SCHEMBL339422

SCHEMBL339422

CC(=O)O[SiH](C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Methyl Alcohol SCHEMBL3363304 0.97
Ethylene SCHEMBL27524712 0.94
Trimethylammonium SCHEMBL5387477 0.91 ALDH1A1 (0.35)
Dimethylamine SCHEMBL5398096 0.91 ALDH1A1 (0.42)
Methylethylamine SCHEMBL5394829 0.82 ALDH1A1 (0.35)
SCHEMBL5395116 0.80 ALDH1A1 (0.33)
SCHEMBL204297 0.79 ALDH1A1 (0.41)
SCHEMBL2767718 0.79 ALDH1A1 (0.41)
SCHEMBL5441885 0.76 KDM5A (0.35)
SCHEMBL27554009 0.76 ALDH1A1 (0.39)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 214 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113583243-B Polymer electrolyte, preparation method of polymer electrolyte membrane and lithium ion battery 深圳市贝特瑞新能源技术研究院有限公司 2022-07-19 CN claimed
CN-112759766-B High-vinyl-activity fluorosilicone rubber raw rubber and preparation method thereof 新元化学(山东)股份有限公司 2022-07-15 CN claimed
CN-111690139-B Neutralizing agent for synthesizing polyfluorosiloxane and preparation method and application thereof 威海新元化工有限公司 2021-11-09 CN claimed
CN-113583243-A Polymer electrolyte, preparation method of polymer electrolyte membrane and lithium ion battery 深圳市贝特瑞新能源技术研究院有限公司 2021-11-02 CN claimed
CN-107636852-B Method for depositing porous organosilicate glass films for use as resistive random access memories 弗萨姆材料美国有限责任公司 2021-06-25 CN claimed
CN-112759766-A High-vinyl-activity fluorosilicone rubber raw rubber and preparation method thereof 威海新元化工有限公司 2021-05-07 CN claimed
US-10991571-B2 High temperature atomic layer deposition of silicon oxide thin films VERSUM MATERIALS US, LLC (US) 2021-04-27 US claimed
CN-111690139-A Neutralizing agent for synthesizing polyfluorosiloxane and preparation method and application thereof 威海新元化工有限公司 2020-09-22 CN claimed
CN-105845549-B Method and precursor for manufacturing 3D devices 弗萨姆材料美国有限责任公司 2020-03-03 CN claimed
US-20190189431-A1 High Temperature Atomic Layer Deposition of Silicon Oxide Thin Films VERSUM MATERIALS US, LLC (US) 2019-06-20 US claimed
WO-2012052439-A1 PROCESS FOR PREPARING A SILICONE RESIN AND COSMETIC USE OF THE RESIN L'OREAL (FR) 2012-04-26 WO claimed
EP-2261390-A2 Mechanical enhancer additives for low dielectric films AIR PRODUCTS AND CHEMICALS, INC. (US) 2010-12-15 EP claimed
CN-1311097-C Mechanical enhancer additives for low dielectric films AIR PROD & CHEM (US) 2007-04-18 CN claimed
CN-1576390-A Mechanical enhancer additives for low dielectric films AIR PROD & CHEM (US) 2005-02-09 CN claimed
US-20040033445-A1 Method of forming a photoresist pattern and method for patterning a layer using a photoresist SAMSUNG ELECTRONICS CO., LTD. (KR) 2004-02-19 US claimed
EP-1006118-B1 Method for synthesizing organosilicon compounds that contain a group bonded to silicon across the SI-C bond DOW CORNING ASIA LTD (JP) 2003-05-07 EP claimed
EP-1085022-A1 A method of manufacturing an acyloxysilane compound having functional groups bonded to silicon atoms via Si-C- bonds Dow Corning Asia, Ltd. (JP) 2001-03-21 EP claimed
US-6111126-A Method for synthesizing organosilicon compounds that contain a functional group bonded to silicon across the Si-C bond DOW CORNING ASIA, LTD. (JP) 2000-08-29 US claimed
EP-1006118-A2 Method for synthesizing organosilicon compounds that contain a group bonded to silicon across the SI-C bond Dow Corning Asia, Ltd. (JP) 2000-06-07 EP claimed
US-6060620-A Method for manufacturing an acyloxysilane compound having functional groups bonded to silicon atoms via SI--C bonds DOW CORNING ASIA, LTD. (JP) 2000-05-09 US claimed