SCHEMBL3387263

SCHEMBL3387263

O=C(O)c1cc(O)c(O)c2ccccc12

nearest known ligand 0.71

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
THRB P10828 1/20 0.71
HSD17B10 Q99714 3/20 0.66
HPGD P15428 3/20 0.66
CYP2C9 P11712 2/20 0.66
TSHR P16473 1/20 0.66
ALOX12 P18054 1/20 0.66
ATIC P31939 1/20 0.66
KDM4E B2RXH2 4/20 0.56
MEN1 O00255 3/20 0.56
KMT2A Q03164 3/20 0.56
ALDH1A1 P00352 3/20 0.56
MAPT P10636 2/20 0.56
PKM P14618 1/20 0.56
HTT P42858 1/20 0.56
HMGB1 P09429 2/20 0.55
CXCL12 P48061 1/20 0.55
MCL1 Q07820 4/20 0.54
POLB P06746 2/20 0.53
NSD2 O96028 1/20 0.53
LDHA P00338 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5539615 0.85 HSD17B10 (0.88) THRBHSD17B10HPGDCYP2C9TSHR
SCHEMBL9618746 0.83 HSD17B10 (0.66) THRBHSD17B10HPGDCYP2C9TSHR
SCHEMBL317180 0.83 THRB (1.00) THRBHSD17B10HPGDCYP2C9TSHR
SCHEMBL6742045 0.82 THRB (0.55) THRBHSD17B10HPGDCYP2C9TSHR
SCHEMBL27571871 0.82 THRB (0.58) THRBHSD17B10HPGDCYP2C9TSHR
Hydrochloric Acid SCHEMBL7535914 0.80 THRB (0.56) THRBHSD17B10HPGDCYP2C9TSHR
SCHEMBL6824726 0.80 THRB (0.56) THRBHSD17B10HPGDCYP2C9TSHR
SCHEMBL6036421 0.80 THRB (0.56) THRBHSD17B10HPGDCYP2C9TSHR
SCHEMBL3914056 0.80 THRB (0.56) THRBHSD17B10HPGDCYP2C9TSHR
SCHEMBL6036418 0.80 HSD17B10 (0.61) THRBHSD17B10HPGDCYP2C9TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 44 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12044969-B2 Resist underlayer film-forming composition NISSAN CHEMICAL CORPORATION (JP) 2024-07-23 US disclosed
US-12044969-B2 Resist underlayer film-forming composition NISSAN CHEMICAL CORPORATION (JP) 2024-07-23 US disclosed
US-20230296984-A1 EUV RESIST UNDERLAYER FILM-FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2023-09-21 US disclosed
US-20230296984-A1 EUV RESIST UNDERLAYER FILM-FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2023-09-21 US disclosed
US-11693313-B2 Resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2023-07-04 US disclosed
US-20220146939-A1 RESIST UNDERLAYER FILM-FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2022-05-12 US disclosed
US-20220121118-A1 RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2022-04-21 US disclosed
EP-3230339-B1 EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL TORAY INDUSTRIES (JP) 2022-03-23 EP disclosed
US-20210397090-A1 RESIST UNDERLAYER FILM-FORMING COMPOSITION AND METHOD FOR FORMING RESIST PATTERN USING THE SAME NISSAN CHEMICAL CORPORATION (JP) 2021-12-23 US disclosed
US-20210311396-A1 RESIST UNDERLAYER FILM-FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2021-10-07 US disclosed
EP-2489689-A1 COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF Nippon Soda Co., Ltd. (JP) 2012-08-22 EP disclosed
US-20120196991-A1 COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF NISSO CHEMICAL ANALYSIS SERVICE CO., LTD. (JP) 2012-08-02 US disclosed
US-20120105549-A1 AQUEOUS INKJET PRINTING FLUID COMPOSITIONS QUALEX INC. 2012-05-03 US disclosed
US-20120105549-A1 AQUEOUS INKJET PRINTING FLUID COMPOSITIONS QUALEX INC. 2012-05-03 US disclosed
CN-101802049-A Epoxy resin composition for semiconductor encapsulation containing inclusion complex NIPPON SODA CO 2010-08-11 CN disclosed
US-20100179250-A1 INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION NIPPON SODA CO., LTD. (JP) 2010-07-15 US disclosed
EP-2192139-A1 INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION Nippon Soda Co., Ltd. (JP) 2010-06-02 EP disclosed
US-3985797-A Hydroxylation of aromatic compounds UOP INC. (US) 1976-10-12 US disclosed
US-3985796-A Hydroxylation of aromatic compounds UOP INC. (US) 1976-10-12 US disclosed
US-3931295-A Hydroxylation of aromatic compounds UNIVERSAL OIL PRODUCTS COMPANY (US) 1976-01-06 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11693313-B2 Resist composition and method of forming resist pattern C1R, C1S, C9 THRB 1707/4885HSD17B10 413/4885HPGD 3017/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.