Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3392125 | 0.87 | HDAC3 (0.31) | — | |
| SCHEMBL19154601 | 0.80 | TP53 (0.43) | TP53 | |
| SCHEMBL16370551 | 0.80 | TP53 (0.34) | TP53 | |
| SCHEMBL5072539 | 0.78 | TP53 (0.52) | TP53 | |
| SCHEMBL15357336 | 0.77 | LMNA (0.39) | TP53 | |
| SCHEMBL11503783 | 0.77 | TP53 (0.50) | TP53 | |
| SCHEMBL13186373 | 0.77 | TP53 (0.50) | TP53 | |
| SCHEMBL5468722 | 0.77 | TP53 (0.50) | TP53 | |
| SCHEMBL17703947 | 0.77 | TP53 (0.50) | TP53 | |
| SCHEMBL9187707 | 0.77 | TP53 (0.50) | TP53 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9562299-B2 | Copper electroplating solution and copper electroplating apparatus | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2017-02-07 | — | — | US | disclosed |
| US-20120193238-A1 | Compositions For Plating Copper And Methods Of Forming A Copper Bump Using The Same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2012-08-02 | — | — | US | disclosed |
| US-20100084277-A1 | Composition for copper plating and associated methods | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2010-04-08 | — | — | US | disclosed |