SCHEMBL345062

SCHEMBL345062

CP(=O)([O-])c1ccc(P(C)(=O)[O-])cc1.[Mg+2]

nearest known ligand 0.43

Known targets — ChEMBL curated mechanism

ATP4AATP4BGABBR1GABBR2HMGCR

The experimentally established mechanism targets of None. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
▸ HPGD P15428 1/20 0.43
▸ ESR1 P03372 1/20 0.37
▸ LMNA P02545 1/20 0.36
▸ TSHR P16473 1/20 0.36
▸ GAA P10253 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL345377 0.94 HPGD (0.43) HPGDESR1LMNATSHRGAA
Zinc Ion SCHEMBL344701 0.94 HPGD (0.43) HPGDESR1LMNATSHRGAA
SCHEMBL345473 0.94 HPGD (0.43) HPGDESR1LMNATSHRGAA
SCHEMBL191537 0.86 ESR1 (0.48) HPGDESR1TSHRGAA
SCHEMBL28610141 0.80 ESR1 (0.48) HPGDESR1TSHRGAA
SCHEMBL190560 0.80 ESR1 (0.48) HPGDESR1TSHRGAA
SCHEMBL28468343 0.80 ESR1 (0.48) HPGDESR1TSHRGAA
Zinc Ion SCHEMBL191600 0.80 ESR1 (0.48) HPGDESR1TSHRGAA
SCHEMBL191017 0.80 ESR1 (0.48) HPGDESR1TSHRGAA
SCHEMBL19895696 0.80 ESR1 (0.48) HPGDESR1TSHRGAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 58 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024150527-A1 MOLDED ARTICLE, PRODUCTION METHOD FOR LASER-MARKED MOLDED ARTICLE, AND LASER MARKING METHOD 旭化成株式会社 2024-07-18 — — WO disclosed
US-20240218162-A1 RESIN COMPOSITION, PELLET AND MOLDED ARTICLE MITSUBISHI CHEMICAL CORPORATION (JP) 2024-07-04 — — US disclosed
WO-2024048976-A1 POLY(ARYLENE ETHER) RESIN COMPOSITION, PREPARATION METHOD THEREFOR, AND MOLDED ARTICLE MANUFACTURED THEREFROM (주) 엘지화학 2024-03-07 — — WO disclosed
US-20230415395-A1 MOLDED ARTICLE, PRODUCTION METHOD FOR LASER-MARKED MOLDED ARTICLE, AND LASER MARKING METHOD ASAHI KASEI KABUSHIKI KAISHA (JP) 2023-12-28 — — US disclosed
US-11851564-B2 Low-halogen flame retardant polyamide compositions resistant to heat aging ASCEND PERFORMANCE MATERIALS OPERATIONS LLC (US) 2023-12-26 — — US disclosed
US-20230374302-A1 THERMOPLASTIC RESIN COMPOSITION, METHOD OF PREPARING THE SAME, AND MOLDED ARTICLE MANUFACTURED USING THE SAME LG CHEM, LTD. (KR) 2023-11-23 — — US disclosed
EP-3009478-B1 POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE PRODUCED THEREFROM KURARAY CO (JP) 2023-11-22 — — EP disclosed
US-20230340252-A1 RESIN COMPOSITION AND ELECTROMAGNETIC WAVE ABSORBER MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2023-10-26 — — US disclosed
US-20230242747-A1 RESIN COMPOSITION, FORMED ARTICLE , ELECTROMAGNETIC WAVE ABSORBER, AND METHOD FOR MEASURING ABSORBANCE OF RESIN COMPOSITION MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2023-08-03 — — US disclosed
WO-2023120460-A1 POLYAMIDE COMPOSITION 株式会社クラレ 2023-06-29 — — WO disclosed
US-20120016077-A1 POLYAMIDE RESIN, POLYAMIDE RESIN COMPOSITION, AND MOLDED ARTICLE COMPRISING SAME TORAY INDUSTRIES INC. (JP) 2012-01-19 — — US disclosed
US-20110200811-A1 FLAME-RETARDANT POLYBUTYLENE TEREPHTHALATE SERIES RESIN COMPOSITION MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2011-08-18 — — US disclosed
US-7968629-B2 Flame retardant polyamide resin composition and molded article MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2011-06-28 — — US disclosed
EP-2322577-A1 FLAME-RETARDANT POLYBUTYLENE TEREPHTHALATE-BASED RESIN COMPOSITION Mitsubishi Engineering-Plastics Corporation (JP) 2011-05-18 — — EP disclosed
US-20110028614-A1 POLYAMIDE, POLYAMIDE COMPOSITION, AND METHOD FOR PRODUCING POLYAMIDE ASAHI KASEI CHEMICALS CORPORATION (JP) 2011-02-03 — — US disclosed
EP-2270067-A1 POLYAMIDE, POLYAMIDE COMPOSITION AND METHOD FOR PRODUCING POLYAMIDE Asahi Kasei Chemicals Corporation (JP) 2011-01-05 — — EP disclosed
US-20100227957-A1 FLAME-RETARDANT GLASS FIBER-REINFORCED POLYAMIDE RESIN COMPOSITION UNITIKA LTD. (JP) 2010-09-09 — — US disclosed
EP-2186861-A1 FLAME-RETARDANT GLASS-FIBER-REINFORCED POLYAMIDE RESIN COMPOSITION Unitika, Ltd. (JP) 2010-05-19 — — EP disclosed
US-20090312468-A1 FLAME RETARDANT POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2009-12-17 — — US disclosed
EP-1995280-A1 FLAME RETARDANT POLYAMIDE RESIN COMPOSITION AND MOLDING Mitsubishi Engineering-Plastics Corporation (JP) 2008-11-26 — — EP disclosed
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