Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA12 | O43570 | 4/20 | 0.50 |
| ▸ | CA1 | P00915 | 4/20 | 0.50 |
| ▸ | CA2 | P00918 | 4/20 | 0.50 |
| ▸ | CA9 | Q16790 | 4/20 | 0.50 |
| ▸ | CA7 | P43166 | 3/20 | 0.50 |
| ▸ | CA14 | Q9ULX7 | 3/20 | 0.50 |
| ▸ | CA6 | P23280 | 3/20 | 0.50 |
| ▸ | CA4 | P22748 | 2/20 | 0.50 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.50 |
| ▸ | POLB | P06746 | 1/20 | 0.50 |
| ▸ | GAA | P10253 | 1/20 | 0.50 |
| ▸ | MAPT | P10636 | 1/20 | 0.50 |
| ▸ | PTGS2 | P35354 | 1/20 | 0.50 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.50 |
| ▸ | SLC6A2 | P23975 | 1/20 | 0.49 |
| ▸ | P2RY14 | Q15391 | 1/20 | 0.49 |
| ▸ | PTPN1 | P18031 | 1/20 | 0.49 |
| ▸ | NQO2 | P16083 | 1/20 | 0.48 |
| ▸ | CA3 | P07451 | 1/20 | 0.45 |
| ▸ | TYR | P14679 | 1/20 | 0.45 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27360806 | 0.88 | SLC6A2 (0.59) | CA12CA1CA2CA9CA7 | |
| SCHEMBL3420178 | 0.85 | SLC6A2 (0.56) | CA12CA1CA2CA9CA7 | |
| SCHEMBL3388820 | 0.85 | CA12 (0.50) | CA12CA1CA2CA9CA7 | |
| SCHEMBL10702559 | 0.78 | HTT (0.56) | CA12CA1CA2CA9CA7 | |
| SCHEMBL186327 | 0.77 | PTPN1 (0.68) | CA12CA1CA2CA9CA7 | |
| SCHEMBL31129058 | 0.77 | BCL2L1 (0.51) | CA12CA1CA2CA9CA7 | |
| SCHEMBL677189 | 0.77 | NQO2 (0.62) | CA1CA2CA9CA7CA4 | |
| SCHEMBL31037122 | 0.77 | NQO2 (0.62) | CA1CA2CA9CA7CA4 | |
| Hydrochloric Acid SCHEMBL3917256 | 0.76 | PTPN1 (0.66) | CA12CA1CA2CA9CA7 | |
| SCHEMBL9944055 | 0.75 | MEN1 (0.66) | CA12CA1CA2CA9CA7 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3230339-B1 | EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL | TORAY INDUSTRIES (JP) | 2022-03-23 | — | — | EP | disclosed |
| CN-107001594-B | Composition epoxy resin, prepreg, the manufacturing method of fiber reinforced plastic materials and fiber reinforced plastic materials | 东丽株式会社 | 2019-07-23 | — | — | CN | disclosed |
| US-20170362376-A1 | EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL | TORAY INDUSTRIES, INC. (JP) | 2017-12-21 | — | — | US | disclosed |
| EP-3230339-A1 | EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL | Toray Industries, Inc. (JP) | 2017-10-18 | — | — | EP | disclosed |
| CN-107001594-A | Composition epoxy resin, prepreg, the manufacture method of fiber reinforced plastic materials and fiber reinforced plastic materials | 东丽株式会社 | 2017-08-01 | — | — | CN | disclosed |
| WO-2016087935-A1 | EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL | TORAY INDUSTRIES, INC. (JP) | 2016-06-09 | — | — | WO | disclosed |
| CN-102725273-B | Inclusion compound and manufacture method thereof | NIPPON SODA CO.,LTD. (JP) | 2016-02-17 | — | — | CN | disclosed |
| CN-102892849-B | curable powder coating composition and cured product thereof | NIPPON SODA CO.,LTD. (JP) | 2016-01-20 | — | — | CN | disclosed |
| US-9068074-B2 | Composition for formation of cured epoxy resin, and cured products thereof | NIPPON SODA CO., LTD. (JP) | 2015-06-30 | — | — | US | disclosed |
| CN-102574988-B | Composition for formation of cured epoxy resin, and cured products thereof | NIPPON SODA CO | 2014-05-14 | — | — | CN | disclosed |
| US-8653160-B2 | Inclusion complex containing epoxy resin composition for semiconductor encapsulation | NIPPON SODA CO., LTD. (JP) | 2014-02-18 | — | — | US | disclosed |
| EP-2573148-A1 | CURABLE POWDER COATING COMPOSITION, AND CURED PRODUCT OF SAME | Nippon Soda Co., Ltd. (JP) | 2013-03-27 | — | — | EP | disclosed |
| US-20130059942-A1 | CURABLE POWDER COATING COMPOSITION, AND CURED PRODUCT OF SAME | NIPPON SODA CO., LTD. (JP) | 2013-03-07 | — | — | US | disclosed |
| CN-102725273-A | Clathrate and method for producing same | NIPPON SODA CO | 2012-10-10 | — | — | CN | disclosed |
| CN-101802049-B | Epoxy resin composition for semiconductor encapsulation containing inclusion complex | NIPPON SODA CO | 2012-09-12 | — | — | CN | disclosed |
| EP-2489689-A1 | COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF | Nippon Soda Co., Ltd. (JP) | 2012-08-22 | — | — | EP | disclosed |
| US-20120196991-A1 | COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF | NISSO CHEMICAL ANALYSIS SERVICE CO., LTD. (JP) | 2012-08-02 | — | — | US | disclosed |
| CN-101802049-A | Epoxy resin composition for semiconductor encapsulation containing inclusion complex | NIPPON SODA CO | 2010-08-11 | — | — | CN | disclosed |
| US-20100179250-A1 | INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION | NIPPON SODA CO., LTD. (JP) | 2010-07-15 | — | — | US | disclosed |
| EP-2192139-A1 | INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION | Nippon Soda Co., Ltd. (JP) | 2010-06-02 | — | — | EP | disclosed |