⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3679770 | 0.81 | — | — | |
| SCHEMBL7633164 | 0.77 | — | — | |
| SCHEMBL6063904 | 0.75 | — | — | |
| SCHEMBL6064167 | 0.71 | — | — | |
| SCHEMBL340030 | 0.70 | — | — | |
| SCHEMBL15226911 | 0.70 | — | — | |
| SCHEMBL705171 | 0.70 | — | — | |
| SCHEMBL28638893 | 0.69 | THRB (0.30) | — | |
| SCHEMBL703192 | 0.69 | — | — | |
| SCHEMBL704925 | 0.69 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114180623-A | Method for preparing massive metal oxide-silicon oxide composite aerogel through click reaction | 滁州学院 | 2022-03-15 | — | — | CN | claimed |
| EP-3909766-B1 | MODIFIED CONJUGATED DIENE POLYMER, MODIFIED CONJUGATED DIENE POLYMER COMPOSITION, MULTILAYER ARTICLE, METHOD FOR PRODUCING MULTILAYER ARTICLE, AND MOLDED ARTICLE | ASAHI CHEMICAL IND (JP) | 2025-05-07 | — | — | EP | disclosed |
| CN-117355632-A | Method for producing planarizing film, material for planarizing film, and planarizing film | 东曹株式会社 | 2024-01-05 | — | — | CN | disclosed |
| CN-116891557-A | Modified conjugated diene polymer, resin composition containing the same, and product | 旭化成株式会社 | 2023-10-17 | — | — | CN | disclosed |
| WO-2022138896-A1 | ALL SOLID STATE BATTERY BINDER USING CONJUGATED DIENE-BASED POLYMER, POSITIVE ELECTRODE LAYER, NEGATIVE ELECTRODE LAYER, AND ELECTROLYTE LAYER USING SAID BINDER, AND ALL SOLID STATE BATTERY INCLUDING SAID BINDER AND SAID LAYERS | 旭化成株式会社 | 2022-06-30 | — | — | WO | disclosed |
| CN-114180623-A | Method for preparing massive metal oxide-silicon oxide composite aerogel through click reaction | 滁州学院 | 2022-03-15 | — | — | CN | disclosed |
| EP-3909766-A1 | MODIFIED CONJUGATED DIENE POLYMER, MODIFIED CONJUGATED DIENE POLYMER COMPOSITION, MULTILAYER ARTICLE, METHOD FOR PRODUCING MULTILAYER ARTICLE, AND MOLDED ARTICLE | Asahi Kasei Kabushiki Kaisha (JP) | 2021-11-17 | — | — | EP | disclosed |
| US-10626229-B2 | Silane-crosslinkable ethylene-propylene copolymer and crosslinked body of the same | FURUKAWA ELECTRIC CO., LTD. (JP) | 2020-04-21 | — | — | US | disclosed |
| US-9994681-B2 | Organopolysiloxane prepolymer and a curable organopolysiloxane composition comprising the same | HENKEL AG & CO. KGAA (DE) | 2018-06-12 | — | — | US | disclosed |
| EP-3245256-A1 | ORGANOPOLYSILOXANE PREPOLYMER AND CURABLE ORGANOPOLYSILOXANE COMPOSITION COMPRISING SAME | Henkel AG & Co. KGaA (DE) | 2017-11-22 | — | — | EP | disclosed |
| US-20110160409-A1 | COMPOSITION FOR THERMOSETTING SILICONE RESIN | NITTO DENKO CORPORATION (JP) | 2011-06-30 | — | — | US | disclosed |
| EP-2338937-A1 | Composition for thermosetting silicone resin | NITTO DENKO CORPORATION (JP) | 2011-06-29 | — | — | EP | disclosed |
| EP-1398353-B1 | THERMOPLASTIC RESIN COMPOSITION | KANEKA CORP (JP) | 2010-10-13 | — | — | EP | disclosed |
| US-20090142593-A1 | PRESSURE-SENSITIVE ADHESIVE TAPE | NITTO DENKO CORPORATION (JP) | 2009-06-04 | — | — | US | disclosed |
| EP-2065455-A1 | Pressure-sensitive adhesive tape | NITTO DENKO CORPORATION (JP) | 2009-06-03 | — | — | EP | disclosed |
| US-7282535-B2 | Thermoplastic resin composition | KANEKA CORPORATION (JP) | 2007-10-16 | — | — | US | disclosed |
| US-7015292-B2 | Silicon-containing olefin copolymer, crosslinkable rubber composition thereof, and use thereof | MITSUI CHEMICALS, INC. (JP) | 2006-03-21 | — | — | US | disclosed |
| US-20050038214-A1 | Silicon-containing olefin copolymer, crosslinkable rubber composition thereof, and use thereof | MITSUI CHEMICALS, INC. (JP) | 2005-02-17 | — | — | US | disclosed |
| US-20040147674-A1 | Thermoplastic resin composition | KANEKA CORPORATION (JP) | 2004-07-29 | — | — | US | disclosed |
| EP-1398353-A1 | THERMOPLASTIC RESIN COMPOSITION | Kaneka Corporation (JP) | 2004-03-17 | — | — | EP | disclosed |