SCHEMBL3390578

SCHEMBL3390578

O=C(O)c1cc(O)cc2cccc(O)c12

nearest known ligand 0.51

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GRIN2D O15399 1/20 0.51
GRIN2A Q12879 1/20 0.51
GRIN2B Q13224 1/20 0.51
GRIN2C Q14957 1/20 0.51
CDC25B P30305 2/20 0.50
ALDH1A1 P00352 4/20 0.48
MEN1 O00255 2/20 0.48
KMT2A Q03164 2/20 0.48
DNMT1 P26358 1/20 0.48
CACNA1B Q00975 1/20 0.48
APBA1 Q02410 1/20 0.48
MCL1 Q07820 1/20 0.48
APOBEC3G Q9HC16 1/20 0.48
MAOA P21397 2/20 0.47
CA12 O43570 5/20 0.47
CA1 P00915 5/20 0.47
CA2 P00918 5/20 0.47
CA9 Q16790 5/20 0.47
CA7 P43166 4/20 0.47
CA14 Q9ULX7 4/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2185926 0.87 CDC25B (0.56) GRIN2DGRIN2AGRIN2BGRIN2CCDC25B
SCHEMBL3387947 0.85 HSD17B10 (0.53) GRIN2DGRIN2AGRIN2BGRIN2CCDC25B
SCHEMBL23409342 0.82 CDC25B (0.47) GRIN2DGRIN2AGRIN2BGRIN2CCDC25B
SCHEMBL30118104 0.82 CDC25B (0.47) GRIN2DGRIN2AGRIN2BGRIN2CCDC25B
SCHEMBL28038339 0.81 ALDH1A1 (0.44) GRIN2DGRIN2AGRIN2BGRIN2CCDC25B
SCHEMBL29940636 0.80 HSD17B10 (0.67) GRIN2DGRIN2AGRIN2BGRIN2CCDC25B
SCHEMBL689259 0.80 HSD17B10 (0.67) GRIN2DGRIN2AGRIN2BGRIN2CCDC25B
SCHEMBL28860271 0.79 HSD17B10 (0.64) GRIN2DGRIN2AGRIN2BGRIN2CCDC25B
SCHEMBL28221447 0.79 HSD17B10 (0.64) GRIN2DGRIN2AGRIN2BGRIN2CCDC25B
SCHEMBL25366396 0.77 CDC25B (0.47) CDC25BALDH1A1MEN1KMT2ACA12

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3230339-B1 EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL TORAY INDUSTRIES (JP) 2022-03-23 EP disclosed
CN-107001594-B Composition epoxy resin, prepreg, the manufacturing method of fiber reinforced plastic materials and fiber reinforced plastic materials 东丽株式会社 2019-07-23 CN disclosed
US-20170362376-A1 EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL TORAY INDUSTRIES, INC. (JP) 2017-12-21 US disclosed
EP-3230339-A1 EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL Toray Industries, Inc. (JP) 2017-10-18 EP disclosed
CN-107001594-A Composition epoxy resin, prepreg, the manufacture method of fiber reinforced plastic materials and fiber reinforced plastic materials 东丽株式会社 2017-08-01 CN disclosed
WO-2016087935-A1 EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL TORAY INDUSTRIES, INC. (JP) 2016-06-09 WO disclosed
CN-102725273-B Inclusion compound and manufacture method thereof NIPPON SODA CO.,LTD. (JP) 2016-02-17 CN disclosed
CN-102892849-B curable powder coating composition and cured product thereof NIPPON SODA CO.,LTD. (JP) 2016-01-20 CN disclosed
US-9068074-B2 Composition for formation of cured epoxy resin, and cured products thereof NIPPON SODA CO., LTD. (JP) 2015-06-30 US disclosed
CN-102574988-B Composition for formation of cured epoxy resin, and cured products thereof NIPPON SODA CO 2014-05-14 CN disclosed
EP-2573148-A1 CURABLE POWDER COATING COMPOSITION, AND CURED PRODUCT OF SAME Nippon Soda Co., Ltd. (JP) 2013-03-27 EP disclosed
US-20130059942-A1 CURABLE POWDER COATING COMPOSITION, AND CURED PRODUCT OF SAME NIPPON SODA CO., LTD. (JP) 2013-03-07 US disclosed
CN-102892849-A Curable powder coating composition and cured product thereof NIPPON SODA CO 2013-01-23 CN disclosed
CN-102725273-A Clathrate and method for producing same NIPPON SODA CO 2012-10-10 CN disclosed
CN-101802049-B Epoxy resin composition for semiconductor encapsulation containing inclusion complex NIPPON SODA CO 2012-09-12 CN disclosed
EP-2489689-A1 COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF Nippon Soda Co., Ltd. (JP) 2012-08-22 EP disclosed
US-20120196991-A1 COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF NISSO CHEMICAL ANALYSIS SERVICE CO., LTD. (JP) 2012-08-02 US disclosed
CN-101802049-A Epoxy resin composition for semiconductor encapsulation containing inclusion complex NIPPON SODA CO 2010-08-11 CN disclosed
US-20100179250-A1 INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION NIPPON SODA CO., LTD. (JP) 2010-07-15 US disclosed
EP-2192139-A1 INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION Nippon Soda Co., Ltd. (JP) 2010-06-02 EP disclosed