SCHEMBL3420178

SCHEMBL3420178

O=C(O)c1cc(O)c2ccc(O)cc2c1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SLC6A2 P23975 1/20 0.56
P2RY14 Q15391 1/20 0.56
PRMT1 Q99873 1/20 0.50
CA12 O43570 7/20 0.48
CA1 P00915 7/20 0.48
CA2 P00918 7/20 0.48
CA9 Q16790 7/20 0.48
CA7 P43166 6/20 0.48
CA14 Q9ULX7 6/20 0.48
CA6 P23280 4/20 0.48
CA4 P22748 3/20 0.48
KDM4E B2RXH2 2/20 0.48
MAPT P10636 2/20 0.48
CA3 P07451 2/20 0.48
CA5A P35218 2/20 0.48
CA5B Q9Y2D0 2/20 0.48
ALDH1A1 P00352 2/20 0.48
LMNA P02545 1/20 0.48
TP53 P04637 1/20 0.48
SELL P14151 1/20 0.48

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27360806 0.88 SLC6A2 (0.59) SLC6A2P2RY14PRMT1CA12CA1
SCHEMBL1681429 0.85 PRMT1 (0.63) SLC6A2P2RY14PRMT1CA12CA1
SCHEMBL3391281 0.85 CA12 (0.50) SLC6A2P2RY14PRMT1CA12CA1
SCHEMBL10026215 0.83 PTPN1 (0.51) SLC6A2P2RY14CA12CA1CA2
SCHEMBL12193501 0.81 SLC6A2 (0.54) SLC6A2P2RY14PRMT1CA12CA1
SCHEMBL2186294 0.81 SLC6A2 (0.54) SLC6A2P2RY14PRMT1CA12CA1
SCHEMBL4565723 0.81 CASP6 (0.54) SLC6A2P2RY14PRMT1CA12CA1
SCHEMBL163553 0.78 PRMT1 (0.56) SLC6A2P2RY14PRMT1CA12CA1
SCHEMBL21979549 0.78 BCL2L1 (0.67) SLC6A2P2RY14PRMT1CA12CA1
SCHEMBL30514356 0.78 BCL2L1 (0.67) SLC6A2P2RY14PRMT1CA12CA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11693313-B2 Resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2023-07-04 US disclosed
US-11693313-B2 Resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2023-07-04 US disclosed
WO-2023287067-A1 ANTIBACTERIAL COMPOUND 주식회사 엘지화학 2023-01-19 WO disclosed
US-20220121118-A1 RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2022-04-21 US disclosed
EP-3230339-B1 EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL TORAY INDUSTRIES (JP) 2022-03-23 EP disclosed
US-20210149303-A1 RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2021-05-20 US disclosed
US-20210149302-A1 RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2021-05-20 US disclosed
US-20200183275-A1 RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2020-06-11 US disclosed
US-20200183273-A1 RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, AND COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2020-06-11 US disclosed
CN-107001594-B Composition epoxy resin, prepreg, the manufacturing method of fiber reinforced plastic materials and fiber reinforced plastic materials 东丽株式会社 2019-07-23 CN disclosed
US-8653160-B2 Inclusion complex containing epoxy resin composition for semiconductor encapsulation NIPPON SODA CO., LTD. (JP) 2014-02-18 US disclosed
EP-2573148-A1 CURABLE POWDER COATING COMPOSITION, AND CURED PRODUCT OF SAME Nippon Soda Co., Ltd. (JP) 2013-03-27 EP disclosed
US-20130059942-A1 CURABLE POWDER COATING COMPOSITION, AND CURED PRODUCT OF SAME NIPPON SODA CO., LTD. (JP) 2013-03-07 US disclosed
CN-102725273-A Clathrate and method for producing same NIPPON SODA CO 2012-10-10 CN disclosed
CN-101802049-B Epoxy resin composition for semiconductor encapsulation containing inclusion complex NIPPON SODA CO 2012-09-12 CN disclosed
EP-2489689-A1 COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF Nippon Soda Co., Ltd. (JP) 2012-08-22 EP disclosed
US-20120196991-A1 COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF NISSO CHEMICAL ANALYSIS SERVICE CO., LTD. (JP) 2012-08-02 US disclosed
CN-101802049-A Epoxy resin composition for semiconductor encapsulation containing inclusion complex NIPPON SODA CO 2010-08-11 CN disclosed
US-20100179250-A1 INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION NIPPON SODA CO., LTD. (JP) 2010-07-15 US disclosed
EP-2192139-A1 INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION Nippon Soda Co., Ltd. (JP) 2010-06-02 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11693313-B2 Resist composition and method of forming resist pattern C1R, C1S, C9 SLC6A2 4086/4885P2RY14 3128/4885PRMT1 1386/4885
US-20200183273-A1 RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, AND COMPOUND SLC11A2, RPP30, RDX SLC6A2 1400/4885P2RY14 1592/4885PRMT1 379/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.