090291285-A1 FILM OR LAMINATE COMPRISING ETHYLENE-BASED RESIN OR ETHYLENE-BASED RESIN COMPOSITION MITSUI CHEMICALS, INC. 2009-11-26 US disclosed
EP-2050771-A1 FILM OR LAMINATE COMPRISING ETHYLENE RESIN OR ETHYLENE RESIN COMPOSITION Mitsui Chemicals, Inc. (JP) 2009-04-22 EP disclosed
US-20080090983-A1 Ethylene-Based Resin and Molded Object Obtained Therefrom MITSUI CHEMICALS, INC. (JP) 2008-04-17 US disclosed
EP-1849805-A1 ETHYLENIC RESIN AND FORMED ARTICLE OBTAINED THEREFROM Mitsui Chemicals, Inc. (JP) 2007-10-31 EP disclosed