SCHEMBL3387947

SCHEMBL3387947

O=C(O)c1cccc2cc(O)cc(O)c12

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HSD17B10 Q99714 2/20 0.53
CDC25B P30305 2/20 0.50
GRIN2D O15399 1/20 0.47
GRIN2A Q12879 1/20 0.47
GRIN2B Q13224 1/20 0.47
GRIN2C Q14957 1/20 0.47
ALDH1A1 P00352 5/20 0.47
CA12 O43570 4/20 0.47
CA1 P00915 4/20 0.47
CA2 P00918 4/20 0.47
CA9 Q16790 4/20 0.47
CA7 P43166 3/20 0.47
CA14 Q9ULX7 3/20 0.47
TSHR P16473 2/20 0.47
NR4A1 P22736 1/20 0.46
NR4A2 P43354 1/20 0.46
NR4A3 Q92570 1/20 0.46
CA6 P23280 2/20 0.45
KDM4E B2RXH2 2/20 0.45
HMGB1 P09429 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2185926 0.87 CDC25B (0.56) HSD17B10CDC25BGRIN2DGRIN2AGRIN2B
SCHEMBL3390578 0.85 GRIN2D (0.51) HSD17B10CDC25BGRIN2DGRIN2AGRIN2B
SCHEMBL24895108 0.82 HSD17B10 (0.50) HSD17B10GRIN2DGRIN2AGRIN2BGRIN2C
SCHEMBL24895095 0.82 CDC25B (0.54) HSD17B10CDC25BALDH1A1CA12CA1
SCHEMBL689259 0.80 HSD17B10 (0.67) HSD17B10CDC25BGRIN2DGRIN2AGRIN2B
SCHEMBL29940636 0.80 HSD17B10 (0.67) HSD17B10CDC25BGRIN2DGRIN2AGRIN2B
SCHEMBL28860271 0.79 HSD17B10 (0.64) HSD17B10CDC25BGRIN2DGRIN2AGRIN2B
SCHEMBL28221447 0.79 HSD17B10 (0.64) HSD17B10CDC25BGRIN2DGRIN2AGRIN2B
SCHEMBL24895099 0.78 HSD17B10 (0.46) HSD17B10GRIN2DGRIN2AGRIN2BGRIN2C
SCHEMBL29105420 0.78 CDC25B (0.48) HSD17B10CDC25BGRIN2DGRIN2AGRIN2B

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230296984-A1 EUV RESIST UNDERLAYER FILM-FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2023-09-21 US disclosed
US-20230296984-A1 EUV RESIST UNDERLAYER FILM-FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2023-09-21 US disclosed
EP-3230339-B1 EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL TORAY INDUSTRIES (JP) 2022-03-23 EP disclosed
US-20210397090-A1 RESIST UNDERLAYER FILM-FORMING COMPOSITION AND METHOD FOR FORMING RESIST PATTERN USING THE SAME NISSAN CHEMICAL CORPORATION (JP) 2021-12-23 US disclosed
CN-107001594-B Composition epoxy resin, prepreg, the manufacturing method of fiber reinforced plastic materials and fiber reinforced plastic materials 东丽株式会社 2019-07-23 CN disclosed
US-20170362376-A1 EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL TORAY INDUSTRIES, INC. (JP) 2017-12-21 US disclosed
EP-3230339-A1 EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL Toray Industries, Inc. (JP) 2017-10-18 EP disclosed
CN-107001594-A Composition epoxy resin, prepreg, the manufacture method of fiber reinforced plastic materials and fiber reinforced plastic materials 东丽株式会社 2017-08-01 CN disclosed
WO-2016087935-A1 EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL TORAY INDUSTRIES, INC. (JP) 2016-06-09 WO disclosed
CN-102725273-B Inclusion compound and manufacture method thereof NIPPON SODA CO.,LTD. (JP) 2016-02-17 CN disclosed
CN-102574988-B Composition for formation of cured epoxy resin, and cured products thereof NIPPON SODA CO 2014-05-14 CN disclosed
US-8653160-B2 Inclusion complex containing epoxy resin composition for semiconductor encapsulation NIPPON SODA CO., LTD. (JP) 2014-02-18 US disclosed
EP-2573148-A1 CURABLE POWDER COATING COMPOSITION, AND CURED PRODUCT OF SAME Nippon Soda Co., Ltd. (JP) 2013-03-27 EP disclosed
US-20130059942-A1 CURABLE POWDER COATING COMPOSITION, AND CURED PRODUCT OF SAME NIPPON SODA CO., LTD. (JP) 2013-03-07 US disclosed
CN-102892849-A Curable powder coating composition and cured product thereof NIPPON SODA CO 2013-01-23 CN disclosed
EP-2489689-A1 COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF Nippon Soda Co., Ltd. (JP) 2012-08-22 EP disclosed
US-20120196991-A1 COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF NISSO CHEMICAL ANALYSIS SERVICE CO., LTD. (JP) 2012-08-02 US disclosed
CN-101802049-A Epoxy resin composition for semiconductor encapsulation containing inclusion complex NIPPON SODA CO 2010-08-11 CN disclosed
US-20100179250-A1 INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION NIPPON SODA CO., LTD. (JP) 2010-07-15 US disclosed
EP-2192139-A1 INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION Nippon Soda Co., Ltd. (JP) 2010-06-02 EP disclosed