SCHEMBL3404336

SCHEMBL3404336

C[SiH](C)O[Si]([O])(c1ccccc1)c1ccccc1

nearest known ligand 0.31

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 1/20 0.31
ESR2 Q92731 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL94175 0.76 ESR1 (0.33) ESR1ESR2
SCHEMBL330426 0.76 ESR1 (0.33) ESR1ESR2
SCHEMBL4610928 0.76 ESR1 (0.33) ESR1ESR2
SCHEMBL4795729 0.74 ESR1 (0.37) ESR1ESR2
SCHEMBL297373 0.74 ESR1 (0.37) ESR1ESR2
SCHEMBL9763687 0.74 ESR1 (0.37) ESR1ESR2
SCHEMBL20492835 0.74 ESR1 (0.32) ESR1ESR2
SCHEMBL20493844 0.74 ESR1 (0.32) ESR1ESR2
SCHEMBL10438592 0.73 CA4 (0.38) ESR1ESR2
SCHEMBL94083 0.73 ESR1 (0.31) ESR1ESR2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 75 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118369388-A Water paint 株式会社钟化 2024-07-19 CN disclosed
CN-115362203-B Moisture-curable non-yellowing clear compositions and methods of making the same 迈图高新材料公司 2024-07-16 CN disclosed
US-20240199773-A1 COMPOSITION AND METHOD FOR PRODUCING COMPOSITION KANEKA CORPORATION (JP) 2024-06-20 US disclosed
WO-2024122630-A1 ONE-COMPONENT THERMOSETTING RESIN COMPOSITION AND UTILIZATION THEREOF 株式会社カネカ 2024-06-13 WO disclosed
CN-114364765-B Adhesive and method for producing adhesive 株式会社钟化 2024-04-19 CN disclosed
CN-113330044-B Powder and granule and use thereof 株式会社钟化 2024-04-16 CN disclosed
CN-117881739-A Composition and method for producing composition 株式会社钟化 2024-04-12 CN disclosed
CN-113227249-B Resin composition and use thereof 株式会社钟化 2024-03-15 CN disclosed
US-20240026092-A1 METHOD FOR PRODUCING PURIFIED POLYMER FINE PARTICLES AND METHOD FOR PRODUCING RESIN COMPOSITION KANEKA CORPORATION (JP) 2024-01-25 US disclosed
WO-2024010080-A1 UV-CURABLE PRINTING INK COMPOSITION, AND PRODUCTION METHOD AND CURED COATING FILM OF SAME 株式会社カネカ 2024-01-11 WO disclosed
EP-3006478-B1 CURABLE RESIN COMPOSITION, STRUCTURAL ADHESIVE PRODUCED USING SAME, COATING MATERIAL OR FIBER REINFORCED COMPOSITE MATERIAL, FOAM BODY PRODUCED BY FOAMING SAME, LAMINATED BODY PRODUCED BY CURING SAME, AND CURED PRODUCT THEREOF KANEKA CORP (JP) 2019-09-04 EP disclosed
US-20180371239-A1 CURABLE RESIN COMPOSITION, STRUCTURAL ADHESIVE, COATING MATERIAL OR FIBER REINFORCED COMPOSITE MATERIAL USING THE SAME, FOAM BODY USING THE SAME, LAMINATE USING THE SAME, AND CURED MATERIAL THEREOF KANEKA CORPORATION (JP) 2018-12-27 US disclosed
US-10100195-B2 Curable resin composition, structural adhesive, coating material or fiber reinforced composite material using the same, foam body using the same, laminate using the same, and cured material thereof KANEKA CORPORATION (JP) 2018-10-16 US disclosed
US-20160122539-A1 CURABLE RESIN COMPOSITION, STRUCTURAL ADHESIVE, COATING MATERIAL OR FIBER REINFORCED COMPOSITE MATERIAL USING THE SAME, FOAM BODY USING THE SAME, LAMINATE USING THE SAME, AND CURED MATERIAL THEREOF KANEKA CORPORATION (JP) 2016-05-05 US disclosed
US-20140213729-A1 CURABLE RESIN COMPOSITION CONTAINING POLYMER MICROPARTICLES KANEKA CORPORATION (JP) 2014-07-31 US disclosed
US-8742014-B2 Liquid resin composition and cured product using the liquid resin composition KANEKA CORPORATION (JP) 2014-06-03 US disclosed
EP-2189502-B1 LIQUID RESIN COMPOSITION AND CURED PRODUCT USING THE LIQUID RESIN COMPOSITION KANEKA CORP (JP) 2013-05-15 EP disclosed
US-20100204404-A1 LIQUID RESIN COMPOSITION AND CURED PRODUCT USING THE LIQUID RESIN COMPOSITION KANEKA CORPORATION 2010-08-12 US disclosed
EP-2189502-A1 LIQUID RESIN COMPOSITION AND CURED PRODUCT USING THE LIQUID RESIN COMPOSITION Kaneka Corporation (JP) 2010-05-26 EP disclosed
US-5340866-A Addition of red iron oxide and cerium hydroxide to curable fluoropolymer to improve heat resistance GENERAL ELECTRIC COMPANY (US) 1994-08-23 US disclosed