SCHEMBL3389967

SCHEMBL3389967

C[Si](C)(C)C[Pt](C)(C)C1=CC=CC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3386787 0.80
SCHEMBL3386786 0.77
SCHEMBL3384872 0.76
SCHEMBL14859278 0.76
SCHEMBL3386853 0.75
SCHEMBL3384752 0.73 CALM1 (0.30)
SCHEMBL3390073 0.73
SCHEMBL3389777 0.72
SCHEMBL21051672 0.71 TP53 (0.32)
SCHEMBL926369 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 107 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023136147-A1 SOLAR CELL MODULE, METHOD FOR PRODUCING SAME, AND SOLAR CELL SEALING MATERIAL 信越化学工業株式会社 2023-07-20 WO claimed
US-11214651-B2 Thermally conductive silicone composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2022-01-04 US claimed
US-20210324148-A1 THERMALLY CONDUCTIVE SILICONE COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-21 US claimed
EP-3156456-B1 ONE-PART ADDITION-CURING HEAT-CONDUCTIVE SILICONE GREASE COMPOSITION SHINETSU CHEMICAL CO (JP) 2021-01-20 EP claimed
EP-3199591-B1 UV-THICKENING THERMALLY CONDUCTIVE SILICONE GREASE COMPOSITION SHINETSU CHEMICAL CO (JP) 2020-04-29 EP claimed
US-20190085167-A1 ONE-LIQUID-TYPE THERMOSETTING HEAT-CONDUCTIVE SILICONE GREASE COMPOSITION, AND METHOD FOR PRODUCING CURED PRODUCT THEREOF SHIN-ETSU CHEMICAL CO., LTD. (JP) 2019-03-21 US claimed
EP-3431553-A1 ONE-LIQUID-TYPE THERMOSETTING HEAT-CONDUCTIVE SILICONE GREASE COMPOSITION, AND METHOD FOR PRODUCING CURED PRODUCT THEREOF Shin-Etsu Chemical Co., Ltd. (JP) 2019-01-23 EP claimed
US-10030184-B2 Addition one part curing type heat-conductive silicone grease composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-07-24 US claimed
US-9851668-B2 Fixing member, fixing device, and image forming apparatus FUJI XEROX CO., LTD. (JP) 2017-12-26 US claimed
US-20170313924-A1 ULTRAVIOLET-THICKENABLE THERMALLY CONDUCTIVE SILICONE GREASE COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-11-02 US claimed
US-20160230005-A1 ULTRAVIOLET-RAY-CURABLE ORGANOPOLYSILOXANE COMPOSITION, AND METHOD FOR PRODUCING PRINTING MATERIAL SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-08-11 US claimed
US-9365757-B2 UV-curable adhesive organopolysiloxane composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-06-14 US claimed
US-20150124338-A1 UV-CURABLE ADHESIVE ORGANOPOLYSILOXANE COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-05-07 US claimed
US-8952077-B2 Silicone rubber composition, silicone rubber molded article, and production method thereof SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-02-10 US claimed
US-20140135416-A1 SILICONE RUBBER COMPOSITION, SILICONE RUBBER MOLDED ARTICLE, AND PRODUCTION METHOD THEREOF SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-05-15 US claimed
EP-2584003-A1 Method for Curing Addition Curable Organopolysiloxane Composition Shin-Etsu Chemical Co., Ltd. (JP) 2013-04-24 EP claimed
US-20130096223-A1 METHOD FOR CURING ADDITION CURABLE ORGANOPOLYSILOXANE COMPOSITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2013-04-18 US claimed
EP-1050539-B1 Irradiation-curable silicone compositions containing photo-active platinum (IV) compounds GEN ELECTRIC (US) 2007-11-14 EP claimed
EP-1050539-A2 Irradiation-curable silicone compositions containing photo-active platinum (IV) compounds GENERAL ELECTRIC COMPANY (US) 2000-11-08 EP claimed
US-6127446-A CYCLOPENTADIENYLPLATINUM (IV) COMPOUNDS HAVING A TRISUBSTITUTED-SILYL ALIPHATIC GROUP ATTACHED TO PLATINUM BY CARBON-PLATINUM LINKAGES AS HYDROSILYLATION CATALYSTS IN IRRADIATION-CURABLE SILICONES GENERAL ELECTRIC COMPANY (US) 2000-10-03 US claimed