SCHEMBL3412141

SCHEMBL3412141

CCCCCCCCCCCCCCCCCC[Si](F)(F)F

nearest known ligand 0.50

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
TSHR P16473 4/20 0.50
THRB P10828 1/20 0.50
DNM1 Q05193 7/20 0.38
ALDH1A1 P00352 3/20 0.38
LMNA P02545 2/20 0.38
MEN1 O00255 2/20 0.38
KMT2A Q03164 2/20 0.38
HSD17B10 Q99714 1/20 0.38
SLC22A1 O15245 1/20 0.38
EPHX1 P07099 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4808011 1.00 TSHR (0.50) TSHRTHRBDNM1ALDH1A1LMNA
SCHEMBL1681938 1.00 TSHR (0.50) TSHRTHRBDNM1ALDH1A1LMNA
SCHEMBL9990847 1.00 TSHR (0.50) TSHRTHRBDNM1ALDH1A1LMNA
SCHEMBL28230210 1.00 TSHR (0.50) TSHRTHRBDNM1ALDH1A1LMNA
SCHEMBL31555165 1.00 TSHR (0.50) TSHRTHRBDNM1ALDH1A1LMNA
SCHEMBL9990841 1.00 TSHR (0.50) TSHRTHRBDNM1ALDH1A1LMNA
SCHEMBL4809792 0.97
SCHEMBL15091470 0.92 TSHR (0.42) TSHRTHRBDNM1ALDH1A1LMNA
SCHEMBL15091543 0.92 TSHR (0.42) TSHRTHRBDNM1ALDH1A1LMNA
SCHEMBL15091920 0.92 TSHR (0.42) TSHRTHRBDNM1ALDH1A1LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024232632-A1 TRANSITION METAL SUPPORTED CATALYST WITH IMPROVED HYDROGENATION ACTIVITY AND USE THEREOF 한양대학교 산학협력단 2024-11-14 WO claimed
EP-2011834-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2012-07-25 EP claimed
WO-2024232632-A1 TRANSITION METAL SUPPORTED CATALYST WITH IMPROVED HYDROGENATION ACTIVITY AND USE THEREOF 한양대학교 산학협력단 2024-11-14 WO disclosed
CN-109415494-B Two-pack type epoxy resin composition 思美定株式会社 2021-11-09 CN disclosed
CN-107148453-B Photocurable composition 思美定株式会社 2021-08-17 CN disclosed
CN-107428891-B Curable composition 施敏打硬株式会社 2021-04-20 CN disclosed
US-10920068-B2 Two-pack type epoxy resin composition CEMEDINE CO., LTD. (JP) 2021-02-16 US disclosed
CN-108431157-B Bonding method using photocurable adhesive 思美定株式会社 2021-02-05 CN disclosed
EP-3480238-B1 TWO-PACK TYPE EPOXY RESIN COMPOSITION CEMEDINE CO LTD (JP) 2020-12-02 EP disclosed
US-10844251-B2 Pressure-sensitive adhesive CEMEDINE CO., LTD. (JP) 2020-11-24 US disclosed
CN-105392845-B Photocurable composition 思美定株式会社 2020-10-20 CN disclosed
US-20160312089-A1 PHOTOCURABLE COMPOSITION HAVING ADHESIVE PROPERTIES CEMEDINE CO., LTD. (JP) 2016-10-27 US disclosed
EP-3081612-A1 PHOTOCURABLE COMPOSITION HAVING ADHESIVE PROPERTIES Cemedine Co., Ltd. (JP) 2016-10-19 EP disclosed
US-20160152783-A1 PHOTOCURABLE COMPOSITION CEMEDINE CO., LTD. (JP) 2016-06-02 US disclosed
EP-3023462-A1 PHOTOCURABLE COMPOSITION Cemedine Co., Ltd. (JP) 2016-05-25 EP disclosed
EP-2011834-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2012-07-25 EP disclosed
US-20110311860-A1 NONAQUEOUS ELECTROLYTE BATTERY AND NONAQUEOUS ELECTROLYTE SONY CORPORATION (JP) 2011-12-22 US disclosed
US-7772332-B2 organotin-free catalyst; fluorosilane catalyst and an amine or aminoalkylsiloxane coupler used together for high curing of a polymer with a reactive silicon group; polymer is hydrosilylated polyether, polyisobutylene, or polyacrylate; sealant, adhesive; oil resistance; elasticity KANEKA CORPORATION (JP) 2010-08-10 US disclosed
US-20090069505-A1 CURABLE COMPOSITION KANEKA CORPORATION (JP) 2009-03-12 US disclosed
EP-2011834-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2009-01-07 EP disclosed