SCHEMBL339221

SCHEMBL339221

[c]1ccccc1/C=C/c1[c]cccc1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5664436 1.00
SCHEMBL191092 0.88 CHAT (0.45)
SCHEMBL191091 0.88 CHAT (0.45)
SCHEMBL331608 0.85
SCHEMBL5504831 0.85
SCHEMBL151711 0.85
SCHEMBL151710 0.85
SCHEMBL4630004 0.84 DHODH (0.36)
SCHEMBL4629976 0.81
SCHEMBL20578746 0.81 ALDH1A1 (0.46)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 76 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-107710443-B Organic thin film, method for producing organic thin film, organic electroluminescent element, display device, lighting device, organic thin film solar cell, thin film transistor, and coating composition 日本放送协会 2019-12-17 CN claimed
US-8889265-B2 Copolymer and polymer light emitting device using the same SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2014-11-18 US claimed
US-7794623-B2 Microelectronic device having liquid crystalline epoxy resins INTEL CORPORATION (US) 2010-09-14 US claimed
US-20080237897-A1 Microelectronic device having liquid crystalline epoxy resins MATAYABAS JAMES CHRISTOPHER 2008-10-02 US claimed
US-7417111-B2 Liquid crystalline epoxy resins INTEL CORPORATION (US) 2008-08-26 US claimed
US-20050224753-A1 melting point that is less than 140 degrees C. and may be liquid crystalline at a temperature greater than 150 degrees C.; include epoxylated trans-stilbenediol and epoxylated 3,3,5,5-tetramethyltrans-stilbenediol INTEL CORPORATION 2005-10-13 US claimed
EP-0684288-B1 Process for the preparation of aminoazo dyes BASF AG (DE) 1997-02-12 EP claimed
US-5175259-A Cotton or polyamide reactive dyes BASF AKTIENGESELLSCHAFT (DE) 1992-12-29 US claimed
US-20240118615-A1 RESIST COMPOSITION AND PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-04-11 US disclosed
US-20240118610-A1 RESIST COMPOSITION AND PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-04-11 US disclosed
CN-107340688-B Composition for hard mask 东友精细化工有限公司 2022-05-06 CN disclosed
CN-114051408-A Composition for preventing, ameliorating, or treating cancer 梨花女子大学校产学协力团 2022-02-15 CN disclosed
CN-107710443-B Organic thin film, method for producing organic thin film, organic electroluminescent element, display device, lighting device, organic thin film solar cell, thin film transistor, and coating composition 日本放送协会 2019-12-17 CN disclosed
US-9523007-B2 Polymer composition and polymer light emitting device SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2016-12-20 US disclosed
WO-2005052027-A1 CROSSLINKABLE ARYLAMINE COMPOUNDS AND CONJUGATED OLIGOMERS OF POLYMERS BASED THEREON SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2005-06-09 WO disclosed
WO-2005049689-A2 CROSSLINKABLE SUBSTITUTED FLUORENE COMPOUNDS AND CONJUGATED OLIGOMERS OR POLYMERS BASED THEREON SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2005-06-02 WO disclosed
EP-1497360-A1 SOFT CHEMICALLY FOAMED THERMOPLASTIC VULCANIZATE FOR SEALING APPLICATION BY ROBOTIC EXTRUSION Advanced Elastomer Systems, L.P. (US) 2005-01-19 EP disclosed
US-20040180925-A1 Dipeptidylpeptidase-IV inhibitor KYOWA HAKKO KOGYO CO., LTD. (JP) 2004-09-16 US disclosed
WO-2003095538-A1 SOFT CHEMICALLY FOAMED THERMOPLASTIC VULCANIZATE FOR SEALING APPLICATION BY ROBOTIC EXTRUSION ADVANCED ELASTOMER SYSTEMS, L.P. (US) 2003-11-20 WO disclosed
EP-1354882-A1 DIPEPTIDYL PEPTIDASE IV INHIBITOR KYOWA HAKKO KOGYO CO., LTD. (JP) 2003-10-22 EP disclosed