SCHEMBL3384466

SCHEMBL3384466

C=CC(=O)OOC(C)OC(C)OC(=O)OC(C)(C)CC(C)(C)C

nearest known ligand 0.31

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3382405 0.93 TSHR (0.33) TSHR
SCHEMBL9420431 0.88 THRB (0.33) TSHR
SCHEMBL9420423 0.85 TSHR (0.32) TSHR
SCHEMBL3382997 0.82 TSHR (0.31) TSHR
SCHEMBL3384550 0.81 TSHR (0.37) TSHR
SCHEMBL3382091 0.81 TSHR (0.34) TSHR
SCHEMBL10716556 0.81 THRB (0.31) TSHR
SCHEMBL1795077 0.77 TSHR (0.34) TSHR
SCHEMBL10482061 0.76 TSHR (0.31) TSHR
SCHEMBL3381267 0.74 TSHR (0.33) TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0991082-B1 COMPOSITE DIELECTRIC MATERIAL COMPOSITION, AND FILM, SUBSTRATE, ELECTRONIC PARTS AND MOLDINGS THEREFROM TDK CORP (JP) 2010-11-24 EP disclosed
EP-0953608-B1 HEAT-RESISTANT, LOWLY DIELECTRIC HIGH-MOLECULAR MATERIAL, AND FILMS, SUBSTRATES, ELECTRIC COMPONENTS AND HEAT-RESISTANT RESIN MOLDINGS PRODUCED THEREFROM TDK CORP (JP) 2008-12-24 EP disclosed
US-6500535-B1 FINELY DISPERSED CROSSLINKED TERPOLYMER COMPRISING ALPHA-OLEFIN, CONJUGATED DIENE, AND VINYL AROMATIC MONOMERS TDK CORPORATION (JP) 2002-12-31 US disclosed
US-20020190818-A1 High frequency band pass filter TDK CORPORATION (JP) 2002-12-19 US disclosed
US-6420476-B1 MOLECULAR WEIGHT CONTROL FOR HEAT RESISTANT LOW DIELECTRIC POLYMER TDK CORPORATION (JP) 2002-07-16 US disclosed
EP-0991082-A1 COMPOSITE DIELECTRIC MATERIAL COMPOSITION, AND FILM, SUBSTRATE, ELECTRONIC PARTS AND MOLDINGS THEREFROM TDK Corporation (JP) 2000-04-05 EP disclosed
EP-0953608-A1 HEAT-RESISTANT, LOWLY DIELECTRIC HIGH-MOLECULAR MATERIAL, AND FILMS, SUBSTRATES, ELECTRIC COMPONENTS AND HEAT-RESISTANT RESIN MOLDINGS PRODUCED THEREFROM TDK Corporation (JP) 1999-11-03 EP disclosed
EP-0295821-B1 Method for production of graft resin composition NIPPON OILS & FATS CO LTD (JP) 1994-01-05 EP disclosed
EP-0368295-A2 Thermoplastic resin composition and method for preparing the same NIPPON PETROCHEMICALS CO., LTD. (JP) 1990-05-16 EP disclosed
EP-0361400-A2 Thermoplastic resin composition NIPPON PETROCHEMICALS COMPANY, LIMITED (JP) 1990-04-04 EP disclosed
US-4839423-A USING A UNSATURATED ORGANIC PEROXY FREE RADICAL CATALYSY NIPPON OIL & FATS CO., LTD. (JP) 1989-06-13 US disclosed
EP-0314188-A2 Thermoplastic resin composition and method for preparing the same NIPPON PETROCHEMICALS CO., LTD. (JP) 1989-05-03 EP disclosed