SCHEMBL3402249

SCHEMBL3402249

CCCCn1cc[n+](CCC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)c1

nearest known ligand 0.43

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
FDPS P14324 16/20 0.41
MEN1 O00255 2/20 0.40
HSP90AA1 P07900 2/20 0.40
KMT2A Q03164 2/20 0.40
SMN1; SMN2 Q16637 2/20 0.40
APAF1 O14727 1/20 0.37
NPC1 O15118 1/20 0.37
PLA2G1B P04054 1/20 0.37
MAPT P10636 1/20 0.37
MAPK1 P28482 1/20 0.37
HTT P42858 1/20 0.37
RAB9A P51151 1/20 0.37
NPSR1 Q6W5P4 1/20 0.37
ATG4B Q9Y4P1 1/20 0.37
PON1 P27169 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19475616 0.96 FDPS (0.39) FDPSMEN1HSP90AA1KMT2ASMN1; SMN2
Iodide SCHEMBL3408657 0.94 MEN1 (0.46) FDPSMEN1HSP90AA1KMT2ASMN1; SMN2
SCHEMBL3402245 0.89 MEN1 (0.37) FDPSMEN1HSP90AA1KMT2ASMN1; SMN2
Iodide SCHEMBL3412942 0.87 MEN1 (0.45) FDPSMEN1HSP90AA1KMT2ASMN1; SMN2
Iodide SCHEMBL1703534 0.87 MEN1 (0.45) FDPSMEN1HSP90AA1KMT2ASMN1; SMN2
Iodide SCHEMBL1702988 0.87 MEN1 (0.45) FDPSMEN1HSP90AA1KMT2ASMN1; SMN2
Iodide SCHEMBL1702855 0.87 MEN1 (0.45) FDPSMEN1HSP90AA1KMT2ASMN1; SMN2
SCHEMBL21837196 0.86 MEN1 (0.35) FDPSMEN1HSP90AA1KMT2ASMN1; SMN2
SCHEMBL1219617 0.81
SCHEMBL1219120 0.81 MEN1 (0.43) FDPSMEN1HSP90AA1KMT2ASMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2021153584-A1 EPOXY RESIN COMPOSITION, MOLDING MATERIAL FOR FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED COMPOSITE MATERIAL 東レ株式会社 2021-08-05 WO disclosed
WO-2014203764-A1 OIL DEGRADATION SENSOR AND OIL DEGRADATION DETECTION METHOD 三菱重工業株式会社 (JP) 2014-12-24 WO disclosed
US-20130177719-A1 ADHESIVE COMPOSITION, COATING COMPOSITION, AND PRIMER, INKJET INK, ADHESION METHOD AND LAMINATE USING THE SAME COMPOSITION BASF SE (DE) 2013-07-11 US disclosed
US-20130164548-A1 FLOOR COATING MATERIAL AND FLOORING BASF SE (DE) 2013-06-27 US disclosed
US-8084530-B2 Sealing agent for optical semiconductor element, and optical semiconductor element SEKISUI CHEMICAL CO., LTD. (JP) 2011-12-27 US disclosed
US-20100171414-A1 SEALING AGENT FOR OPTICAL SEMICONDUCTOR ELEMENT, AND OPTICAL SEMICONDUCTOR ELEMENT SEKISUI CHEMICAL CO., LTD. (JP) 2010-07-08 US disclosed
EP-2159242-A1 SEALING AGENT FOR OPTICAL SEMICONDUCTOR ELEMENT, AND OPTICAL SEMICONDUCTOR ELEMENT Sekisui Chemical Co., Ltd. (JP) 2010-03-03 EP disclosed