⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15134994 | 0.73 | — | — | |
| SCHEMBL340734 | 0.70 | — | — | |
| SCHEMBL3684808 | 0.70 | — | — | |
| SCHEMBL17499021 | 0.67 | — | — | |
| SCHEMBL6063944 | 0.65 | — | — | |
| SCHEMBL702325 | 0.65 | — | — | |
| SCHEMBL6062646 | 0.64 | — | — | |
| SCHEMBL29216629 | 0.63 | — | — | |
| SCHEMBL129236 | 0.61 | — | — | |
| SCHEMBL9419069 | 0.60 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2020196786-A1 | MAGNETIC PARTICLES AND TEST AGENT | 積水化学工業株式会社 | 2020-10-01 | — | — | WO | disclosed |
| WO-2020196787-A1 | MAGNETIC PARTICLES AND TEST AGENT | 積水化学工業株式会社 | 2020-10-01 | — | — | WO | disclosed |
| CN-109314320-A | Connection structural bodies, particle and bonding composition containing metallic atom | 积水化学工业株式会社 | 2019-02-05 | — | — | CN | disclosed |
| CN-108699342-A | Composite particle and liquid crystal display device | 积水化学工业株式会社 | 2018-10-23 | — | — | CN | disclosed |
| CN-108700765-A | Light control laminate and resin spacer for light control laminate | 积水化学工业株式会社 | 2018-10-23 | — | — | CN | disclosed |
| US-9994681-B2 | Organopolysiloxane prepolymer and a curable organopolysiloxane composition comprising the same | HENKEL AG & CO. KGAA (DE) | 2018-06-12 | — | — | US | disclosed |
| CN-108139286-A | Semiconductor installation binding agent and semiconductor transducer | 积水化学工业株式会社 | 2018-06-08 | — | — | CN | disclosed |
| CN-108139285-A | Adhesive for mounting semiconductor sensor chip and semiconductor sensor | 积水化学工业株式会社 | 2018-06-08 | — | — | CN | disclosed |
| CN-108138024-A | Particle, connecting material, and connecting structure | 积水化学工业株式会社 | 2018-06-08 | — | — | CN | disclosed |
| CN-107849426-A | Connecting material and connection structural bodies | 积水化学工业株式会社 | 2018-03-27 | — | — | CN | disclosed |
| CN-101855598-A | Positive photosensitive composition, positive permanent resist, and method for producing positive permanent resist | ADEKA CORP | 2010-10-06 | — | — | CN | disclosed |
| CN-101659731-A | Conjugated diene polymer, conjugated diene polymer composition, and method for producing conjugated diene polymer | SUMITOMO CHEMICAL CO | 2010-03-03 | — | — | CN | disclosed |
| US-20090142593-A1 | PRESSURE-SENSITIVE ADHESIVE TAPE | NITTO DENKO CORPORATION (JP) | 2009-06-04 | — | — | US | disclosed |
| EP-2065455-A1 | Pressure-sensitive adhesive tape | NITTO DENKO CORPORATION (JP) | 2009-06-03 | — | — | EP | disclosed |
| US-7282535-B2 | Thermoplastic resin composition | KANEKA CORPORATION (JP) | 2007-10-16 | — | — | US | disclosed |
| US-7015292-B2 | Silicon-containing olefin copolymer, crosslinkable rubber composition thereof, and use thereof | MITSUI CHEMICALS, INC. (JP) | 2006-03-21 | — | — | US | disclosed |
| US-20050038214-A1 | Silicon-containing olefin copolymer, crosslinkable rubber composition thereof, and use thereof | MITSUI CHEMICALS, INC. (JP) | 2005-02-17 | — | — | US | disclosed |
| US-20040147674-A1 | Thermoplastic resin composition | KANEKA CORPORATION (JP) | 2004-07-29 | — | — | US | disclosed |
| EP-1398353-A1 | THERMOPLASTIC RESIN COMPOSITION | Kaneka Corporation (JP) | 2004-03-17 | — | — | EP | disclosed |
| US-4596761-A | Graft polymerized SiO2 lithographic masks | HUGHES AIRCRAFT COMPANY (US) | 1986-06-24 | — | — | US | disclosed |