⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL18326438 | 0.97 | — | — | |
| SCHEMBL190279 | 0.97 | — | — | |
| SCHEMBL190267 | 0.94 | — | — | |
| Bromide SCHEMBL11061283 | 0.94 | — | — | |
| SCHEMBL19895697 | 0.94 | — | — | |
| SCHEMBL191362 | 0.94 | — | — | |
| Hydrochloric Acid SCHEMBL11062069 | 0.94 | — | — | |
| SCHEMBL190570 | 0.94 | — | — | |
| SCHEMBL9580952 | 0.82 | GABBR2 (0.39) | — | |
| SCHEMBL6051111 | 0.82 | GABBR2 (0.41) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 287 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20220356328-A1 | Polyamide Composition and the Article Thereof | BASF SE (DE) | 2022-11-10 | — | — | US | claimed |
| EP-4041801-A1 | POLYAMIDE COMPOSITION AND THE ARTICLE THEREOF | BASF SE (DE) | 2022-08-17 | — | — | EP | claimed |
| CN-114502656-A | Polyamide composition and article thereof | 巴斯夫欧洲公司 | 2022-05-13 | — | — | CN | claimed |
| WO-2021069456-A1 | POLYAMIDE COMPOSITION AND THE ARTICLE THEREOF | BASF SE (DE) | 2021-04-15 | — | — | WO | claimed |
| US-20260139106-A1 | INSULATION FILM | BASF SE (DE) | 2026-05-21 | — | — | US | disclosed |
| EP-4743515-A1 | A FILLER COMPOSITION AND ITS USE IN POLYAMIDE-BASED MATERIAL | BASF SE (DE) | 2026-05-20 | — | — | EP | disclosed |
| WO-2026098475-A1 | BIO-BASED POLYAMIDE COMPOSITION HAVING GOOD STIFFNESS AND HEAT RESISTANCE | BASF SE (DE) | 2026-05-15 | — | — | WO | disclosed |
| EP-4169977-B1 | RESIN COMPOSITION, MOLDED BODY AND ELECTROMAGNETIC WAVE ABSORBER | MITSUBISHI CHEM CORP (JP) | 2026-03-18 | — | — | EP | disclosed |
| EP-4700081-A1 | THERMOPLASTIC RESIN COMPOSITION, METHOD FOR PREPARING SAME, AND MOLDED ARTICLE COMPRISING SAME | LG Chem, Ltd. (KR) | 2026-02-25 | — | — | EP | disclosed |
| US-12559623-B2 | Resin composition and electromagnetic wave absorber | MITSUBISHI CHEMICAL CORPORATION (JP) | 2026-02-24 | — | — | US | disclosed |
| EP-4685188-A1 | THERMOPLASTIC RESIN COMPOSITION, PREPARATION METHOD THEREFOR AND MOLDED ARTICLE COMPRISING SAME | LG Chem, Ltd. (KR) | 2026-01-28 | — | — | EP | disclosed |
| US-12534597-B2 | Polyamide resin composition and molded object thereof | KURARAY CO., LTD. (JP) | 2026-01-27 | — | — | US | disclosed |
| US-20090029138-A1 | Resin Composition Having Excellent Heat Resistance | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2009-01-29 | — | — | US | disclosed |
| EP-1995280-A1 | FLAME RETARDANT POLYAMIDE RESIN COMPOSITION AND MOLDING | Mitsubishi Engineering-Plastics Corporation (JP) | 2008-11-26 | — | — | EP | disclosed |
| CN-101309972-A | Resin composition having excellent heat resistance | ASAHI CHEMICAL CORP (JP) | 2008-11-19 | — | — | CN | disclosed |
| CN-101309971-A | heat-resistant resin composition | ASAHI CHEMICAL CORP (JP) | 2008-11-19 | — | — | CN | disclosed |
| EP-1956048-A1 | RESIN COMPOSITION EXCELLENT IN FLAME RETARDANCE | Asahi Kasei Chemicals Corporation (JP) | 2008-08-13 | — | — | EP | disclosed |
| EP-1950249-A1 | RESIN COMPOSITION HAVING EXCELLENT HEAT RESISTANCE | Asahi Kasei Chemicals Corporation (JP) | 2008-07-30 | — | — | EP | disclosed |
| EP-1950248-A1 | HEAT-RESISTANT RESIN COMPOSITION | Asahi Kasei Chemicals Corporation (JP) | 2008-07-30 | — | — | EP | disclosed |
| US-20070235893-A1 | Method for producing resin strand | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2007-10-11 | — | — | US | disclosed |