SCHEMBL340911

SCHEMBL340911

C=CCCCCCCCCCC[Si](OC)(OC)OC

nearest known ligand 0.46

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.46
LMNA P02545 4/20 0.44
ALDH1A1 P00352 4/20 0.44
LPAR3 Q9UBY5 2/20 0.39
MAPT P10636 3/20 0.35
ABCC4 O15439 1/20 0.35
LPAR2 Q9HBW0 1/20 0.35
TRPA1 O75762 1/20 0.33
TRPV1 Q8NER1 1/20 0.33
USP2 O75604 2/20 0.32
CYP3A4 P08684 2/20 0.32
SMN1; SMN2 Q16637 2/20 0.32
RECQL P46063 1/20 0.32
TDP1 Q9NUW8 1/20 0.32
HPGD P15428 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1229892 1.00 TSHR (0.46) TSHRLMNAALDH1A1LPAR3MAPT
SCHEMBL3091759 1.00 TSHR (0.46) TSHRLMNAALDH1A1LPAR3MAPT
SCHEMBL444717 1.00 TSHR (0.46) TSHRLMNAALDH1A1LPAR3MAPT
SCHEMBL138043 1.00 TSHR (0.46) TSHRLMNAALDH1A1LPAR3MAPT
SCHEMBL1228462 1.00 TSHR (0.46) TSHRLMNAALDH1A1LPAR3MAPT
SCHEMBL6037442 1.00 TSHR (0.46) TSHRLMNAALDH1A1LPAR3MAPT
SCHEMBL630825 1.00 TSHR (0.46) TSHRLMNAALDH1A1LPAR3MAPT
SCHEMBL6037453 1.00 TSHR (0.46) TSHRLMNAALDH1A1LPAR3MAPT
SCHEMBL6037374 1.00 TSHR (0.46) TSHRLMNAALDH1A1LPAR3MAPT
SCHEMBL6037371 1.00 TSHR (0.46) TSHRLMNAALDH1A1LPAR3MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3340253-A1 UV-RESISTANT ELECTRODE ASSEMBLY Solvay SA (BE) 2018-06-27 EP claimed
EP-3340252-A1 ELECTRODE ASSEMBLY Solvay SA (BE) 2018-06-27 EP claimed
CN-107209303-B Far infrared ray reflective film, dispersion for forming far infrared ray reflective film, method for producing far infrared ray reflective film, far infrared ray reflective glass, and window 富士胶片株式会社 2020-07-14 CN disclosed
US-10589494-B2 Far infrared reflective film, dispersion for forming far infrared reflective film, manufacturing method of far infrared reflective film, far infrared reflective glass, and window FUJIFILM CORPORATION (JP) 2020-03-17 US disclosed
EP-3340253-A1 UV-RESISTANT ELECTRODE ASSEMBLY Solvay SA (BE) 2018-06-27 EP disclosed
EP-3340252-A1 ELECTRODE ASSEMBLY Solvay SA (BE) 2018-06-27 EP disclosed
US-20180079917-A1 HEAT INSULATION PAINT FUJIFILM CORPORATION (JP) 2018-03-22 US disclosed
US-20170320302-A1 FAR INFRARED REFLECTIVE FILM, DISPERSION FOR FORMING FAR INFRARED REFLECTIVE FILM, MANUFACTURING METHOD OF FAR INFRARED REFLECTIVE FILM, FAR INFRARED REFLECTIVE GLASS, AND WINDOW FUJIFILM CORPORATION (JP) 2017-11-09 US disclosed
EP-3125323-A1 SOLAR CELL Fujifilm Corporation (JP) 2017-02-01 EP disclosed
US-20170005282-A1 SOLAR CELL FUJIFILM CORPORATION (JP) 2017-01-05 US disclosed
US-8729195-B2 Organosilicon compound, method for producing thereof, and curable silicone composition containing the same DOW CORNING TORAY CO., LTD. (JP) 2014-05-20 US disclosed
EP-2239137-A1 HYDROPHILIC MEMBERS FUJIFILM Corporation (JP) 2010-10-13 EP disclosed
CN-101451050-A Pressure sensitive adhesive tape NITTO DENKO CORP (JP) 2009-06-10 CN disclosed
US-20090142593-A1 PRESSURE-SENSITIVE ADHESIVE TAPE NITTO DENKO CORPORATION (JP) 2009-06-04 US disclosed
EP-2065455-A1 Pressure-sensitive adhesive tape NITTO DENKO CORPORATION (JP) 2009-06-03 EP disclosed
US-20050124747-A1 Coating composition for ink-jet recording medium and ink-jet recording medium DEUTSCHE BANK AG, NEW YORK BRANCH, AS COLLATERAL AGENT 2005-06-09 US disclosed
EP-1470928-A1 COATING COMPOSITION FOR INK-JET RECORDING MEDIUM AND INK-JET RECORDING MEDIUM Clariant International Ltd. (CH) 2004-10-27 EP disclosed
EP-1114734-A1 RESIN COMPOSITION FOR INK-JET RECORDING SHEET AND RECORDING SHEET MADE WITH THE SAME DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) 2001-07-11 EP disclosed
EP-0989162-A1 THERMOPLASTIC RESIN COMPOSITION, WATER-BASED COMPOSITION, HEAT-SENSITIVE PRESSURE-SENSITIVE ADHESIVE, AND HEAT-SENSITIVE SHEET Daicel Chemical Industries, Ltd. (JP) 2000-03-29 EP disclosed
EP-0989168-A1 Water-based coating composition Daicel Chemical Industries, Ltd. (JP) 2000-03-29 EP disclosed