SCHEMBL3390106

SCHEMBL3390106

CC(CCCCCSSCCCCCC(C)S(=O)(=O)O)S(=O)(=O)O

nearest known ligand 0.39

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
TP53 P04637 1/20 0.39
TRPV1 Q8NER1 1/20 0.32
TRPA1 O75762 1/20 0.32
GRIA1 P42261 3/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3393114 0.98 TP53 (0.41) TP53
SCHEMBL3394231 0.91 TP53 (0.38) TP53
SCHEMBL11895963 0.88 TP53 (0.35) TP53
SCHEMBL3391834 0.82 TP53 (0.35) TP53
SCHEMBL28800003 0.80 TP53 (0.34) TP53
SCHEMBL9166850 0.80 TP53 (0.43) TP53TRPV1TRPA1GRIA1
SCHEMBL3393824 0.80 TP53 (0.34) TP53
SCHEMBL8497172 0.78 TP53 (0.63) TP53
SCHEMBL4662306 0.78 TP53 (0.63) TP53
SCHEMBL2053835 0.78 TP53 (0.63) TP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9562299-B2 Copper electroplating solution and copper electroplating apparatus SAMSUNG ELECTRONICS CO., LTD. (KR) 2017-02-07 US disclosed
US-20120193238-A1 Compositions For Plating Copper And Methods Of Forming A Copper Bump Using The Same SAMSUNG ELECTRONICS CO., LTD. (KR) 2012-08-02 US disclosed
US-20100084277-A1 Composition for copper plating and associated methods SAMSUNG ELECTRONICS CO., LTD. (KR) 2010-04-08 US disclosed