Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.42 |
| ▸ | TP53 | P04637 | 1/20 | 0.42 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.42 |
| ▸ | MGLL | Q99685 | 4/20 | 0.35 |
| ▸ | TSHR | P16473 | 1/20 | 0.33 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8138079 | 0.94 | ALDH1A1 (0.47) | ALDH1A1TP53CYP3A4MGLLTSHR | |
| SCHEMBL9770281 | 0.79 | ALDH1A1 (0.46) | ALDH1A1TP53CYP3A4MGLLTSHR | |
| SCHEMBL1375231 | 0.78 | TP53 (0.45) | ALDH1A1TP53CYP3A4MGLL | |
| SCHEMBL30142954 | 0.76 | SMN1; SMN2 (0.41) | ALDH1A1 | |
| SCHEMBL11529622 | 0.76 | ALDH1A1 (0.46) | ALDH1A1TP53CYP3A4MGLLTSHR | |
| SCHEMBL28949251 | 0.75 | TP53 (0.49) | ALDH1A1TP53CYP3A4MGLLTSHR | |
| SCHEMBL471872 | 0.75 | TP53 (0.49) | ALDH1A1TP53CYP3A4MGLLTSHR | |
| SCHEMBL30575200 | 0.74 | TP53 (0.45) | ALDH1A1TP53CYP3A4MGLL | |
| SCHEMBL15259657 | 0.73 | TP53 (0.50) | ALDH1A1TP53CYP3A4MGLLTSHR | |
| SCHEMBL28672803 | 0.72 | TP53 (0.46) | ALDH1A1TP53CYP3A4MGLLTSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8653160-B2 | Inclusion complex containing epoxy resin composition for semiconductor encapsulation | NIPPON SODA CO., LTD. (JP) | 2014-02-18 | — | — | US | disclosed |
| US-20100179250-A1 | INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION | NIPPON SODA CO., LTD. (JP) | 2010-07-15 | — | — | US | disclosed |
| EP-2192139-A1 | INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION | Nippon Soda Co., Ltd. (JP) | 2010-06-02 | — | — | EP | disclosed |