⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL16739248 | 0.82 | — | — | |
| SCHEMBL709287 | 0.82 | — | — | |
| Methane SCHEMBL27766930 | 0.71 | — | — | |
| SCHEMBL29538745 | 0.71 | — | — | |
| SCHEMBL139031 | 0.50 | — | — | |
| SCHEMBL33671 | 0.50 | — | — | |
| SCHEMBL582196 | 0.50 | — | — | |
| SCHEMBL34591 | 0.50 | — | — | |
| SCHEMBL11122779 | 0.50 | — | — | |
| SCHEMBL140973 | 0.50 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 574 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-108550564-B | Method for forming conductive interconnection structure, conductive interconnection structure and three-dimensional memory | 长江存储科技有限责任公司 | 2024-06-07 | — | — | CN | claimed |
| WO-2024112167-A1 | ALL-SOLID-STATE SECONDARY BATTERY | 삼성에스디아이주식회사 | 2024-05-30 | — | — | WO | claimed |
| US-20230161087-A1 | OPTICAL FILM, METHOD FOR MANUFACTURING THE SAME, AND BACKLIGHT MODULE | NAN YA PLASTICS CORPORATION (TW) | 2023-05-25 | — | — | US | claimed |
| CN-116148958-A | Optical film, manufacturing method thereof and backlight module | 南亚塑胶工业股份有限公司 | 2023-05-23 | — | — | CN | claimed |
| CN-116068687-A | Optical film, manufacturing method thereof and backlight module | 南亚塑胶工业股份有限公司 | 2023-05-05 | — | — | CN | claimed |
| US-20230140137-A1 | OPTICAL FILM, METHOD FOR MANUFACTURING THE SAME, AND BACKLIGHT MODULE | NAN YA PLASTICS CORPORATION (TW) | 2023-05-04 | — | — | US | claimed |
| CN-115975680-A | Method for preparing hydrogen from medical waste and application thereof | 广东汇江氢能产业工程技术研究有限公司 | 2023-04-18 | — | — | CN | claimed |
| US-20220131138-A1 | MATERIALS AND METHODS FOR COMPONENTS OF ZINC-ION BATTERIES | SHENZHEN INX TECHNOLOGY CO., LTD (CN) | 2022-04-28 | — | — | US | claimed |
| CN-113871372-A | Memory and electronic equipment | 维沃移动通信有限公司 | 2021-12-31 | — | — | CN | claimed |
| US-20210399047-A1 | HETEROJUNCTION THIN FILM DIODE | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2021-12-23 | — | — | US | claimed |
| US-20100236614-A1 | HYBRID PHOTOVOLTAICS BASED ON SEMICONDUCTOR NANOCRYSTALS AND AMORPHOUS SILICON | LOS ALAMOS NATIONAL SECURITY, LLC (US) | 2010-09-23 | — | — | US | claimed |
| US-20060240227-A1 | Nanocrystal coated surfaces | NATIONAL RESEARCH COUNCIL OF CANADA (CA) | 2006-10-26 | — | — | US | claimed |
| WO-2006060660-A2 | GROUP III NITRIDE COATINGS AND METHODS | CORNELL RESEARCH FOUNDATION, INC. (US) | 2006-06-08 | — | — | WO | claimed |
| US-20030205767-A1 | Dual metal gate CMOS devices | SHARP LABORATORIES OF AMERICA, INC. | 2003-11-06 | — | — | US | claimed |
| US-6573134-B2 | Dual metal gate CMOS devices and method for making the same | SHARP LABORATORIES OF AMERICA, INC. | 2003-06-03 | — | — | US | claimed |
| US-20020140036-A1 | Dual metal gate CMOS devices and method for making the same | SHARP LABORATORIES OF AMERICA, INC. | 2002-10-03 | — | — | US | claimed |
| US-5998232-A | Planar technology for producing light-emitting devices | IMPLANT SCIENCES CORPORATION (US) | 1999-12-07 | — | — | US | claimed |
| US-5652551-A | Method for high frequency device operation with high temperature and radiation hard characteristics | THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE ARMY (US) | 1997-07-29 | — | — | US | claimed |
| US-4672016-A | Carrier particles for use in a developer for developing latent electrostatic images comprise organic tin compound, silicone resin and conductive material | RICOH COMPANY, LTD. (JP) | 1987-06-09 | — | — | US | claimed |
| US-RE29009-E | High sensitivity semiconductor strain gauge | BELL & HOWELL COMPANY (US) | 1976-10-26 | — | — | US | claimed |