⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Ammonia Solution, Strong SCHEMBL21904294 | 1.00 | — | — | |
| Ammonia Solution, Strong SCHEMBL1792060 | 0.82 | — | — | |
| Ammonia Solution, Strong SCHEMBL31435101 | 0.82 | — | — | |
| Ammonia Solution, Strong SCHEMBL235036 | 0.82 | — | — | |
| Ammonia Solution, Strong SCHEMBL176834 | 0.82 | — | — | |
| Ammonia Solution, Strong SCHEMBL29896256 | 0.82 | — | — | |
| Ammonia Solution, Strong SCHEMBL887056 | 0.82 | — | — | |
| Ammonia Solution, Strong SCHEMBL907559 | 0.82 | — | — | |
| Ammonia Solution, Strong SCHEMBL3797560 | 0.82 | — | — | |
| SCHEMBL27737745 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9520321-B2 | Integrated circuits and methods for fabricating integrated circuits with self-aligned vias | GlobalFoundries, Inc. (KY) | 2016-12-13 | — | — | US | disclosed |
| US-20160254185-A1 | INTEGRATED CIRCUITS AND METHODS FOR FABRICATING INTEGRATED CIRCUITS WITH SELF-ALIGNED VIAS | GLOBALFOUNDRIES U.S. INC. | 2016-09-01 | — | — | US | disclosed |
| US-9431294-B2 | Methods of producing integrated circuits with an air gap | GlobalFoundries, Inc. (KY) | 2016-08-30 | — | — | US | disclosed |
| US-20160118292-A1 | INTEGRATED CIRCUITS WITH AN AIR GAP AND METHODS OF PRODUCING THE SAME | GLOBALFOUNDRIES U.S. INC. | 2016-04-28 | — | — | US | disclosed |
| US-20150194305-A1 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | KABUSHIKI KAISHA TOSHIBA (JP) | 2015-07-09 | — | — | US | disclosed |
| US-8659064-B2 | Semiconductor barrier layer constructions, and methods of forming semiconductor barrier layer constructions | MICRON TECHNOLOGY, INC. (US) | 2014-02-25 | — | — | US | disclosed |
| US-8211794-B2 | Properties of metallic copper diffusion barriers through silicon surface treatments | TEXAS INSTRUMENTS INCORPORATED (US) | 2012-07-03 | — | — | US | disclosed |
| US-20120012914-A1 | Semiconductor Constructions, and Methods of Forming Semiconductor Constructions | MICRON TECHNOLOGY INC. (US) | 2012-01-19 | — | — | US | disclosed |
| US-7999330-B2 | Dynamic random access memory device and electronic systems | MICRON TECHNOLOGY, INC. (US) | 2011-08-16 | — | — | US | disclosed |
| US-20080290515-A1 | PROPERTIES OF METALLIC COPPER DIFFUSION BARRIERS THROUGH SILICON SURFACE TREATMENTS | TEXAS INSTRUMENTS INCORPORATED | 2008-11-27 | — | — | US | disclosed |
| US-20070117308-A1 | Semiconductor constructions, and methods of forming semiconductor constructions | MICRON TECHNOLOGY, INC. | 2007-05-24 | — | — | US | disclosed |
| US-20060292786-A1 | Semiconductor constructions, and methods of forming semiconductor constructions | MICRON TECHNOLOGY, INC. | 2006-12-28 | — | — | US | disclosed |