SCHEMBL3382085

SCHEMBL3382085

C=C(C)C(=O)OOC(C)OC(C)OC(=O)OC(C)OC(C)OOC(=O)C(=C)C

nearest known ligand 0.37

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.37
ALDH1A1 P00352 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3383725 0.90 TSHR (0.41) TSHRALDH1A1
SCHEMBL3383731 0.87 TSHR (0.32) TSHR
SCHEMBL14482142 0.85 ALDH1A1 (0.43) TSHRALDH1A1
SCHEMBL10350826 0.84 TSHR (0.42) TSHRALDH1A1
SCHEMBL10716069 0.82 TSHR (0.45) TSHRALDH1A1
SCHEMBL3382589 0.82 TSHR (0.32) TSHR
SCHEMBL3382997 0.81 TSHR (0.31) TSHR
SCHEMBL10715594 0.80 TSHR (0.30) TSHR
SCHEMBL4096632 0.78 TSHR (0.46) TSHRALDH1A1
SCHEMBL1792808 0.77 TSHR (0.34) TSHRALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-107531978-B Methacrylic resin composition 株式会社可乐丽 2020-11-03 CN disclosed
EP-0991082-B1 COMPOSITE DIELECTRIC MATERIAL COMPOSITION, AND FILM, SUBSTRATE, ELECTRONIC PARTS AND MOLDINGS THEREFROM TDK CORP (JP) 2010-11-24 EP disclosed
EP-0953608-B1 HEAT-RESISTANT, LOWLY DIELECTRIC HIGH-MOLECULAR MATERIAL, AND FILMS, SUBSTRATES, ELECTRIC COMPONENTS AND HEAT-RESISTANT RESIN MOLDINGS PRODUCED THEREFROM TDK CORP (JP) 2008-12-24 EP disclosed
US-6500535-B1 FINELY DISPERSED CROSSLINKED TERPOLYMER COMPRISING ALPHA-OLEFIN, CONJUGATED DIENE, AND VINYL AROMATIC MONOMERS TDK CORPORATION (JP) 2002-12-31 US disclosed
US-20020190818-A1 High frequency band pass filter TDK CORPORATION (JP) 2002-12-19 US disclosed
US-6420476-B1 MOLECULAR WEIGHT CONTROL FOR HEAT RESISTANT LOW DIELECTRIC POLYMER TDK CORPORATION (JP) 2002-07-16 US disclosed
EP-0991082-A1 COMPOSITE DIELECTRIC MATERIAL COMPOSITION, AND FILM, SUBSTRATE, ELECTRONIC PARTS AND MOLDINGS THEREFROM TDK Corporation (JP) 2000-04-05 EP disclosed
EP-0953608-A1 HEAT-RESISTANT, LOWLY DIELECTRIC HIGH-MOLECULAR MATERIAL, AND FILMS, SUBSTRATES, ELECTRIC COMPONENTS AND HEAT-RESISTANT RESIN MOLDINGS PRODUCED THEREFROM TDK Corporation (JP) 1999-11-03 EP disclosed
EP-0295821-B1 Method for production of graft resin composition NIPPON OILS & FATS CO LTD (JP) 1994-01-05 EP disclosed
EP-0412572-A2 Thermoplastic resin composition and method for preparing the same NIPPON PETROCHEMICALS CO., LTD. (JP) 1991-02-13 EP disclosed
US-4839423-A USING A UNSATURATED ORGANIC PEROXY FREE RADICAL CATALYSY NIPPON OIL & FATS CO., LTD. (JP) 1989-06-13 US disclosed
EP-0295821-A2 Method for production of graft resin composition NIPPON OIL AND FATS COMPANY, LIMITED (JP) 1988-12-21 EP disclosed
EP-0178141-B1 PEROXYCARBONATE GROUP-CONTAINING COPOLYMER AND METHOD FOR MANUFACTURE THEREOF NIPPON OIL AND FATS COMPANY, LIMITED (JP) 1987-12-23 EP disclosed
US-4658001-A STORAGE STABLE RANDOM COPOLYMERS WITH ANOTHER UNSATURATED COMPOUND NIPPON OILS & FATS CO., LTD. (JP) 1987-04-14 US disclosed
EP-0178141-A1 Peroxycarbonate group-containing copolymer and method for manufacture thereof NIPPON OIL AND FATS COMPANY, LIMITED (JP) 1986-04-16 EP disclosed