SCHEMBL3388489

SCHEMBL3388489

O=C(O)c1ccc(O)c2ccc(O)cc12

nearest known ligand 0.61

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.61
CA1 P00915 3/20 0.61
CA2 P00918 3/20 0.61
CA12 O43570 2/20 0.61
CA7 P43166 2/20 0.61
CA9 Q16790 2/20 0.61
CA14 Q9ULX7 2/20 0.61
PTGS2 P35354 2/20 0.61
ALOX5 P09917 1/20 0.61
TSHR P16473 1/20 0.61
LCK P06239 5/20 0.55
CES2 O00748 1/20 0.47
SELL P14151 1/20 0.47
SELP P16109 1/20 0.47
MEN1 O00255 3/20 0.46
KMT2A Q03164 3/20 0.46
KDR P35968 2/20 0.46
PDE4A P27815 1/20 0.46
BLVRB P30043 1/20 0.46
HTT P42858 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14736946 0.92 CA1 (0.61) ALDH1A1CA1CA2CA12CA7
SCHEMBL6410064 0.81 CA12 (0.52) ALDH1A1CA1CA2CA12CA7
SCHEMBL7783966 0.78 IDO1 (0.50) ALDH1A1CA1CA2CA12CA7
SCHEMBL678559 0.77 IDO1 (0.59) ALDH1A1CA1CA2CA12CA7
SCHEMBL29497936 0.77 IDO1 (0.59) ALDH1A1CA1CA2CA12CA7
Gentisic Acid SCHEMBL3690 0.76 CA1 (1.00) ALDH1A1CA1CA2CA12CA7
Gentisic Acid SCHEMBL2053863 0.76 CA1 (1.00) ALDH1A1CA1CA2CA12CA7
2,4-Dihydroxybenzoic Acid SCHEMBL28080 0.76 CA12 (1.00) ALDH1A1CA1CA2CA12CA7
Gentisic Acid SCHEMBL29349919 0.76 CA1 (1.00) ALDH1A1CA1CA2CA12CA7
2,4-Dihydroxybenzoic Acid SCHEMBL29573604 0.76 CA12 (1.00) ALDH1A1CA1CA2CA12CA7

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230296984-A1 EUV RESIST UNDERLAYER FILM-FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2023-09-21 US disclosed
US-20230296984-A1 EUV RESIST UNDERLAYER FILM-FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2023-09-21 US disclosed
EP-3230339-B1 EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL TORAY INDUSTRIES (JP) 2022-03-23 EP disclosed
US-20210397090-A1 RESIST UNDERLAYER FILM-FORMING COMPOSITION AND METHOD FOR FORMING RESIST PATTERN USING THE SAME NISSAN CHEMICAL CORPORATION (JP) 2021-12-23 US disclosed
CN-107001594-B Composition epoxy resin, prepreg, the manufacturing method of fiber reinforced plastic materials and fiber reinforced plastic materials 东丽株式会社 2019-07-23 CN disclosed
US-20170362376-A1 EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL TORAY INDUSTRIES, INC. (JP) 2017-12-21 US disclosed
EP-3230339-A1 EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL Toray Industries, Inc. (JP) 2017-10-18 EP disclosed
CN-107001594-A Composition epoxy resin, prepreg, the manufacture method of fiber reinforced plastic materials and fiber reinforced plastic materials 东丽株式会社 2017-08-01 CN disclosed
WO-2016087935-A1 EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL TORAY INDUSTRIES, INC. (JP) 2016-06-09 WO disclosed
CN-102725273-B Inclusion compound and manufacture method thereof NIPPON SODA CO.,LTD. (JP) 2016-02-17 CN disclosed
EP-2573148-A1 CURABLE POWDER COATING COMPOSITION, AND CURED PRODUCT OF SAME Nippon Soda Co., Ltd. (JP) 2013-03-27 EP disclosed
US-20130059942-A1 CURABLE POWDER COATING COMPOSITION, AND CURED PRODUCT OF SAME NIPPON SODA CO., LTD. (JP) 2013-03-07 US disclosed
CN-102892849-A Curable powder coating composition and cured product thereof NIPPON SODA CO 2013-01-23 CN disclosed
CN-102725273-A Clathrate and method for producing same NIPPON SODA CO 2012-10-10 CN disclosed
CN-101802049-B Epoxy resin composition for semiconductor encapsulation containing inclusion complex NIPPON SODA CO 2012-09-12 CN disclosed
EP-2489689-A1 COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF Nippon Soda Co., Ltd. (JP) 2012-08-22 EP disclosed
US-20120196991-A1 COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF NISSO CHEMICAL ANALYSIS SERVICE CO., LTD. (JP) 2012-08-02 US disclosed
CN-101802049-A Epoxy resin composition for semiconductor encapsulation containing inclusion complex NIPPON SODA CO 2010-08-11 CN disclosed
US-20100179250-A1 INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION NIPPON SODA CO., LTD. (JP) 2010-07-15 US disclosed
EP-2192139-A1 INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION Nippon Soda Co., Ltd. (JP) 2010-06-02 EP disclosed