SCHEMBL3406049

SCHEMBL3406049

F[Si](F)(F)CCCS

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL707573 0.76
SCHEMBL704339 0.76
SCHEMBL704440 0.73
SCHEMBL8974344 0.72
SCHEMBL30945313 0.72
SCHEMBL933155 0.69
SCHEMBL24282406 0.67
SCHEMBL626348 0.67
SCHEMBL22838 0.65 LMNA (0.40)
SCHEMBL5996619 0.65 LMNA (0.40)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2011834-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2012-07-25 EP claimed
US-20230127105-A1 Nonaqueous Electrolytic Solution and Nonaqueous Electrolytic Solution Battery MITSUBISHI CHEMICAL CORPORATION (JP) 2023-04-27 US disclosed
CN-107428891-B Curable composition 施敏打硬株式会社 2021-04-20 CN disclosed
CN-105392845-B Photocurable composition 思美定株式会社 2020-10-20 CN disclosed
EP-3081612-B1 PHOTOCURABLE COMPOSITION HAVING ADHESIVE PROPERTIES CEMEDINE CO LTD (JP) 2018-11-14 EP disclosed
CN-107428891-A Curable composition 施敏打硬株式会社 2017-12-01 CN disclosed
US-9718999-B2 Photocurable composition having adhesive properties CEMEDINE CO., LTD (JP) 2017-08-01 US disclosed
US-20160312089-A1 PHOTOCURABLE COMPOSITION HAVING ADHESIVE PROPERTIES CEMEDINE CO., LTD. (JP) 2016-10-27 US disclosed
EP-3081612-A1 PHOTOCURABLE COMPOSITION HAVING ADHESIVE PROPERTIES Cemedine Co., Ltd. (JP) 2016-10-19 EP disclosed
US-20160152783-A1 PHOTOCURABLE COMPOSITION CEMEDINE CO., LTD. (JP) 2016-06-02 US disclosed
EP-3023462-A1 PHOTOCURABLE COMPOSITION Cemedine Co., Ltd. (JP) 2016-05-25 EP disclosed
EP-2011834-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2012-07-25 EP disclosed
US-7772332-B2 organotin-free catalyst; fluorosilane catalyst and an amine or aminoalkylsiloxane coupler used together for high curing of a polymer with a reactive silicon group; polymer is hydrosilylated polyether, polyisobutylene, or polyacrylate; sealant, adhesive; oil resistance; elasticity KANEKA CORPORATION (JP) 2010-08-10 US disclosed
US-20090069505-A1 CURABLE COMPOSITION KANEKA CORPORATION (JP) 2009-03-12 US disclosed
EP-2011834-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2009-01-07 EP disclosed